TC 91

Electronics assembly technology

 
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TC 91 Publications (192)

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Reference, Edition, Date, Title
Language
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IEC 60068-2-20:2008

Edition 5.0 (2008-07-21)

Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads

EN-FR, EN
Preview
IEC 60068-2-21:2006

Edition 6.0 (2006-06-22)

Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices

EN-FR, EN, ES
No preview
IEC 60068-2-21:2006/COR1:2012

Edition 6.0 (2012-01-24)

Corrigendum 1 - Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices

EN-FR
Preview
IEC 60068-2-58:2015+AMD1:2017 CSV

Edition 4.1 (2017-07-28)

Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

EN
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IEC 60068-2-58:2015

Edition 4.0 (2015-03-27)

Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

EN-FR
No preview
IEC 60068-2-58:2015/AMD1:2017

Edition 4.0 (2017-07-28)

Amendment 1 - Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

EN
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IEC 60068-2-69:2017+AMD1:2019 CSV

Edition 3.1 (2019-06-19)

Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method

EN-FR
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IEC 60068-2-69:2017

Edition 3.0 (2017-03-07)

Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method

EN-FR
No preview
IEC 60068-2-69:2017/COR1:2018

Edition 3.0 (2018-01-24)

Corrigendum 1 - Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement)

EN-FR
No preview
IEC 60068-2-69:2017/AMD1:2019

Edition 3.0 (2019-06-19)

Amendment 1 - Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method

EN-FR
Preview
IEC 60068-2-77:1999

Edition 1.0 (1999-01-15)

Environmental testing - Part 2-77: Tests - Test 77: Body strength and impact shock

EN-FR, EN, ES
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IEC 60068-2-82:2019

Edition 2.0 (2019-05-14)

Environmental testing - Part 2-82: Tests - Test Xw1: Whisker test methods for components and parts used in electronic assemblies

EN-FR
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IEC 60068-2-83:2011

Edition 1.0 (2011-09-07)

Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste

EN-FR
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IEC TR 60068-3-12:2014

Edition 2.0 (2014-10-17)

Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile

EN-FR
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IEC 60068-3-13:2016

Edition 1.0 (2016-05-13)

Environmental testing - Part 3-13: Supporting documentation and guidance on Test T - Soldering

EN-FR
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IEC 60194:2015

Edition 6.0 (2015-04-15)

Printed board design, manufacture and assembly - Terms and definitions

EN-FR
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IEC 60194-2:2017

Edition 1.0 (2017-12-13)

Printed boards design, manufacture and assembly - Vocabulary - Part 2: Common usage in electronic technologies as well as printed board and electronic assembly technologies

EN
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IEC PAS 61182-12:2014

Edition 1.0 (2014-08-22)

Generic requirements for printed board assembly products manufacturing description data and transfer methodology

EN
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IEC 61188-5-1:2002

Edition 1.0 (2002-07-12)

Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements

EN-FR
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IEC 61188-5-2:2003

Edition 1.0 (2003-06-24)

Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components

EN-FR
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IEC 61188-5-3:2007

Edition 1.0 (2007-10-30)

Printed boards and printed board assemblies - Design and use - Part 5-3: Attachment (land/joint) considerations - Components with gull-wing leads on two sides

EN-FR, EN
Preview
IEC 61188-5-4:2007

Edition 1.0 (2007-10-30)

Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides

EN-FR, EN
Preview
IEC 61188-5-5:2007

Edition 1.0 (2007-10-30)

Printed boards and printed board assemblies - Design and use - Part 5-5: Attachment (land/joint) considerations - Components with gull-wing leads on four sides

EN-FR, EN
Preview
IEC 61188-5-6:2003

Edition 1.0 (2003-01-23)

Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations - Chip carriers with J-leads on four sides

EN-FR
Preview
IEC 61188-5-8:2007

Edition 1.0 (2007-10-30)

Printed board and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA)

EN-FR, EN
Preview
IEC 61188-6-4:2019

Edition 1.0 (2019-05-02)

Printed boards and printed board assemblies - Design and use - Part 6-4: Land pattern design - Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design

EN-FR
Preview
IEC 61188-7:2017

Edition 2.0 (2017-04-10)

Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction

EN-FR, EN
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IEC TR 61188-8:2021

Edition 1.0 (2021-01-14)

Circuit boards and circuit board assemblies - Design and use - Part 8: 3D shape data for CAD component library

