International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology

 
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TC 91 Work programme (23)

Project

Reference

Document

Reference

Init.

Date

Current

Stage

Next

Stage

Working

Group

Project

Leader

Fcst. Publ.

Date

PNW 91-1514

PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES – DESIGN AND USE Part 8: 3D shape data specification for CAD component library.

91/1514/NP PRVN
  • PRVN
  • Preparation of RVN

2018-08

2018-08

WG 12 Takaaki Murata 2020-11
PNW 91-1551

Device Embedding assembly technology - Part 2-601: Guide line - Evaluation method of electrical connectivity

91/1551/NP PNW
  • PNW
  • New Work Item Proposal

2018-11

PRVN
  • PRVN
  • Preparation of RVN document

2019-01

WG 6 Yoshihisa KATOH 2022-12
IEC 60068-2-20 ED6

Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads

91/1455/RR 2017-07 ACD
  • ACD
  • Approved for CD

2017-07

CD
  • CD
  • Draft circulated as CD

2018-12

WG 3 Walter Huck 2020-02
IEC 60068-2-21 ED7

Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices

91/1418/RR 2016-12 ACD
  • ACD
  • Approved for CD

2016-12

CD
  • CD
  • Draft circulated as CD

2019-09

WG 3 Walter Huck 2020-01
IEC 60068-2-69/AMD1 ED3

Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method

91/1513/CDV 2018-02 AFDIS
  • AFDIS
  • Approved for FDIS

2018-11

TFDIS
  • TFDIS
  • Translation of FDIS

2019-01

WG 3 Hiroshi Oshima 2019-10
IEC 60068-2-82 ED2

Environmental testing - Part 2-82: Tests - Test XW1: Whisker test methods for components and parts used in electronic assemblies

91/1495/CDV 2016-08 TFDIS
  • TFDIS
  • Translation of FDIS

2018-11

DECFDIS
  • DECFDIS
  • FDIS at Editing Check

2019-01

WG 3 Udo Welzel 2019-08
IEC 60194-1 ED1

Printed boards design, manufacture and assembly - Vocabulary - Part 1: Common usage in printed board and electronic assembly technologies

91/1460/CD 2017-08 ACDV
  • ACDV
  • Approved for CDV

2018-09

TCDV
  • TCDV
  • Translation of CDV

2019-02

WG 5 Min-su Lee 2019-12
IEC 61188-6-1 ED1

Printed boards and printed board assemblies – Design and use – Part 6-1: Generic requirements of land pattern on circuit boards

91/1493/RR 2018-01 ACD
  • ACD
  • Approved for CD

2018-01

CD
  • CD
  • Draft circulated as CD

2018-12

WG 12 Rainer Taube 2020-12
IEC 61188-6-4 ED1

Printed boards and printed board assemblies - Design and use - Part 6-4: Generic requirements for dimensional drawings of SMD from viewpoint of land pattern design

91/1489/CDV 2016-07 RFDIS
  • RFDIS
  • FDIS received and registered

2018-11

CFDIS
  • CFDIS
  • Draft circulated as FDIS

2019-02

WG 12 Hiroyuki ISHIBASHI 2019-04
IEC 61189-2-801 ED1

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-801: Thermal conductivity test for base materials

91/1543/CD 2018-01 CD
  • CD
  • Draft circulated as CD

2018-11

PCC
  • PCC
  • Preparation of CC document

2019-02

WG 10 Douglas Sober 2020-09
IEC 61189-2-803 ED1

Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-803: Test methods for Z-Axis Expansion of base materials and printed board

91/1545/CD 2018-06 CD
  • CD
  • Draft circulated as CD

2018-11

PCC
  • PCC
  • Preparation of CC document

2019-02

WG 10 Douglas Sober 2020-10
IEC 61189-2-804 ED1

Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-804: Test methods for time to delamination – T260, T288, T300

