TC 119

Printed Electronics

 
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TC 119 Work programme (22)

Project

Reference

Document

Reference

Init.

Date

Current

Stage

Next

Stage

Working

Group

Project

Leader

Fcst. Publ.

Date

PWI TR 119-13 ED1

Future IEC TR 62899-2XX-X: Materials - Measurement and assessment method of dispersibility in silver nano-ink

PWI
  • PWI
  • Preliminary work item

2018-11

2021-11

WG 2 Jinsoo Noh
PWI 119-16 ED1

Future IEC 62899-505-2 ED1 : Quality assessment - Printed NFC Antenna and Temperature Sensor

PWI
  • PWI
  • Preliminary work item

2018-12

prePNW
  • prePNW
  • Preparation of NP document

2021-03

WG 5 Gyoujin Cho
PWI 119-17 ED1

Future IEC 62899-2XX-X: Space charge mobility measurement in organic diodes

PWI
  • PWI
  • Preliminary work item

2019-10

prePNW
  • prePNW
  • Preparation of NP document

2021-04

WG 2 Fernando de Castro
PWI TR 119-19 ED1

IEC TR 62899-3XX : Equipment – Substrate - Sheet to sheet mechanical dimension

PWI
  • PWI
  • Preliminary work item

2019-10

2020-11

WG 3 Yoshiaki Kondoh
PWI 119-22 ED1

Future IEC 62899-3XX ED1 Printed Electronics - Part 30X: Equipment – Sintering – Temperature uniformity measurement method for photonic sintering system

PWI
  • PWI
  • Preliminary work item

2020-11

prePNW
  • prePNW
  • Preparation of NP document

2021-04

WG 3 Sang Ho Lee
PWI 119-23 ED1

Future IEC 62899-525-1 ED1 Printed electronics - Part 525-1: Quality Assessment - R2R printed NFC QR code label for anticounterfeiting

PWI
  • PWI
  • Preliminary work item

2020-11

prePNW
  • prePNW
  • Preparation of NP document

2021-04

WG 5 Gyoujin Cho
PWI 119-24 ED1

Future IEC 62899-403-2 ED1 Printed electronics - Part 403-1: Printability - Requirements - for reproducibility - Basic patterns for plating

PWI
  • PWI
  • Preliminary work item

2020-11

prePNW
  • prePNW
  • Preparation of NP document

2021-04

WG 4 Takehito Kozasa
PNW 119-339 ED1

IEC 62899-202-10 ED1 Printed Electronics Part 202-10 : Materials - Resistance measurement method on thermoformed conducting layer

119/339/NP PRVN
  • PRVN
  • Preparation of RVN

2021-02

2021-03

WG 2 Outi Rusanen 2023-11
PNW 119-341 ED1

IEC 62899-507-1 ED1 Printed Electronicss - Part 507-1: Quality assessment - Printed electrode connection to wire

119/341/NP PRVN
  • PRVN
  • Preparation of RVN

2021-02

2021-03

WG 5 Chae Min Lim 2023-07
IEC 62899-201-2 ED1

Printed electronics - Part 201-2: Materials - Evaluation method of stretchable substrates

119/262/CDV 2017-02 AFDIS
  • AFDIS
  • Approved for FDIS

2020-06

DECFDIS
  • DECFDIS
  • FDIS at editing check

2021-04

WG 2 Satoshi MAEDA 2021-10
IEC 62899-202 ED2

Printed electronics - Part 202: Materials - Conductive ink

119/327/RR 2020-10 ACD
  • ACD
  • Approved for CD

2020-10

CD
  • CD
  • Draft circulated as CD

2021-04

WG 2 Tadanobu Sato 2023-03
IEC 62899-202-4 ED1

Printed electronics - Part 202-4: Materials - Conductive ink - Measurement methods for properties of stretchable printed layers(conductive and insulating)

119/272/CDV 2017-02 AFDIS
  • AFDIS
  • Approved for FDIS

2020-08

DECFDIS
  • DECFDIS
  • FDIS at editing check

2021-04

WG 2 Satoshi MAEDA 2021-10
IEC 62899-202-8 ED1

IEC 62899-202-8 ED1 Printed electronics – Part 202-8: Materials – Conductive film – Measurement for difference in resistance with printing direction of conductive film fabricated with wire shaped materials

119/333/NP 2021-02 ACD
  • ACD
  • Approved for CD

2021-02

CD
  • CD
  • Draft circulated as CD

2022-01

WG 2 Haekyoung Kim 2023-07
IEC 62899-202-9 ED1

IEC 62899-202-9 ED1 : Materials - Guidelines for printed patterns for mechanical test

119/335/CD 2019-10 CDM
  • CDM
  • CD to be discussed at meeting

2021-04

2021-10

WG 2 Byoung-Joon Kim 2022-06
IEC 62899-203 ED2

Printed electronics - Part 203: Materials - Semiconductor ink

119/328/RR 2020-10 ACD
  • ACD
  • Approved for CD

2020-10

CD
  • CD
  • Draft circulated as CD

2021-04

WG 2 Simon Ogier 2023-03
IEC 62899-301-3 ED1

Printed Electronics – Part 301-3: Equipment – Contact printing – Rigid master – Measurement method of printing plate roller shape errors

119/337/CD 2019-08 PCC
  • PCC
  • Preparation of CC

2021-02

2021-03

WG 3 Dongwoo Kang 2022-07
IEC 62899-302-4 ED1

IEC 62899-302-4 ED1 Printed Electronics - Part 302-4 : Equipment - Inkjet – Media for inkjet printing drop position evaluation for printed electronics

119/340/NP 2021-04 ACD
  • ACD
  • Approved for CD

2021-04

CD
  • CD
  • Draft circulated as CD

2021-12

WG 3 Kei Hyodo 2024-12
IEC TR 62899-302-5 ED1

IEC TR 62899-302-5: Equipment - Inkjet - Review Result of Measuring Methods for Inkjet Printing

119/324/CD 2020-09 CDM
  • CDM
  • CD to be discussed at meeting

2021-03

2021-05

WG 3 Kei Hyodo 2022-02
IEC TR 62899-402-4 ED1

Printed electronics - Part 402-4: Printability - Classification and measurement methods for morphology

119/300/DTR

2020-01 PRVDTR
  • PRVDTR
  • Preparation of RVDTR

2020-03

2021-03

WG 4 Tadahiro Furukawa 2021-12
IEC 62899-503-3 ED1

Printed electronics- Part 503-3 : Quality assessment - Measuring method of contact resistance for the printed thin film transistor by transfer length method

119/299/CDV 2019-03 AFDIS
  • AFDIS
  • Approved for FDIS

2021-02

DECFDIS
  • DECFDIS
  • FDIS at editing check

2021-03

WG 5 Takehito Kozasa 2021-10
IEC 62899-506-1 ED1

Printed electronics-Part 506-1: Quality assessment- Accelerated stress test of printed heating element

119/338/CD 2019-04 PCC
  • PCC
  • Preparation of CC

2021-02

2021-03

WG 5 Chae Min Lim 2022-06
IEC TR 62899-550-1 ED1

Future IEC TR 62899-550-1: Quality assessment - Framework document on durability testing

119/313/CD ADTR
  • ADTR
  • Approved for DTR

2020-11

TDTR
  • TDTR
  • Translation of DTR

2021-03

WG 5 HYUN JONG KIM 2022-02