EN
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IEC 61189-1:1997+AMD1:2001 CSV

Edition 1.1 (2001-11-22)

Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology

EN-FR
Preview
IEC 61189-1:1997

Edition 1.0 (1997-03-27)

Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology

EN-FR
No preview
IEC 61189-1:1997/AMD1:2001

Edition 1.0 (2001-08-09)

Amendment 1 - Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology

EN-FR
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IEC 61189-2:2006

Edition 2.0 (2006-05-30)

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures

EN
Preview
IEC 61189-2-630:2018

Edition 1.0 (2018-06-05)

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-630: Test methods for materials for interconnection structures - Moisture absorption after pressure vessel conditioning

EN-FR
Preview
IEC 61189-2-719:2016

Edition 1.0 (2016-07-12)

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-719: Test methods for materials for interconnection structures - Relative permittivity and loss tangent (500 MHz to 10 GHz)

EN-FR
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IEC 61189-2-721:2015

Edition 1.0 (2015-04-29)

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-721: Test methods for materials for interconnection structures - Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency using a split post dielectric resonator

EN-FR
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IEC 61189-3:2007

Edition 2.0 (2007-10-09)

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)

EN-FR, EN
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IEC TS 61189-3-301:2016

Edition 1.0 (2016-07-28)

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-301: Test methods for interconnection structures (printed boards) - Appearance inspection method for plated surfaces on PWB

EN
Preview
IEC 61189-3-719:2016

Edition 1.0 (2016-01-05)

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling

EN-FR
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IEC 61189-3-913:2016

Edition 1.0 (2016-01-05)

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-913: Test method for thermal conductivity of electronic circuit boards for high-brightness LEDs

EN-FR
Preview
IEC TR 61189-3-914:2017

Edition 1.0 (2017-03-17)

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-914: Test method for thermal conductivity of printed circuit boards for high-brightness LEDs - Guidelines

EN
Preview
IEC 61189-5:2006

Edition 1.0 (2006-08-29)

Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies

EN-FR, EN
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IEC 61189-5-1:2016

Edition 1.0 (2016-07-05)

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies

EN-FR
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IEC 61189-5-2:2015

Edition 1.0 (2015-01-08)

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies

EN-FR
Preview
IEC 61189-5-3:2015

Edition 1.0 (2015-01-08)

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies

EN-FR
Preview
IEC 61189-5-4:2015

Edition 1.0 (2015-01-08)

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies

EN-FR
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IEC 61189-5-503:2017

Edition 1.0 (2017-05-22)

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards

EN-FR, EN
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IEC 61189-5-504:2020

Edition 1.0 (2020-04-21)

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-504: General test methods for materials and assemblies - Process ionic contamination testing (PICT)

EN-FR
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IEC TR 61189-5-506:2019

Edition 1.0 (2019-06-26)

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-506: General test methods for materials and assemblies - An intercomparison evaluation to implement the use of fine-pitch test structures for surface insulation resistance (SIR) testing of solder fluxes in accordance with IEC 61189-5-501

EN
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IEC 61189-6:2006

Edition 1.0 (2006-07-24)

Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in manufacturing electronic assemblies

EN-FR, EN
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IEC 61189-11:2013

Edition 1.0 (2013-05-07)

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys

EN-FR
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IEC 61190-1-1:2002

Edition 1.0 (2002-03-25)

Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly

EN-FR
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IEC 61190-1-2:2014

Edition 3.0 (2014-02-19)

Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly

EN-FR
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IEC 61190-1-3:2017

Edition 3.0 (2017-12-13)

Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications

EN-FR
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IEC 61191-1:2018 RLV

Edition 3.0 (2018-09-14)

Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies

EN
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IEC 61191-1:2018

Edition 3.0 (2018-09-14)

Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies

EN-FR
Preview
IEC 61191-2:2017

Edition 3.0 (2017-05-23)

Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies

EN-FR, EN
No preview
IEC 61191-2:2017/COR1:2019

Edition 3.0 (2019-09-16)

Corrigendum 1 - Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies

EN-FR, EN
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IEC 61191-3:2017

Edition 2.0 (2017-05-30)

Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies

EN-FR, EN
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IEC 61191-4:2017

Edition 2.0 (2017-07-26)

Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies

EN
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IEC 61191-6:2010

Edition 1.0 (2010-01-14)

Printed board assemblies - Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method

EN-FR
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IEC TR 61191-7:2020

Edition 1.0 (2020-03-11)

