International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 47

Semiconductor devices

 
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TC 47 Work programme (18)

Project

Reference

Document

Reference

Init.

Date

Current

Stage

Next

Stage

Working

Group

Project

Leader

Fcst. Publ.

Date

PNW 47-2529

Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 8- Test and evaluation methods of flexible and stretchable supercapacitors for use in low power electronics

47/2529/NP PRVN
  • PRVN
  • Preparation of RVN

2019-03

2019-03

WG 7 Jae Yeong Park 2021-06
IEC 60749-20 ED3

Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat

47/2561/RR 2019-04 TCDV
  • TCDV
  • Translation of CDV

2019-04

CCDV
  • CCDV
  • Draft circulated as CDV

2019-05

WG 2 Jim Lynch 2020-07
IEC 60749-20-1 ED2

Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat

47/2565/FDIS 2018-05 CFDIS
  • CFDIS
  • Draft circulated as FDIS

2019-04

PRVD
  • PRVD
  • Preparation of RVD document

2019-05

WG 2 Jim Lynch 2019-07
IEC 60749-30 ED2

Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing

47/2560/RR 2019-04 TCDV
  • TCDV
  • Translation of CDV

2019-04

CCDV
  • CCDV
  • Draft circulated as CDV

2019-05

WG 2 Jim Lynch 2020-07
IEC 60749-41 ED1

Semiconductor devices - Mechanical and climatic test methods - Part 41: Reliability testing methods of non-volatile memory devices

47/2325/CD 2015-10 ACDV
  • ACDV
  • Approved for CDV

2017-11

TCDV
  • TCDV
  • Translation of CDV

2022-01

WG 2 Jim Lynch 2020-05
IEC 62373-1 ED1

Semiconductor devices – Bias-temperature stability test for metal-oxide semiconductor field-effect transistors (MOSFET) - Part 1: Fast BTI Test method

47/2502/CD 2017-08 ACDV
  • ACDV
  • Approved for CDV

2019-02

TCDV
  • TCDV
  • Translation of CDV

2019-04

WG 5 Hideya Matsuyama 2020-07
IEC 62435-3 ED1

Electronic components – Long-term storage of electronic semiconductor devices – Part 3: Data

47/2491/CDV 2011-03 TFDIS
  • TFDIS
  • Translation of FDIS

2019-04

DECFDIS
  • DECFDIS
  • FDIS at Editing Check

2019-05

WG 3 Alan Lucero 2019-12
IEC 62435-7 ED1

Long-term storage of electronic components – Part 7: Micro-electromechanical devices

47/2507/CD 2018-06 TCDV
  • TCDV
  • Translation of CDV

2019-03

CCDV
  • CCDV
  • Draft circulated as CDV

2019-04

WG 3 Alan Lucero 2020-06
IEC 62435-8 ED1

Long-term storage of electronic components – Part 8: Passive electronic devices

47/2540/CD 2018-06 PCC
  • PCC
  • Preparation of CC

2019-04

2019-05

WG 3 Alan Lucero 2020-06
IEC 62779-4 ED1

Semiconductor devices - Semiconductor interface for human body communication- Part 4: Semiconductor interface for capsule endoscopy using human body communication

47/2524/CDV 2017-04 PRVC
  • PRVC
  • Preparation of RVC

2019-04

2019-06

WG 6 Byoung Nam Lee 2020-01
IEC 62830-5 ED1

Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 5: Test method for measuring generated power from flexible thermoelectric devices

47/2545/CDV 2015-11 CCDV
  • CCDV
  • Draft circulated as CDV

2019-04

PRVC
  • PRVC
  • Preparation of RVC

2019-06

WG 7 Namsu Kim 2020-05
IEC 62830-6 ED1

Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 6 - Test and evaluation methods for vertical contact mode triboelectric energy harvesting devices

47/2508/CDV 2017-09 RFDIS
  • RFDIS
  • FDIS received and registered

2019-04

CFDIS
  • CFDIS
  • Draft circulated as FDIS

2019-07

WG 7 Jae Yeong Park 2019-09
IEC 62830-7 ED1

Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 7- linear sliding mode triboelectric energy harvesting

47/2526/CD 2018-07 ACDV
  • ACDV
  • Approved for CDV

2019-03

TCDV
  • TCDV
  • Translation of CDV

2019-12

WG 7 Jae Yeong Park 2021-01
IEC 62951-6 ED1

Semiconductor devices - Flexible and stretchable semiconductor devices - Part 6: Test method for sheet resistance of flexible conducting films

47/2547/FDIS


2015-11 BPUB
  • BPUB
  • Being published

2019-04

PPUB
  • PPUB
  • Publication published

2019-05

WG 6 Hojun Ryu 2019-05
IEC 63068-3 ED1

Semiconductor devices – Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices - Part 3: Test method for defects using photoluminescence

47/2527/CD 2018-08 ACDV
  • ACDV
  • Approved for CDV

2019-04

TCDV
  • TCDV
  • Translation of CDV

2019-10

WG 5 Junji SENZAKI 2021-04
IEC 63150-1 ED1

Semiconductor devices - Measurement and evaluation methods of kinetic energy harvesting devices under practical vibration environment - Part 1: Arbitrary and random mechanical vibrations

47/2548/FDIS


2017-07 BPUB
  • BPUB
  • Being published

2019-04

PPUB
  • PPUB
  • Publication published

2019-05

WG 7 Yuji SUZUKI 2019-05
IEC 63229 ED1

Semiconductor devices – The classification of defects in gallium nitride epitaxial wafers on silicon carbide substrate

47/2528/CD 2018-11 PCC
  • PCC
  • Preparation of CC

2019-03

2019-03

WG 5 Zhihong Feng 2021-04
IEC 63244-1 ED1

Semiconductor devices - Semiconductor devices for wireless power transfer and charging - Part 1 : General requirements and specifications

47/2532/NP 2019-04 ACD
  • ACD
  • Approved for CD

2019-04

CD
  • CD
  • Draft circulated as CD

2019-06

WG 7 Cheolung Cha 2021-02