International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 119

Printed Electronics

 
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TC 119 Work programme (20)

Project

Reference

Document

Reference

Init.

Date

Current

Stage

Next

Stage

Working

Group

Project

Leader

Fcst. Publ.

Date

PWI 119-10 ED1

Future IEC 62899-2XX-X ED1 : Materials - Measurement for difference in resistance with printing direction of TCE fabricated with wire shaped materials

PWI
  • PWI
  • Preliminary Work Item

2018-11

prePNW
  • prePNW
  • Preparation of NP document

2019-10

WG 2 Haekyoung Kim
PWI 119-12 ED1

Future IEC 62899-2XX-X ED1 : Materials - Resistance evaluation method for thermoplastic deformation

PWI
  • PWI
  • Preliminary Work Item

2018-11

prePNW
  • prePNW
  • Preparation of NP document

2019-10

WG 2 Matti Mäntysalo
PWI TR 119-13 ED1

Future IEC TR 62899-2XX-X: Materials - Measurement and assessment method of dispersibility in silver nano-ink

PWI
  • PWI
  • Preliminary Work Item

2018-11

2019-10

WG 2 Jinsoo Noh
PWI 119-14 ED1

Future IEC 62899-302-4 ED1 : Equipment –Measurement of drop placement

PWI
  • PWI
  • Preliminary Work Item

2018-12

prePNW
  • prePNW
  • Preparation of NP document

2019-10

WG 3 Shinri Sakai
PWI TR 119-15 ED1

Future IEC TR 62899-5XX: Quality assessment - Framework document on durability testing

PWI
  • PWI
  • Preliminary Work Item

2018-12

2019-10

WG 5 HYUN JONG KIM
PWI 119-16 ED1

Future IEC 62899-50x-1 ED1 : Quality assessment - Printed NFC Antenna and Temperature Sensor

PWI
  • PWI
  • Preliminary Work Item

2018-12

prePNW
  • prePNW
  • Preparation of NP document

2019-10

WG 5
IEC 62899-201-2 ED1

Printed electronics - Part 201-2: Materials - Evaluation method of stretchable substrates

119/262/CDV 2017-02 PRVC
  • PRVC
  • Preparation of RVC

2019-07

2019-10

WG 2 Satoshi Maeda 2020-08
IEC 62899-202-4 ED1

Printed electronics - Part 202-4: Materials - Conductive ink - Measurement methods for properties of stretchable printed layers(conductive and insulating)

119/272/CDV 2017-02 PRVC
  • PRVC
  • Preparation of RVC

2019-10

2019-12

WG 2 Satoshi Maeda 2020-07
IEC 62899-202-6 ED1

Printed electronics – Part 202-6: Materials – Conductive film – Measurement method for resistance changes under high temperature and humidity of a printed metal based conductive layer on a flexible substrate

119/248/CDV 2017-08 AFDIS
  • AFDIS
  • Approved for FDIS

2019-05

TFDIS
  • TFDIS
  • Translation of FDIS

2019-11

WG 2 Haekyoung Kim 2020-06
IEC 62899-202-7 ED1

Printed electronics – Part 202-7: Printed films – Measurement of peel strength for printed layer on flexible substrate by 90° peel method

119/267/CDV 2017-10 AFDIS
  • AFDIS
  • Approved for FDIS

2019-10

TFDIS
  • TFDIS
  • Translation of FDIS

2019-12

WG 2 Youngbae Park 2020-07
IEC 62899-202-9 ED1

IEC 62899-202-9 ED1 : Materials - Guidelines for printed patterns for mechanical test

119/273/NP 2019-10 ACD
  • ACD
  • Approved for CD

2019-10

CD
  • CD
  • Draft circulated as CD

2020-08

WG 2 Byoung-Joon Kim 2022-06
IEC 62899-301-3 ED1

Printed Electronics – Part 301-3: Equipment – Contact printing – Rigid master – Measurement method of roll master shape errors

119/265/NP 2019-08 ACD
  • ACD
  • Approved for CD

2019-08

CD
  • CD
  • Draft circulated as CD

2020-06

WG 3 Dongwoo Kang 2022-03
IEC 62899-302-3 ED1

Printed Electronics – Part 302-3: Equipment – Inkjet – Imaging-based measurement of drop direction

119/263/CD 2018-06 ACDV
  • ACDV
  • Approved for CDV

2019-08

TCDV
  • TCDV
  • Translation of CDV

2019-10

WG 3 Stephen Hoath 2020-11
IEC 62899-402-2 ED1

Printed Electronics - Part 402-2: Printability - Measurement of qualitities - Edge waviness

119/258/CDV 2016-10 PRVC
  • PRVC
  • Preparation of RVC

2019-07

2019-10

WG 4 Yanlin SONG 2020-08
IEC 62899-402-3 ED1

Printed Electronics – Part 402-3: Printability – Measurement of qualities – Voids in printed pattern using two-dimensional optical image

119/277/CD 2019-03 PCC
  • PCC
  • Preparation of CC

2019-09

2019-10

WG 4 Chung-Hwan Kim 2021-03
IEC 62899-503 ED1

Printed Electronics - Part 503 : Quality Assessment - Test method for the channel properties of the printed thin-film transistor

119/257/CDV 2016-05 AFDIS
  • AFDIS
  • Approved for FDIS

2019-10

TFDIS
  • TFDIS
  • Translation of FDIS

2019-11

WG 5 An-Jung Chung 2020-06
IEC 62899-503-2 ED1

Printed electronics-Part 503-2: Quality assessment- Test method for Electrical characterization of Roll-to-roll printed TFT active matrix

119/251/NP 2019-07 ACD
  • ACD
  • Approved for CD

2019-07

CD
  • CD
  • Draft circulated as CD

2020-03

WG 5 An-Jung Chung 2021-11
IEC 62899-503-3 ED1

Printed electronics- Part 503-3 : Quality assessment - Measuring method of contact resistance for the printed thin film transistor by transfer length method

119/280/CD 2019-03 PCC
  • PCC
  • Preparation of CC

2019-10

2019-11

WG 5 Takehito Kozasa 2021-03
IEC 62899-505 ED1

Printed electronics - Part 505: Quality assessment - Flexible gas sensor: Mechanical and thermal testing

119/255/CDV 2017-07 AFDIS
  • AFDIS
  • Approved for FDIS

2019-08

TFDIS
  • TFDIS
  • Translation of FDIS

2019-10

WG 5 HYUN JONG KIM 2020-06
IEC 62899-506-1 ED1

Printed electronics-Part 506-1: Quality assessment- Mechanical and thermal tests of printed film heater

119/250/NP 2019-04 ACD
  • ACD
  • Approved for CD

2019-04

CD
  • CD
  • Draft circulated as CD

2020-03

WG 5 Chae Min Lim 2021-10