Printed board assemblies - Part 7: Technical cleanliness of components and printed board assemblies

EN
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IEC 61193-1:2001

Edition 1.0 (2001-12-19)

Quality assessment systems - Part 1: Registration and analysis of defects on printed board assemblies

EN-FR
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IEC 61193-2:2007

Edition 1.0 (2007-08-30)

Quality assessment systems - Part 2: Selection and use of sampling plans for inspection of electronic components and packages

EN
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IEC 61193-3:2013

Edition 1.0 (2013-01-24)

Quality assessment systems - Part 3: Selection and use of sampling plans for printed board and laminate end-product and in-process auditing

EN-FR
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IEC 61249-2-1:2005

Edition 1.0 (2005-01-11)

Materials for printed boards and other interconnecting structures - Part 2-1: Reinforced base materials, clad and unclad - Phenolic cellulose paper reinforced laminated sheets, economic grade, copper clad

EN-FR
Preview
IEC 61249-2-2:2005

Edition 1.0 (2005-01-20)

Materials for printed boards and other interconnecting structures - Part 2-2: Reinforced base materials, clad and unclad - Phenolic cellulose paper reinforced laminated sheets, high electrical grade, copper-clad

EN-FR
Preview
IEC 61249-2-4:2001

Edition 1.0 (2001-12-19)

Materials for printed boards and other interconnecting structures - Part 2-4: Reinforced base materials, clad and unclad - Polyester non-woven/woven fibreglass laminated sheet of defined flammability (vertical burning test), copper-clad

EN-FR, ES
Preview
IEC 61249-2-5:2003

Edition 1.0 (2003-11-12)

Materials for printed boards and other interconnecting structures - Part 2-5: Reinforced base materials, clad and unclad - Brominated epoxide cellulose paper reinforced core/woven E-glass reinforced surfaces laminated sheets of defined flammability (vertical burning test), copper-clad

EN-FR, ES
Preview
IEC 61249-2-6:2003

Edition 1.0 (2003-11-12)

Materials for printed boards and other interconnecting structures - Part 2-6: Reinforced base materials, clad and unclad - Brominated epoxide non-woven/woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad

EN-FR, ES
Preview
IEC 61249-2-7:2002

Edition 1.0 (2002-03-05)

Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad

EN-FR
Preview
IEC 61249-2-8:2003

Edition 1.0 (2003-02-27)

Materials for printed boards and other interconnecting structures - Part 2-8: Reinforced base materials clad and unclad - Modified brominated epoxide woven fibreglass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad

EN-FR, ES
Preview
IEC 61249-2-9:2003

Edition 1.0 (2003-02-27)

Materials for printed boards and other interconnecting structures - Part 2-9: Reinforced base materials, clad and unclad - Bismaleimide/triazine modified epoxide or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad

EN-FR, ES
Preview
IEC 61249-2-10:2003

Edition 1.0 (2003-02-27)

Materials for printed boards and other interconnecting structures - Part 2-10: Reinforced base materials clad and unclad - Cyanate ester, brominated epoxide, modified or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad

EN-FR, ES
Preview
IEC 61249-2-11:2003

Edition 1.0 (2003-11-12)

Materials for printed boards and other interconnecting structures - Part 2-11: Reinforced base materials, clad and unclad - Polyimide, brominated epoxide modified or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad

EN-FR, ES
Preview
IEC 61249-2-12:1999

Edition 1.0 (1999-01-29)

Materials for printed boards and other interconnecting structures - Part 2-12: Sectional specification set for reinforced base materials, clad and unclad - Epoxide non-woven aramid laminate of defined flammability, copper-clad

EN-FR, EN, ES
Preview
IEC 61249-2-13:1999

Edition 1.0 (1999-02-26)

Materials for printed boards and other interconnecting structures - Part 2-13: Sectional specification set for reinforced base materials, clad and unclad - Cyanate ester non-woven aramid laminate of defined flammability, copper-clad

EN-FR, EN, ES
Preview
IEC 61249-2-18:2002

Edition 1.0 (2002-02-13)

Materials for printed boards and other interconnecting structures - Part 2-18: Reinforced base materials, clad and unclad - Polyester non-woven fibreglass reinforced laminated sheet of defined flammability (vertical burning test), copper-clad

EN-FR, ES
Preview
IEC 61249-2-19:2001

Edition 1.0 (2001-11-28)

