International Standards and Conformity Assessment for all electrical, electronic and related technologies

SC 47D

Semiconductor devices packaging

 
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SC 47D Work programme (7)

Project

Reference

Document

Reference

Init.

Date

Current

Stage

Next

Stage

Working

Group

Project

Leader

Fcst. Publ.

Date

PWI TR 47D-1

Future IEC TR 60191-7 Ed.1: Requirements to design electronics devices using thermal characteristics of semiconductor packages

PWI
  • PWI
  • Preliminary Work Item

2019-11

prePNW
  • prePNW
  • Preparation of NP document

2020-03

PWI TR 47D-2

Future IEC TR 60191-7-3 Ed.1: Proposal of new thermal model format for semiconductor packages

PWI
  • PWI
  • Preliminary Work Item

2019-11

prePNW
  • prePNW
  • Preparation of NP document

2020-11

PWI TR 47D-3

Future IEC TR 60191-7-5 Ed.1: 3D semiconductor package model for precise thermal analysis (JTAM)

PWI
  • PWI
  • Preliminary Work Item

2019-11

prePNW
  • prePNW
  • Preparation of NP document

2020-03

PWI TR 47D-4

Future IEC TR 60191-7-1 Ed.1: A new transient thermal model of semiconductor packages (D2ELPHI)

PWI
  • PWI
  • Preliminary Work Item

2019-11

prePNW
  • prePNW
  • Preparation of NP document

2020-03

PWI TR 47D-5

Future IEC TR 60191-7-2 Ed.1: Thermal conductivity measurement method and samples for electronic components

PWI
  • PWI
  • Preliminary Work Item

2019-11

prePNW
  • prePNW
  • Preparation of NP document

2020-11

PWI TR 47D-6

Future IEC TR 60191-7-4 Ed.1: Printed circuit board specifications to evaluate thermal characteristics of fine pitch semiconductor packages

PWI
  • PWI
  • Preliminary Work Item

2019-11

prePNW
  • prePNW
  • Preparation of NP document

2020-11

IEC 60191-2/AMD21 ED1

Proposed new package outline - P-UMP-Ax

47D/899/CDV 2015-06 TPUB
  • TPUB
  • Translation of publication

2019-11

DECPUB
  • DECPUB
  • Publication at Editing Check

2020-01

WG 1 Michael Ahr 2020-04