Edition 1.0 (2012-09-21)

Mechanical standardization of semiconductor devices - Part 2: Dimensions

Edition 3.0 (2018-01-23)

Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices

Edition 1.0 (1966-01-01)

Mechanical standardization of semiconductor devices. Part 2: Dimensions

Edition 1.0 (2001-03-15)

Amendment 1 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

Edition 1.0 (2001-06-20)

Amendment 2 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

Edition 1.0 (2001-08-28)

Amendment 3 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

Edition 1.0 (2001-11-27)

Amendment 4 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

Edition 1.0 (2002-02-12)

Amendment 5 - Mechanical standardization of semiconductor devices. Part 2: Dimensions

Edition 1.0 (2002-05-01)

Amendment 6 - Mechanical standardization of semiconductor devices. Part 2: Dimensions

Edition 1.0 (2002-05-10)

Amendment 7 - Mechanical standardization of semiconductor devices. Part 2: Dimensions

Edition 1.0 (2003-06-27)

Amendment 8 - Mechanical standardization of semiconductor devices. Part 2: Dimensions

Edition 1.0 (2003-11-19)

Amendment 9 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

Edition 1.0 (2004-03-29)

Amendment 10 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

Edition 1.0 (2004-11-23)

Amendment 11 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

Edition 1.0 (2006-03-24)

Amendment 12 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

Edition 1.0 (2006-07-17)

Amendment 13 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

Edition 1.0 (2006-07-17)

Amendment 14 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

Edition 1.0 (2006-07-17)

Amendment 15 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

Edition 1.0 (2007-07-25)

Amendment 16 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

Edition 1.0 (2008-05-27)

Amendment 17 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

Edition 1.0 (2011-11-22)

Amendment 18 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

Edition 1.0 (2012-10-02)

Amendment 19 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

Edition 1.0 (2018-04-12)

Amendment 20 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

Edition 2.0 (1999-10-29)

Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits

Edition 3.1 (2018-03-27)

Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages

Edition 3.0 (2013-10-10)

Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages

Edition 3.0 (2018-03-27)

Amendment 1 - Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages

Edition 2.0 (1997-04-23)

Mechanical standardization of semiconductor devices - Part 5: Recommendations applying to integrated circuit packages using tape automated bonding (TAB)

Edition 3.0 (2009-11-26)

Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages

Edition 1.0 (2001-10-30)

Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull-wing lead terminals

Edition 1.0 (2001-12-11)

Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor devices packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages

Edition 1.0 (2002-10-18)

Corrigendum 1 - Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages

Edition 1.0 (2000-09-29)

Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP)

Edition 1.0 (2003-06-11)

Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)

Edition 1.0 (2001-08-27)

Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA)

Edition 1.0 (2001-03-22)

Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA)

Edition 1.0 (2001-08-27)

Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for glass sealed ceramic quad flatpack (G-QFP)

Edition 1.0 (2003-11-19)

Mechanical standardization of semiconductor devices - Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Dimensions of P-VSON

Edition 2.0 (2011-06-08)

Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guidelines for fine-pitch land grid array (FLGA)

Edition 2.0 (2016-09-27)

Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA)

Edition 1.0 (2007-04-26)

Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA

Edition 1.0 (2011-01-27)

Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA)

Edition 1.0 (2010-01-07)

Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

Edition 1.0 (2010-05-31)

Corrigendum 1 - Mechanical stardardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

Edition 1.0 (2010-07-28)

Corrigendum 2 - Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

Edition 1.0 (2010-02-25)

Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage

Edition 1.0 (2010-08-30)

Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ)

Edition 1.0 (2010-08-30)

Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP)

Edition 1.0 (2012-12-11)

Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)

Edition 1.0 (1996-12-20)

Eighteenth supplement

Edition 1.0 (1997-05-09)

Nineteenth supplement

Edition 1.0 (1998-12-22)

Twentieth supplement

Edition 1.0 (1999-07-29)

Twenty-first supplement

Edition 1.0 (1999-09-30)

Mechanical standardization of semiconductor devices - Part 2: Dimensions

Edition 1.0 (2000-01-31)

Corrigendum 1 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

Edition 1.0 (2000-06-16)

Twenty-third supplement - Mechanical standardization of semiconductor devices - Part 2: Dimensions

Edition 1.0 (2000-09-29)

Twenty-fourth supplement - Mechanical standardization of semiconductor devices - Part 2: Dimensions