Materials for printed boards and other interconnecting structures - Part 2-19: Reinforced base materials, clad and unclad - Epoxide cross-plied linear fibreglass-reinforced laminated sheets of defined flammability (vertical burning test), copper clad

EN-FR, ES
Preview
IEC 61249-2-21:2003

Edition 1.0 (2003-11-12)

Materials for printed boards and other interconnecting structures - Part 2-21: Reinforced base materials, clad and unclad - Non-halogenated epoxide woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad

EN-FR, ES
Preview
IEC 61249-2-22:2005

Edition 1.0 (2005-01-11)

Materials for printed boards and other interconnecting structures - Part 2-22: Reinforced base materials clad and unclad - Modified non-halogenated epoxide woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad

EN-FR
Preview
IEC 61249-2-23:2005

Edition 1.0 (2005-01-11)

Materials for printed boards and other interconnecting structures - Part 2-23: Reinforced base materials, clad and unclad - Non-halogenated phenolic cellulose paper reinforced laminated sheets, economic grade, copper clad

EN-FR
Preview
IEC 61249-2-26:2005

Edition 1.0 (2005-01-11)

Materials for printed boards and other interconnecting structures - Part 2-26: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad

EN-FR
Preview
IEC 61249-2-27:2012

Edition 1.0 (2012-11-29)

Materials for printed boards and other interconnecting structures - Part 2-27: Reinforced base materials clad and unclad - Bismaleimide/triazine modified with non-halogenated epoxide woven glass laminate sheets of defined flammability (vertical burning test), copper-clad

EN-FR
Preview
IEC 61249-2-30:2012

Edition 1.0 (2012-11-29)

Materials for printed boards and other interconnecting structures - Part 2-30: Reinforced base materials clad and unclad - Non-halogenated epoxide modified cyanate ester woven glass laminate of defined flammability (vertical burning test), copper-clad

EN-FR
Preview
IEC 61249-2-31:2009

Edition 1.0 (2009-02-11)

Materials for printed boards and other interconnecting structures - Part 2-31: Reinforced base materials, clad and unclad - Halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined relative permittivity (equal to or less than 4,1 at 1 GHz) and flammability (vertical burning test), copper-clad

EN-FR
Preview
IEC 61249-2-32:2009

Edition 1.0 (2009-02-11)

Materials for printed boards and other interconnecting structures - Part 2-32: Reinforced base materials, clad and unclad - Halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined relative permittivity (equal to or less than 3,7 at 1 GHz) and flammability (vertical burning test), copper-clad

EN-FR
Preview
IEC 61249-2-33:2009

Edition 1.0 (2009-02-11)

Materials for printed boards and other interconnecting structures - Part 2-33: Reinforced base materials, clad and unclad - Non-halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined relative permittivity (equal to or less than 4,1 at 1 GHz) and flammability (vertical burning test), copper-clad

EN-FR
Preview
IEC 61249-2-34:2009

Edition 1.0 (2009-02-11)

Materials for printed boards and other interconnecting structures - Part 2-34: Reinforced base materials, clad and unclad - Non-halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined relative permittivity (equal to or less than 3,7 at 1 GHz) and flammability (vertical burning test), copper-clad

EN-FR
Preview
IEC 61249-2-35:2008

Edition 1.0 (2008-11-27)

Materials for printed boards and other interconnecting structures - Part 2-35: Reinforced base materials, clad and unclad - Modified epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly

EN-FR
Preview
IEC 61249-2-36:2008

Edition 1.0 (2008-11-27)

Materials for printed boards and other interconnecting structures - Part 2-36: Reinforced base materials, clad and unclad - Epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly

EN-FR
Preview
IEC 61249-2-37:2008

Edition 1.0 (2008-11-27)

Materials for printed boards and other interconnecting structures - Part 2-37: Reinforced base materials, clad and unclad - Modified non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly

EN-FR
Preview
IEC 61249-2-38:2008

Edition 1.0 (2008-11-27)

Materials for printed boards and other interconnecting structures - Part 2-38: Reinforced base materials, clad and unclad - Non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly

EN-FR
Preview
IEC 61249-2-39:2012

Edition 1.0 (2012-11-29)

Materials for printed boards and other interconnecting structures - Part 2-39: Reinforced base materials clad and unclad - High performance epoxide and non-epoxide, woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly

