International Standards and Conformity Assessment for all electrical, electronic and related technologies

SC 47E

Discrete semiconductor devices

 
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SC 47E Work programme (18)

Project

Reference

Document

Reference

Init.

Date

Current

Stage

Next

Stage

Working

Group

Project

Leader

Fcst. Publ.

Date

PNW 47E-614

Future 60747-19-2: Semiconductor devices - Part 19-2: Smart sensors - Indication of specifications of low-power smart sensors allowing autonomous power supply operation

47E/614/NP PRVN
  • PRVN
  • Preparation of RVN

2018-09

2018-10

WG 1 Kazuyoshi Furuta 2020-12
IEC 60747-5-5 ED2

Semiconductor devices - Part 5-5: Optoelectronic devices - Photocouplers

47E/595/CDV 2015-08 CDVM
  • CDVM
  • Rejected CDV to be discussed at meeting

2018-09

2018-11

WG 4 Patrick Sullivan 2020-01
IEC 60747-5-8 ED1

Semiconductor devices – Part 5-8: Optoelectronic devices – Light emitting diodes – Test method of optoelectronic efficiencies of light emitting diodes

47E/599/CD 2017-09 TCDV
  • TCDV
  • Translation of CDV

2018-12

CCDV
  • CCDV
  • Draft circulated as CDV

2019-01

WG 9 Jong-In Shim 2020-03
IEC 60747-5-9 ED1

Semiconductor devices – Part 5-9: Optoelectronic devices – Light emitting diodes – Test method of the internal quantum efficiency based on the temperature-dependent electroluminescence

47E/610/CD 2017-09 ACDV
  • ACDV
  • Approved for CDV

2018-11

TCDV
  • TCDV
  • Translation of CDV

2019-01

WG 9 Dong-Soo Shin 2020-08
IEC 60747-5-10 ED1

Semiconductor devices – Part 5-10: Optoelectronic devices – Light emitting diodes – Test method of the internal quantum efficiency by the room-temperature reference point

47E/611/CD 2017-09 ACDV
  • ACDV
  • Approved for CDV

2018-11

TCDV
  • TCDV
  • Translation of CDV

2019-01

WG 9 Jong-In Shim 2020-08
IEC 60747-5-11 ED1

Semiconductor devices – Part 5-11: Optoelectronic devices – Light emitting diodes – Test method of radiative and nonradiative currents of light emitting diodes

47E/636/CD 2018-11 CD
  • CD
  • Draft circulated as CD

2018-12

PCC
  • PCC
  • Preparation of CC document

2019-02

WG 9 Dong-Soo Shin 2021-08
IEC TR 60747-5-12 ED1

Semiconductor devices – Part 5-12: Optoelectronic devices – Light emitting diodes – Test method of LED efficiencies

PWI
  • PWI
  • Preliminary Work Item

2018-07

2019-05
IEC 60747-5-13 ED1

Future IEC 60747-5-13: Semiconductor devices - Part 5-13: Optoelectronic devices - Hydrogen sulphide corrosion test for LED packages

47E/601/NP 2018-09 ACD
  • ACD
  • Approved for CD

2018-09

CD
  • CD
  • Draft circulated as CD

2018-12

WG 9 Fumio Ogawa 2020-12
IEC 60747-7/AMD1 ED3

Semiconductor devices - Discrete devices - Part 7: Bipolar transistors

47E/603/CD 2018-03 TCDV
  • TCDV
  • Translation of CDV

2018-12

CCDV
  • CCDV
  • Draft circulated as CDV

2019-01

WG 3 Yoshinori Iwano 2020-03
IEC 60747-9 ED3

Semiconductor devices - Part 9: Discrete devices - Insulated-gate bipolar transistors (IGBTs)

47E/605/CDV 2016-05 AFDIS
  • AFDIS
  • Approved for FDIS

2018-11

TFDIS
  • TFDIS
  • Translation of FDIS

2019-05

WG 3 Shuji Miyashita 2019-12
IEC 60747-14-10 ED1

Semiconductor devices - Part 14-10: Semiconductor sensors - Performance evaluation methods for wearable glucose sensors

47E/587/CDV 2016-09 AFDIS
  • AFDIS
  • Approved for FDIS

2018-06

TFDIS
  • TFDIS
  • Translation of FDIS

2018-09

WG 1 Jae Yeong Park 2019-08
IEC 60747-14-11 ED1

Semiconductor devices - Part 14-11: Semiconductor sensors - Test method of surface acoustic wave based integrated sensor for measuring ultra violet, illumination and temperature

47E/604/CD 2017-06 CDM
  • CDM
  • CD to be discussed at meeting

2018-09

2018-11

PT 60747-14-11 Kunnyun Kim 2020-02
IEC 60747-16-6 ED1

Semiconductor devices - Part 16-6: Microwave integrated circuits - Frequency multipliers

47E/602/CDV 2016-03 APUB
  • APUB
  • Approved for publication

2018-09

2018-12

WG 2 Katsuyuki Oshiba 2019-05
IEC 60747-17 ED1

Semiconductor devices - Part 17: Magnetic and capacitive coupler for basic and reinforced isolation

47E/620/CD 2015-01 PCC
  • PCC
  • Preparation of CC

2018-09

2018-10

WG 8 Alexander Jaus 2020-01
IEC 60747-18-1 ED1

Semiconductor devices - Part 18-1: Semiconductor bio sensors - Test method and data analysis for calibration of lens-free CMOS photonic array sensor

47E/588/CDV 2016-03 RFDIS
  • RFDIS
  • FDIS received and registered

2018-11

CFDIS
  • CFDIS
  • Draft circulated as FDIS

2019-02

WG 1 JongMuk LEE 2019-05
IEC 60747-18-2 ED1

Semiconductor devices - Part 18-2: Semiconductor bio sensors - Evaluation process of lens-free CMOS photonic array sensor package module

47E/581/CD 2016-12 TCDV
  • TCDV
  • Translation of CDV

2018-11

CCDV
  • CCDV
  • Draft circulated as CDV

2019-01

WG 1 JongMuk LEE 2020-02
IEC 60747-18-3 ED1

Semiconductor devices - Part 18-3: Semiconductor bio sensors - Fluid flow characteristics of lens-free CMOS photonic array sensor package module with fluidic system

47E/582/CD 2017-03 TCDV
  • TCDV
  • Translation of CDV

2018-11

CCDV
  • CCDV
  • Draft circulated as CDV

2019-01

WG 1 JongMuk LEE 2020-02
IEC 60747-19-1 ED1

Semiconductor devices – Part 19-1: Smart sensors – Control scheme of smart sensors

47E/615/CD 2018-06 PCC
  • PCC
  • Preparation of CC

2018-09

2018-10

WG 1 Kazuyoshi Furuta 2020-12