TC 91

Edition 5.0 (2008-07-21)

Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads

Edition 6.0 (2006-06-22)

Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices

Edition 6.0 (2012-01-24)

Corrigendum 1 - Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices

Edition 4.1 (2017-07-28)

Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

Edition 4.0 (2015-03-27)

Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

Edition 4.0 (2017-07-28)

Amendment 1 - Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

Edition 3.1 (2019-06-19)

Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method

Edition 3.0 (2017-03-07)

Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method

Edition 3.0 (2018-01-24)

Corrigendum 1 - Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement)

Edition 3.0 (2019-06-19)

Amendment 1 - Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method

Edition 1.0 (1999-01-15)

Environmental testing - Part 2-77: Tests - Test 77: Body strength and impact shock

Edition 2.0 (2019-05-14)

Environmental testing - Part 2-82: Tests - Test Xw1: Whisker test methods for components and parts used in electronic assemblies

Edition 1.0 (2011-09-07)

Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste

Edition 2.0 (2014-10-17)

Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile

Edition 1.0 (2016-05-13)

Environmental testing - Part 3-13: Supporting documentation and guidance on Test T - Soldering

Edition 6.0 (2015-04-15)

Printed board design, manufacture and assembly - Terms and definitions

Edition 1.0 (2017-12-13)

Printed boards design, manufacture and assembly - Vocabulary - Part 2: Common usage in electronic technologies as well as printed board and electronic assembly technologies

Edition 1.0 (2014-08-22)

Generic requirements for printed board assembly products manufacturing description data and transfer methodology

Edition 1.0 (2002-07-12)

Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements

Edition 1.0 (2003-06-24)

Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components

Edition 1.0 (2007-10-30)

Printed boards and printed board assemblies - Design and use - Part 5-3: Attachment (land/joint) considerations - Components with gull-wing leads on two sides

Edition 1.0 (2007-10-30)

Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides

Edition 1.0 (2007-10-30)

Printed boards and printed board assemblies - Design and use - Part 5-5: Attachment (land/joint) considerations - Components with gull-wing leads on four sides

Edition 1.0 (2003-01-23)

Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations - Chip carriers with J-leads on four sides

Edition 1.0 (2007-10-30)

Printed board and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA)

Edition 1.0 (2019-05-02)

Printed boards and printed board assemblies - Design and use - Part 6-4: Land pattern design - Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design

Edition 2.0 (2017-04-10)

Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction

Edition 1.0 (2021-01-14)

Circuit boards and circuit board assemblies - Design and use - Part 8: 3D shape data for CAD component library

Edition 1.1 (2001-11-22)

Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology

Edition 1.0 (1997-03-27)

Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology

Edition 1.0 (2001-08-09)

Amendment 1 - Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology

Edition 2.0 (2006-05-30)

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures

Edition 1.0 (2018-06-05)

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-630: Test methods for materials for interconnection structures - Moisture absorption after pressure vessel conditioning

Edition 1.0 (2016-07-12)

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-719: Test methods for materials for interconnection structures - Relative permittivity and loss tangent (500 MHz to 10 GHz)

Edition 1.0 (2015-04-29)

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-721: Test methods for materials for interconnection structures - Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency using a split post dielectric resonator

Edition 2.0 (2007-10-09)

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)

Edition 1.0 (2016-07-28)

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-301: Test methods for interconnection structures (printed boards) - Appearance inspection method for plated surfaces on PWB

Edition 1.0 (2016-01-05)

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling

Edition 1.0 (2016-01-05)

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-913: Test method for thermal conductivity of electronic circuit boards for high-brightness LEDs

Edition 1.0 (2017-03-17)

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-914: Test method for thermal conductivity of printed circuit boards for high-brightness LEDs - Guidelines

Edition 1.0 (2006-08-29)

Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies

Edition 1.0 (2016-07-05)

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies

Edition 1.0 (2015-01-08)

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies

Edition 1.0 (2015-01-08)

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies

Edition 1.0 (2015-01-08)

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies

Edition 1.0 (2017-05-22)

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards

Edition 1.0 (2020-04-21)

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-504: General test methods for materials and assemblies - Process ionic contamination testing (PICT)

Edition 1.0 (2019-06-26)

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-506: General test methods for materials and assemblies - An intercomparison evaluation to implement the use of fine-pitch test structures for surface insulation resistance (SIR) testing of solder fluxes in accordance with IEC 61189-5-501

Edition 1.0 (2006-07-24)

Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in manufacturing electronic assemblies

Edition 1.0 (2013-05-07)

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys

Edition 1.0 (2002-03-25)

Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly

Edition 3.0 (2014-02-19)

Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly

Edition 3.0 (2017-12-13)

Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications

Edition 3.0 (2018-09-14)

Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies

Edition 3.0 (2018-09-14)

Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies

Edition 3.0 (2017-05-23)

Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies

Edition 3.0 (2019-09-16)

Corrigendum 1 - Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies

Edition 2.0 (2017-05-30)

Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies

Edition 2.0 (2017-07-26)

Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies

Edition 1.0 (2010-01-14)

Printed board assemblies - Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method

Edition 1.0 (2020-03-11)

Printed board assemblies - Part 7: Technical cleanliness of components and printed board assemblies

Edition 1.0 (2001-12-19)

Quality assessment systems - Part 1: Registration and analysis of defects on printed board assemblies

Edition 1.0 (2007-08-30)

Quality assessment systems - Part 2: Selection and use of sampling plans for inspection of electronic components and packages

Edition 1.0 (2013-01-24)

Quality assessment systems - Part 3: Selection and use of sampling plans for printed board and laminate end-product and in-process auditing

Edition 1.0 (2005-01-11)

Materials for printed boards and other interconnecting structures - Part 2-1: Reinforced base materials, clad and unclad - Phenolic cellulose paper reinforced laminated sheets, economic grade, copper clad

Edition 1.0 (2005-01-20)

Materials for printed boards and other interconnecting structures - Part 2-2: Reinforced base materials, clad and unclad - Phenolic cellulose paper reinforced laminated sheets, high electrical grade, copper-clad

Edition 1.0 (2001-12-19)

Materials for printed boards and other interconnecting structures - Part 2-4: Reinforced base materials, clad and unclad - Polyester non-woven/woven fibreglass laminated sheet of defined flammability (vertical burning test), copper-clad

Edition 1.0 (2003-11-12)

Materials for printed boards and other interconnecting structures - Part 2-5: Reinforced base materials, clad and unclad - Brominated epoxide cellulose paper reinforced core/woven E-glass reinforced surfaces laminated sheets of defined flammability (vertical burning test), copper-clad

Edition 1.0 (2003-11-12)

Materials for printed boards and other interconnecting structures - Part 2-6: Reinforced base materials, clad and unclad - Brominated epoxide non-woven/woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad

Edition 1.0 (2002-03-05)

Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad

Edition 1.0 (2003-02-27)

Materials for printed boards and other interconnecting structures - Part 2-8: Reinforced base materials clad and unclad - Modified brominated epoxide woven fibreglass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad

Edition 1.0 (2003-02-27)

Materials for printed boards and other interconnecting structures - Part 2-9: Reinforced base materials, clad and unclad - Bismaleimide/triazine modified epoxide or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad

Edition 1.0 (2003-02-27)

Materials for printed boards and other interconnecting structures - Part 2-10: Reinforced base materials clad and unclad - Cyanate ester, brominated epoxide, modified or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad

Edition 1.0 (2003-11-12)

Materials for printed boards and other interconnecting structures - Part 2-11: Reinforced base materials, clad and unclad - Polyimide, brominated epoxide modified or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad

Edition 1.0 (1999-01-29)

Materials for printed boards and other interconnecting structures - Part 2-12: Sectional specification set for reinforced base materials, clad and unclad - Epoxide non-woven aramid laminate of defined flammability, copper-clad

Edition 1.0 (1999-02-26)

Materials for printed boards and other interconnecting structures - Part 2-13: Sectional specification set for reinforced base materials, clad and unclad - Cyanate ester non-woven aramid laminate of defined flammability, copper-clad

Edition 1.0 (2002-02-13)

Materials for printed boards and other interconnecting structures - Part 2-18: Reinforced base materials, clad and unclad - Polyester non-woven fibreglass reinforced laminated sheet of defined flammability (vertical burning test), copper-clad

Edition 1.0 (2001-11-28)

Materials for printed boards and other interconnecting structures - Part 2-19: Reinforced base materials, clad and unclad - Epoxide cross-plied linear fibreglass-reinforced laminated sheets of defined flammability (vertical burning test), copper clad

Edition 1.0 (2003-11-12)

Materials for printed boards and other interconnecting structures - Part 2-21: Reinforced base materials, clad and unclad - Non-halogenated epoxide woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad

Edition 1.0 (2005-01-11)

Materials for printed boards and other interconnecting structures - Part 2-22: Reinforced base materials clad and unclad - Modified non-halogenated epoxide woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad

Edition 1.0 (2005-01-11)

Materials for printed boards and other interconnecting structures - Part 2-23: Reinforced base materials, clad and unclad - Non-halogenated phenolic cellulose paper reinforced laminated sheets, economic grade, copper clad

Edition 1.0 (2005-01-11)