EN-FR
Preview
IEC 61249-2-40:2012

Edition 1.0 (2012-11-29)

Materials for printed boards and other interconnecting structures - Part 2-40: Reinforced base materials, clad and unclad - High performance, non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly

EN-FR
Preview
IEC 61249-2-41:2010

Edition 1.0 (2010-04-21)

Materials for printed boards and other interconnecting structures - Part 2-41: Reinforced base materials clad and unclad - Brominated epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly

EN-FR
Preview
IEC 61249-2-42:2010

Edition 1.0 (2010-04-21)

Materials for printed boards and other interconnecting structures - Part 2-42: Reinforced base materials clad and unclad - Brominated epoxide non-woven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly

EN-FR
Preview
IEC 61249-2-43:2016

Edition 1.0 (2016-05-12)

Materials for printed boards and other interconnecting structures - Part 2-43: Reinforced base materials clad and unclad - Non-halogenated epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly

EN-FR
Preview
IEC 61249-2-44:2016

Edition 1.0 (2016-05-12)

Materials for printed boards and other interconnecting structures - Part 2-44: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly

EN-FR
Preview
IEC 61249-2-45:2018

Edition 1.0 (2018-01-10)

Materials for printed boards and other interconnecting structures - Part 2-45: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 1,0 W/(m•K) and defined flammability (vertical burning test), copper-clad for lead-free assembly

EN-FR, EN
Preview
IEC 61249-2-46:2018

Edition 1.0 (2018-01-10)

Materials for printed boards and other interconnecting structures - Part 2-46: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 1,5 W/(m•K) and defined flammability (vertical burning test), copper-clad for lead-free assembly

EN-FR, EN
Preview
IEC 61249-2-47:2018

Edition 1.0 (2018-01-10)

Materials for printed boards and other interconnecting structures - Part 2-47: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 2,0 W/(m•K) and defined flammability (vertical burning test), copper-clad for lead-free assembly

EN
Preview
IEC 61249-3-3:1999

Edition 1.0 (1999-02-10)

Materials for printed boards and other interconnecting structures - Part 3-3: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Adhesive coated flexible polyester film

EN-FR, EN, ES
Preview
IEC 61249-3-4:1999

Edition 1.0 (1999-02-10)

Materials for printed boards and other interconnecting structures - Part 3-4: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Adhesive coated flexible polyimide film

EN-FR, EN, ES
Preview
IEC 61249-3-5:1999

Edition 1.0 (1999-02-10)

Materials for printed boards and other interconnecting structures - Part 3-5: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Transfer adhesive films

EN-FR, EN, ES
Preview
IEC 61249-4-1:2008

Edition 1.0 (2008-01-30)

Materials for printed boards and other interconnecting structures - Part 4-1: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability

EN-FR, EN
Preview
IEC 61249-4-2:2005

Edition 1.0 (2005-09-05)

Materials for printed boards and other interconnecting structures - Part 4-2: Sectional specification set for prepreg materials, unclad - Multifunctional epoxide woven E-glass prepreg of defined flammability

EN
Preview
IEC 61249-4-5:2005

Edition 1.0 (2005-09-05)

Materials for printed boards and other interconnecting structures - Part 4-5: Sectional specification set for prepreg materials, unclad - Polyimide, modified or unmodified, woven E-glass prepreg of defined flammability

EN
Preview
IEC 61249-4-11:2005

Edition 1.0 (2005-09-22)

Materials for printed boards and other interconnecting structures - Part 4-11: Sectional specification set for prepreg materials, unclad - Non-halogenated epoxide, woven E-glass prepreg of defined flammability

EN-FR
Preview
IEC 61249-4-12:2005

Edition 1.0 (2005-09-05)

Materials for printed boards and other interconnecting structures - Part 4-12: Sectional specification set for prepreg materials, unclad - Non-halogenated multifunctional epoxide woven E-glass prepreg of defined flammability

EN-FR
Preview
IEC 61249-4-14:2009

Edition 1.0 (2009-05-26)

Materials for printed boards and other interconnecting structures - Part 4-14: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly

EN-FR, EN
Preview
IEC 61249-4-15:2009

Edition 1.0 (2009-05-26)

Materials for printed boards and other interconnecting structures - Part 4-15: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly

EN-FR, EN
Preview
IEC 61249-4-16:2009

Edition 1.0 (2009-05-26)

