International Standards and Conformity Assessment for all electrical, electronic and related technologies

SC 47F

Micro-electromechanical systems

 
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SC 47F Work programme (7)

Project

Reference

Document

Reference

Init.

Date

Current

Stage

Next

Stage

Working

Group

Project

Leader

Fcst. Publ.

Date

IEC 62047-31 ED1

Semiconductor devices - Micro-electromechanical devices - Part 31: Four-point bending test method for interfacial adhesion energy of layered MEMS materials

47F/308/CDV 2016-09 RFDIS
  • RFDIS
  • FDIS received and registered

2018-11

CFDIS
  • CFDIS
  • Draft circulated as FDIS

2019-02

WG 2 Jae-Hyun Kim 2019-05
IEC 62047-32 ED1

Semiconductor devices - Micro-electromechanical devices - Part 32: Test method for the nonlinear vibration of the MEMS resonators

47F/322/FDIS 2016-12 CFDIS
  • CFDIS
  • Draft circulated as FDIS

2018-11

PRVD
  • PRVD
  • Preparation of RVD document

2018-12

WG 3 qingfeng Li 2019-03
IEC 62047-33 ED1

Semiconductor devices - Micro-electromechanical devices - Part 33: MEMS piezoresistive pressure-sensitive device

47F/304/CDV 2016-12 RFDIS
  • RFDIS
  • FDIS received and registered

2018-12

CFDIS
  • CFDIS
  • Draft circulated as FDIS

2019-03

WG 3 wei zhang 2019-05
IEC 62047-34 ED1

Semiconductor devices - Micro-electromechanical devices - Part 34: Test method for MEMS piezoresistive pressure-sensitive device on wafer

47F/305/CDV 2016-12 RFDIS
  • RFDIS
  • FDIS received and registered

2018-12

CFDIS
  • CFDIS
  • Draft circulated as FDIS

2019-03

WG 3 wei zhang 2019-05
IEC 62047-35 ED1

Semiconductor devices – Micro-electromechanical devices – Part 35: Test method of electrical characteristics under bending deformation for flexible and foldable electro-mechanical devices

47F/303/CD 2017-07 TCDV
  • TCDV
  • Translation of CDV

2018-10

CCDV
  • CCDV
  • Draft circulated as CDV

2018-12

WG 2 Shoji Kamiya 2020-02
IEC 62047-36 ED1

Semiconductor devices – Micro-electromechanical devices – Part 36: Environmental and dielectric withstand test methods for MEMS piezoelectric thin films

47F/306/CDV 2017-04 RFDIS
  • RFDIS
  • FDIS received and registered

2018-11

CFDIS
  • CFDIS
  • Draft circulated as FDIS

2019-02

WG 2 Isaku KANNO 2019-05
IEC 62047-37 ED1

Semiconductor devices - Micro-electromechanical devices - Part 37: Environmental test methods of MEMS piezoelectric thin films for sensor application

47F/324/CD 2018-09 CD
  • CD
  • Draft circulated as CD

2018-11

PCC
  • PCC
  • Preparation of CC document

2019-02

WG 2 Isaku KANNO 2021-08