91/1546/CD 2018-06 CD
  • CD
  • Draft circulated as CD

2018-11

PCC
  • PCC
  • Preparation of CC document

2019-02

WG 10 Douglas Sober 2020-10
IEC 61189-5-501 ED1

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-501: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of solder fluxes

91/1535/RR 2018-10 ACD
  • ACD
  • Approved for CD

2018-10

CD
  • CD
  • Draft circulated as CD

2019-08

WG 3 Graham Naisbitt 2022-05
IEC 61189-5-504 ED1

Test methods for electrical materials, interconnection structures and assemblies - Part 5-504: General test methods for materials and assemblies - Process ionic contamination testing (PICT)

91/1467/CD 2017-09 ACDV
  • ACDV
  • Approved for CDV

2018-08

TCDV
  • TCDV
  • Translation of CDV

2019-02

WG 3 Graham Naisbitt 2020-03
IEC TR 61189-5-506 ED1

An intercomparison evaluation to implement the use of fine pitch test structures for surface insulation resistance (SIR) testing of solder fluxes according to IEC 61189-5-501

91/1500/DTR

2018-02 APUB
  • APUB
  • Approved for publication

2018-09

TPUB
  • TPUB
  • Translation of publication

2019-12

WG 3 Martin Wickham 2020-04
IEC 61189-5-601 ED1

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-601: General test methods for materials and assemblies - Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards

91/1518/CD 2015-11 PCC
  • PCC
  • Preparation of CC

2018-09

2019-08

WG 3 Shigeru SUGINO 2020-01
IEC 61249-6-3 ED1

Materials for printed boards and other interconnecting structures – Part 6-3: Sectional specification set for reinforcement materials - Specification for finished fabric woven from “E” glass for printed boards

91/1548/CD 2018-07 CD
  • CD
  • Draft circulated as CD

2018-11

PCC
  • PCC
  • Preparation of CC document

2019-02

WG 4 Douglas Sober 2020-11
IEC 61760-1 ED3

Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)

91/1534/CD 2017-04 CD
  • CD
  • Draft circulated as CD

2018-10

PCC
  • PCC
  • Preparation of CC document

2018-12

WG 1 Udo Welzel 2020-02
IEC 62878-1 ED1

Device embedding assembly technology - Part 1: Generic specification for device embedded substrates

91/1509/CD 2015-12 TCDV
  • TCDV
  • Translation of CDV

2018-11

CCDV
  • CCDV
  • Draft circulated as CDV

2019-01

WG 6 Walter Huck 2020-02
IEC 62878-2-5 ED1

Device embedded substrate - Part 2-5: Implementation of a 3D data format for device embedded substrate

91/1522/CD 2016-03 ACDV
  • ACDV
  • Approved for CDV

2018-11

TCDV
  • TCDV
  • Translation of CDV

2019-02

WG 6 Yoshihisa KATOH 2020-03
IEC TR 62878-2-7 ED1

Device embedding assembly technology - Part 2-7: Guidelines - Accelerated stress testing of passive embedded circuit boards

2018-12 TDTR
  • TDTR
  • Translation of DTR

2018-12

CDTR
  • CDTR
  • Circulation of DTR

2019-01

2019-10
IEC 63215-2 ED1

Endurance test methods for die attach materials applied to power electronics devices – Part 1-1: Temperature cycling test method and reliability performance index for Die attach materials applied to discrete type power electronic devices

91/1494/NP 2018-09 ACD
  • ACD
  • Approved for CD

2018-09

CD
  • CD
  • Draft circulated as CD

2019-12

WG 3 Tsuyoshi YAMAMOTO 2021-12
IEC 63215-4 ED1

Endurance test methods for die attach materials applied to power electronic devices – Part 4: Power cycling test method and reliability performance index for Die attach materials (Near Chip Interconnection) applied to module type power electronic devices

91/1497/NP 2018-09 ACD
  • ACD
  • Approved for CD

2018-09

CD
  • CD
  • Draft circulated as CD

2019-12

WG 3 Tsuyoshi YAMAMOTO 2021-12