Materials for printed boards and other interconnecting structures - Part 4-16: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly

EN-FR, EN
Preview
IEC 61249-4-17:2009

Edition 1.0 (2009-05-26)

Materials for printed boards and other interconnecting structures - Part 4-17: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly

EN-FR, EN
Preview
IEC 61249-4-18:2013

Edition 1.0 (2013-11-04)

Materials for printed boards and other interconnecting structures - Part 4-18: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly

EN-FR
Preview
IEC 61249-4-19:2013

Edition 1.0 (2013-11-04)

Materials for printed boards and other interconnecting structures - Part 4-19: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly

EN-FR
Preview
IEC 61249-5-1:1995

Edition 1.0 (1995-11-28)

Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with and without coatings - Section 1: Copper foils (for the manufacture of copper-clad base materials)

EN-FR, ES
Preview
IEC 61249-5-4:1996

Edition 1.0 (1996-06-18)

Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with or without coatings - Section 4: Conductive inks

EN-FR, ES
Preview
IEC PAS 61249-6-3:2011

Edition 1.0 (2011-09-23)

Specification for finished fabric woven from "E" glass for printed boards

EN
Preview
IEC 61249-7-1:1995

Edition 1.0 (1995-04-26)

Materials for interconnection structures - Part 7: Sectional specification set for restraining core materials - Section 1: Copper/invar/copper

EN-FR, ES
Preview
IEC PAS 61249-8-1:2014

Edition 1.0 (2014-06-10)

Qualification and performance of electrical insulating compound for printed wiring assemblies

EN
Preview
IEC PAS 61249-8-5:2014

Edition 1.0 (2014-06-10)

Qualification and performance specification of permanent solder mask and flexible cover materials

EN
Preview
IEC 61249-8-7:1996

Edition 1.0 (1996-04-26)

Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 7: Marking legend inks

EN-FR, ES
Preview
IEC 61249-8-8:1997

Edition 1.0 (1997-06-24)

Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 8: Temporary polymer coatings

EN-FR, ES
Preview
IEC 61445:2012

Edition 1.0 (2012-06-21)

Digital Test Interchange Format (DTIF)

EN
Preview
IEC 61523-1:2012

Edition 2.0 (2012-06-21)

Delay and power calculation standards - Part 1: Integrated circuit delay and power calculation systems

EN
Preview
IEC 61523-3:2004

Edition 1.0 (2004-09-24)

Delay and power calculation standards - Part 3: Standard Delay Format (SDF) for the electronic design process

EN
Preview
IEC 61523-4:2015

Edition 1.0 (2015-03-11)

Design and Verification of Low-Power Integrated Circuits

EN
Preview
IEC 61636:2016

Edition 1.0 (2016-11-08)

Software interface for Maintenance Information Collection and Analysis (SIMICA)

EN
Preview
IEC 61636-1:2016

Edition 1.0 (2016-11-08)

Software interface for maintenance information collection and analysis (SIMICA): Exchanging test results and session information via the extensible markup language (XML)

EN
Preview
IEC 61636-99:2016

Edition 1.0 (2016-11-08)

Software Interface for Maintenance Information Collection and Analysis (SIMICA): Common Information Elements

EN
Preview
IEC 61671:2012

Edition 1.0 (2012-06-21)

Automatic Test Markup Language (ATML) for Exchanging Automatic Test Equipment and Test Information via XML

EN
Preview
IEC 61671-2:2016

Edition 1.0 (2016-04-08)

Standard for automatic test markup language (ATML) instrument description

EN
Preview
IEC 61671-4:2016

Edition 1.0 (2016-04-08)

Standard for automatic test markup language (ATML) test configuration

EN
Preview
IEC 61671-5:2016

Edition 1.0 (2016-04-08)

Standard for automatic test markup language (ATML) test adapter description

EN
Preview
IEC 61671-6:2016

Edition 1.0 (2016-04-08)

Standard for automatic test markup language (ATML) test station description

EN
Preview
IEC 61690-1:2000

Edition 1.0 (2000-01-31)

Electronic design interchange format (EDIF) - Part 1: Version 3 0 0. (This publication is available in electronic HTML format only)

EN, FR
Preview
IEC 61690-2:2000

Edition 1.0 (2000-01-31)

Electronic design interchange format (EDIF) - Part 2: Version 4 0 0. (This publication is available in electronic HTML format only)

EN, FR
Preview
IEC 61691-1-1:2011

Edition 2.0 (2011-05-19)