Materials for printed boards and other interconnecting structures - Part 2-26: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad

Edition 1.0 (2012-11-29)

Materials for printed boards and other interconnecting structures - Part 2-27: Reinforced base materials clad and unclad - Bismaleimide/triazine modified with non-halogenated epoxide woven glass laminate sheets of defined flammability (vertical burning test), copper-clad

Edition 1.0 (2012-11-29)

Materials for printed boards and other interconnecting structures - Part 2-30: Reinforced base materials clad and unclad - Non-halogenated epoxide modified cyanate ester woven glass laminate of defined flammability (vertical burning test), copper-clad

Edition 1.0 (2009-02-11)

Materials for printed boards and other interconnecting structures - Part 2-31: Reinforced base materials, clad and unclad - Halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined relative permittivity (equal to or less than 4,1 at 1 GHz) and flammability (vertical burning test), copper-clad

Edition 1.0 (2009-02-11)

Materials for printed boards and other interconnecting structures - Part 2-32: Reinforced base materials, clad and unclad - Halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined relative permittivity (equal to or less than 3,7 at 1 GHz) and flammability (vertical burning test), copper-clad

Edition 1.0 (2009-02-11)

Materials for printed boards and other interconnecting structures - Part 2-33: Reinforced base materials, clad and unclad - Non-halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined relative permittivity (equal to or less than 4,1 at 1 GHz) and flammability (vertical burning test), copper-clad

Edition 1.0 (2009-02-11)

Materials for printed boards and other interconnecting structures - Part 2-34: Reinforced base materials, clad and unclad - Non-halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined relative permittivity (equal to or less than 3,7 at 1 GHz) and flammability (vertical burning test), copper-clad

Edition 1.0 (2008-11-27)

Materials for printed boards and other interconnecting structures - Part 2-35: Reinforced base materials, clad and unclad - Modified epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly

Edition 1.0 (2008-11-27)

Materials for printed boards and other interconnecting structures - Part 2-36: Reinforced base materials, clad and unclad - Epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly

Edition 1.0 (2008-11-27)

Materials for printed boards and other interconnecting structures - Part 2-37: Reinforced base materials, clad and unclad - Modified non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly

Edition 1.0 (2008-11-27)

Materials for printed boards and other interconnecting structures - Part 2-38: Reinforced base materials, clad and unclad - Non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly

Edition 1.0 (2012-11-29)

Materials for printed boards and other interconnecting structures - Part 2-39: Reinforced base materials clad and unclad - High performance epoxide and non-epoxide, woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly

Edition 1.0 (2012-11-29)

Materials for printed boards and other interconnecting structures - Part 2-40: Reinforced base materials, clad and unclad - High performance, non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly

Edition 1.0 (2010-04-21)

Materials for printed boards and other interconnecting structures - Part 2-41: Reinforced base materials clad and unclad - Brominated epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly

Edition 1.0 (2010-04-21)

Materials for printed boards and other interconnecting structures - Part 2-42: Reinforced base materials clad and unclad - Brominated epoxide non-woven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly

Edition 1.0 (2016-05-12)

Materials for printed boards and other interconnecting structures - Part 2-43: Reinforced base materials clad and unclad - Non-halogenated epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly

Edition 1.0 (2016-05-12)

Materials for printed boards and other interconnecting structures - Part 2-44: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly

Edition 1.0 (2018-01-10)

Materials for printed boards and other interconnecting structures - Part 2-45: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 1,0 W/(m•K) and defined flammability (vertical burning test), copper-clad for lead-free assembly

Edition 1.0 (2018-01-10)

Materials for printed boards and other interconnecting structures - Part 2-46: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 1,5 W/(m•K) and defined flammability (vertical burning test), copper-clad for lead-free assembly

Edition 1.0 (2018-01-10)

Materials for printed boards and other interconnecting structures - Part 2-47: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 2,0 W/(m•K) and defined flammability (vertical burning test), copper-clad for lead-free assembly

Edition 1.0 (1999-02-10)

Materials for printed boards and other interconnecting structures - Part 3-3: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Adhesive coated flexible polyester film

Edition 1.0 (1999-02-10)

Materials for printed boards and other interconnecting structures - Part 3-4: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Adhesive coated flexible polyimide film

Edition 1.0 (1999-02-10)

Materials for printed boards and other interconnecting structures - Part 3-5: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Transfer adhesive films

Edition 1.0 (2008-01-30)

Materials for printed boards and other interconnecting structures - Part 4-1: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability

Edition 1.0 (2005-09-05)

