International Standards and Conformity Assessment for all electrical, electronic and related technologies

SC 47E

Discrete semiconductor devices

 
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SC 47E Work programme (13)

Project

Reference

Document

Reference

Init.

Date

Current

Stage

Next

Stage

Working

Group

Project

Leader

Fcst. Publ.

Date

PNW 47E-670

Semiconductor devices – Part 16-7: Microwave integrated circuits – Attenuators

47E/670/NP PRVN
  • PRVN
  • Preparation of RVN

2019-10

2019-11

WG 2 2022-03
PNW 47E-671

Semiconductor devices – Part 16-8: Microwave integrated circuits – Limiters

47E/671/NP PRVN
  • PRVN
  • Preparation of RVN

2019-10

2019-11

WG 2 2022-03
IEC 60747-5-4 ED2

Semiconductor devices - Part 5-4: Optoelectronic devices - Semiconductor lasers

47E/687/CD 2019-10 PCC
  • PCC
  • Preparation of CC

2020-01

2020-02

WG 9 Junichi Yoshida 2021-03
IEC 60747-5-5 ED2

Semiconductor devices - Part 5-5: Optoelectronic devices - Photocouplers

47E/655/CDV 2015-08 PRVC
  • PRVC
  • Preparation of RVC

2019-08

2019-11

WG 4 Patrick Sullivan 2020-11
IEC 60747-5-6 ED2

Semiconductor devices - Part 5-6: Optoelectronic devices - Light emitting diodes

47E/645/CD 2019-02 ACDV
  • ACDV
  • Approved for CDV

2019-11

TCDV
  • TCDV
  • Translation of CDV

2020-02

WG 9 Fumio Ogawa 2021-04
IEC TR 60747-5-12 ED1

Semiconductor devices – Part 5-12: Optoelectronic devices – Light emitting diodes – Test method of LED efficiencies

PWI
  • PWI
  • Preliminary Work Item

2018-07

2020-04

WG 9 2019-05
IEC 60747-5-13 ED1

Semiconductor devices - Part 5-13: Optoelectronic devices - Hydrogen sulphide corrosion test for LED packages

47E/661/CD 2018-09 ACDV
  • ACDV
  • Approved for CDV

2019-11

TCDV
  • TCDV
  • Translation of CDV

2020-01

WG 9 Fumio Ogawa 2021-04
IEC 60747-8/AMD1 ED3

Amendment 1 - Semiconductor devices - Discrete devices - Part 8: Field-effect transistors

47E/669/CD 2019-01 PCC
  • PCC
  • Preparation of CC

2019-09

2019-10

WG 3 Yoshinori Iwano 2021-12
IEC 60747-14-11 ED1

Semiconductor devices - Part 14-11: Semiconductor sensors - Test method of surface acoustic wave based integrated sensor for measuring ultra violet, illumination and temperature

47E/674/CDV 2017-06 PRVC
  • PRVC
  • Preparation of RVC

2019-12

2020-03

PT 60747-14-11 Kunnyun Kim 2020-11
IEC 60747-16-5/AMD1 ED1

Amendment 1 - Semiconductor devices - Part 16-5: Microwave integrated circuits - Oscillators

47E/673/CDV 2019-03 PRVC
  • PRVC
  • Preparation of RVC

2019-12

2020-02

WG 2 Masao Nakayama 2020-10
IEC 60747-17 ED1

Semiconductor devices - Part 17: Magnetic and capacitive coupler for basic and reinforced isolation

47E/654/CDV 2015-01 PRVC
  • PRVC
  • Preparation of RVC

2019-08

2019-11

WG 8 Alexander Jaus 2020-10
IEC 60747-18-2 ED1

Semiconductor devices - Part 18-2: Semiconductor bio sensors - Evaluation process of lens-free CMOS photonic array sensor package modules

47E/689/FDIS

2016-12 BPUB
  • BPUB
  • Being published

2019-12

PPUB
  • PPUB
  • Publication published

2020-02

WG 1 JongMuk LEE 2020-02
IEC TS 60747-19-2 ED1

Semiconductor devices - Part 19-2: Smart sensors - Indication of specifications of smart sensors and power supplies to drive smart sensors

47E/693/DTS 2019-06 CDTS
  • CDTS
  • Draft circulated as DTS

2019-11

PRVDTS
  • PRVDTS
  • Preparation of RVDTS

2020-02

WG 1 Kazuyoshi Furuta 2020-10