Behavioural languages - Part 1-1: VHDL Language Reference Manual

EN
Preview
IEC 61691-6:2009

Edition 1.0 (2009-12-14)

Behavioural languages - Part 6: VHDL Analog and Mixed-Signal Extensions

EN
Preview
IEC 61691-7:2009

Edition 1.0 (2009-12-14)

Behavioural languages - Part 7: SystemC R Language Reference Manual

EN
Preview
IEC 61760-1:2020

Edition 3.0 (2020-07-14)

Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)

EN-FR
Preview
IEC 61760-2:2007

Edition 2.0 (2007-04-24)

Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide

EN-FR, EN
Preview
IEC 61760-3:2010

Edition 1.0 (2010-03-16)

Surface mounting technology - Part 3: Standard method for the specification of components for through hole reflow (THR) soldering

EN-FR
Preview
IEC 61760-4:2015+AMD1:2018 CSV

Edition 1.1 (2018-03-13)

Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices

EN-FR
Preview
IEC 61760-4:2015

Edition 1.0 (2015-05-19)

Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices

EN-FR
No preview
IEC 61760-4:2015/AMD1:2018

Edition 1.0 (2018-03-13)

Amendment 1 - Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices

EN-FR
Preview
IEC TR 61908:2004

Edition 1.0 (2004-11-24)

The technology roadmap for industry data dictionary structure, utilization and implementation

EN
Preview
IEC 61926-1:1999

Edition 1.0 (1999-10-18)

Design automation - Part 1: Standard test language for all systems - Common abbreviated test language for all systems (C/ATLAS)

EN
Preview
IEC TR 62014-3:2002

Edition 1.0 (2002-12-04)

Electronic design automation libraries - Part 3: Models of integrated circuits for EMI behavioural simulation

EN
Preview
IEC 62014-4:2015

Edition 1.0 (2015-03-11)

IP-XACT, Standard Structure for Packaging, Integrating, and Reusing IP within Tool Flows

EN
Preview
IEC 62014-5:2015

Edition 1.0 (2015-03-11)

Quality of Electronic and Software Intellectual Property Used in System and System on Chip (SoC) Designs

EN
Preview
IEC 62090:2017

Edition 2.0 (2017-04-11)

Product package labels for electronic components using bar code and two-dimensional symbologies

EN-FR, EN
Preview
IEC 62137-1-1:2007

Edition 1.0 (2007-07-11)

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test

EN-FR, EN
Preview
IEC 62137-1-2:2007

Edition 1.0 (2007-07-25)

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test

EN-FR, EN
Preview
IEC 62137-1-3:2008

Edition 1.0 (2008-11-27)

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test

EN-FR
Preview
IEC 62137-1-4:2009

Edition 1.0 (2009-01-26)

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-4: Cyclic bending test

EN-FR
Preview
IEC 62137-1-5:2009

Edition 1.0 (2009-02-11)

Surface mounting technology - Environmental and endurance test methods for surface mount solder joints - Part 1-5: Mechanical shear fatigue test

EN-FR
Preview
IEC 62137-3:2011

Edition 1.0 (2011-11-08)

Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints

EN-FR
Preview
IEC 62137-4:2014

Edition 1.0 (2014-10-09)

Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices

EN-FR
Preview
IEC 62243:2012

Edition 2.0 (2012-06-21)

Artificial Intelligence Exchange and Service Tie to All Test Environments (AI-ESTATE)

EN
Preview
IEC 62326-1:2002

Edition 2.0 (2002-03-05)

Printed boards - Part 1: Generic specification

EN-FR, ES
Preview
IEC 62326-4:1996

Edition 1.0 (1996-12-19)

Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification

EN-FR, ES
Preview
IEC 62326-4-1:1996

Edition 1.0 (1996-12-19)

Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification - Section 1: Capability detail specification - Performance levels A, B and C

EN-FR, ES
Preview
IEC 62326-20:2016

Edition 1.0 (2016-02-03)

Printed boards - Part 20: Printed circuit boards for high-brightness LEDs

EN-FR
Preview
IEC 62421:2007

Edition 1.0 (2007-08-24)

Electronics assembly technology - Electronic modules

EN-FR, EN
Preview
IEC 62525:2007

Edition 1.0 (2007-11-07)

Standard Test Interface Language (STIL) for Digital Test Vector Data

EN
Preview
IEC 62526:2007

Edition 1.0 (2007-11-07)

Standard for Extensions to Standard Test Interface Language (STIL) for Semiconductor Design Environments

EN
Preview
IEC 62527:2007

Edition 1.0 (2007-11-07)

Standard for Extensions to Standard Test Interface Language (STIL) for DC Level Specification

EN
Preview
IEC 62528:2007

Edition 1.0 (2007-11-07)

Standard Testability Method for Embedded Core-based Integrated Circuits

EN
Preview
IEC 62529:2012

Edition 2.0 (2012-06-21)

Standard for Signal and Test Definition

EN
Preview
IEC 62530:2011

Edition 2.0 (2011-05-19)

SystemVerilog - Unified Hardware Design, Specification, and Verification Language

EN
Preview
IEC 62531:2012

Edition 2.0 (2012-06-21)

Property Specification Language (PSL)

EN
Preview
IEC TR 62699-1:2014

Edition 1.0 (2014-12-16)

Mapping rules and exchange methods for heterogeneous electronic parts libraries - Part 1: Building an integrated search system

EN
Preview
IEC 62739-1:2013

Edition 1.0 (2013-06-18)

Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 1: Erosion test method for metal materials without surface processing

EN-FR
Preview
IEC 62739-2:2016

Edition 1.0 (2016-07-13)

Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 2: Erosion test method for metal materials with surface processing

EN-FR
Preview
IEC 62739-3:2017

Edition 1.0 (2017-01-06)

Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 3: Selection guidance of erosion test methods

EN-FR, EN
Preview
IEC TR 62856:2013

Edition 1.0 (2013-08-07)

Documentation on design automation subjects - The Bird's-eye View of Design Languages (BVDL)

EN-FR
Preview
IEC TR 62866:2014

Edition 1.0 (2014-05-07)

Electrochemical migration in printed wiring boards and assemblies - Mechanisms and testing

EN-FR
Preview
IEC 62878-1:2019

Edition 1.0 (2019-10-14)

Device embedding assembly technology - Part 1: Generic specification for device embedded substrates

EN-FR, EN
Preview
IEC 62878-1-1:2015

Edition 1.0 (2015-05-20)

Device embedded substrate - Part 1-1: Generic specification - Test methods

EN-FR
Preview
IEC TS 62878-2-1:2015

Edition 1.0 (2015-03-30)

Device embedded substrate - Part 2-1: Guidelines - General description of technology

EN-FR
Preview
IEC TR 62878-2-2:2015

Edition 1.0 (2015-12-04)

Device embedded substrate - Part 2-2: Guidelines - Electrical testing

EN-FR
Preview
IEC TS 62878-2-3:2015

Edition 1.0 (2015-03-27)

Device embedded substrate - Part 2-3: Guidelines - Design guide

EN-FR
Preview
IEC TS 62878-2-4:2015

Edition 1.0 (2015-03-27)

Device embedded substrate - Part 2-4: Guidelines - Test element groups (TEG)

EN-FR
Preview
IEC 62878-2-5:2019

Edition 1.0 (2019-09-16)

Device embedding assembly technology - Part 2-5: Guidelines - Implementation of a 3D data format for device embedded substrate

EN-FR, EN
Preview
IEC TR 62878-2-7:2019

Edition 1.0 (2019-03-20)

Device embedding assembly technology - Part 2-7: Guidelines - Accelerated stress testing of passive embedded circuit boards

EN
Preview
IEC 63003:2015

Edition 1.0 (2015-12-14)

Standard for the common test interface pin map configuration for high-density, single-tier electronics test requirements utilizing IEEE Std 1505™

EN
Preview
IEC 63004:2015

Edition 1.0 (2015-12-14)

Standard for receiver fixture interface

EN
Preview
IEC TR 63017:2015

Edition 1.0 (2015-12-16)

Flexible printed circuit boards (FPCBs) - Method of compensation of impedance variations

EN
Preview
IEC TR 63018:2015

Edition 1.0 (2015-12-16)

Flexible printed circuit boards (FPCBs) - Method to decrease signal loss by using noise suppression materials

EN
Preview
IEC TR 63051:2017

Edition 1.0 (2017-01-10)

Documentation on design automation subjects - Mathematical algorithm hardware description languages for system level modeling and verification (HDLMath)

EN
Preview
IEC 63055:2016

Edition 1.0 (2016-11-08)

Format for LSI-Package-Board Interoperable design

EN