Materials for printed boards and other interconnecting structures - Part 4-2: Sectional specification set for prepreg materials, unclad - Multifunctional epoxide woven E-glass prepreg of defined flammability

Edition 1.0 (2005-09-05)

Materials for printed boards and other interconnecting structures - Part 4-5: Sectional specification set for prepreg materials, unclad - Polyimide, modified or unmodified, woven E-glass prepreg of defined flammability

Edition 1.0 (2005-09-22)

Materials for printed boards and other interconnecting structures - Part 4-11: Sectional specification set for prepreg materials, unclad - Non-halogenated epoxide, woven E-glass prepreg of defined flammability

Edition 1.0 (2005-09-05)

Materials for printed boards and other interconnecting structures - Part 4-12: Sectional specification set for prepreg materials, unclad - Non-halogenated multifunctional epoxide woven E-glass prepreg of defined flammability

Edition 1.0 (2009-05-26)

Materials for printed boards and other interconnecting structures - Part 4-14: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly

Edition 1.0 (2009-05-26)

Materials for printed boards and other interconnecting structures - Part 4-15: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly

Edition 1.0 (2009-05-26)

Materials for printed boards and other interconnecting structures - Part 4-16: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly

Edition 1.0 (2009-05-26)

Materials for printed boards and other interconnecting structures - Part 4-17: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly

Edition 1.0 (2013-11-04)

Materials for printed boards and other interconnecting structures - Part 4-18: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly

Edition 1.0 (2013-11-04)

Materials for printed boards and other interconnecting structures - Part 4-19: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly

Edition 1.0 (1995-11-28)

Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with and without coatings - Section 1: Copper foils (for the manufacture of copper-clad base materials)

Edition 1.0 (1996-06-18)

Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with or without coatings - Section 4: Conductive inks

Edition 1.0 (2011-09-23)

Specification for finished fabric woven from "E" glass for printed boards

Edition 1.0 (1995-04-26)

Materials for interconnection structures - Part 7: Sectional specification set for restraining core materials - Section 1: Copper/invar/copper

Edition 1.0 (2014-06-10)

Qualification and performance of electrical insulating compound for printed wiring assemblies

Edition 1.0 (2014-06-10)

Qualification and performance specification of permanent solder mask and flexible cover materials

Edition 1.0 (1996-04-26)

Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 7: Marking legend inks

Edition 1.0 (1997-06-24)

Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 8: Temporary polymer coatings

Edition 1.0 (2012-06-21)

Digital Test Interchange Format (DTIF)

Edition 2.0 (2012-06-21)

Delay and power calculation standards - Part 1: Integrated circuit delay and power calculation systems

Edition 1.0 (2004-09-24)

Delay and power calculation standards - Part 3: Standard Delay Format (SDF) for the electronic design process

Edition 1.0 (2015-03-11)

Design and Verification of Low-Power Integrated Circuits

Edition 1.0 (2016-11-08)

Software interface for Maintenance Information Collection and Analysis (SIMICA)

Edition 1.0 (2016-11-08)

Software interface for maintenance information collection and analysis (SIMICA): Exchanging test results and session information via the extensible markup language (XML)

Edition 1.0 (2016-11-08)

Software Interface for Maintenance Information Collection and Analysis (SIMICA): Common Information Elements

Edition 1.0 (2012-06-21)

Automatic Test Markup Language (ATML) for Exchanging Automatic Test Equipment and Test Information via XML

Edition 1.0 (2016-04-08)

Standard for automatic test markup language (ATML) instrument description

Edition 1.0 (2016-04-08)

Standard for automatic test markup language (ATML) test configuration

Edition 1.0 (2016-04-08)

Standard for automatic test markup language (ATML) test adapter description

Edition 1.0 (2016-04-08)

Standard for automatic test markup language (ATML) test station description

Edition 1.0 (2000-01-31)

Electronic design interchange format (EDIF) - Part 1: Version 3 0 0. (This publication is available in electronic HTML format only)

Edition 1.0 (2000-01-31)

Electronic design interchange format (EDIF) - Part 2: Version 4 0 0. (This publication is available in electronic HTML format only)

Edition 2.0 (2011-05-19)

Behavioural languages - Part 1-1: VHDL Language Reference Manual

Edition 1.0 (2009-12-14)

Behavioural languages - Part 6: VHDL Analog and Mixed-Signal Extensions

Edition 1.0 (2009-12-14)

Behavioural languages - Part 7: SystemC R Language Reference Manual

Edition 3.0 (2020-07-14)

Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)

Edition 2.0 (2007-04-24)

Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide

Edition 1.0 (2010-03-16)

Surface mounting technology - Part 3: Standard method for the specification of components for through hole reflow (THR) soldering

Edition 1.1 (2018-03-13)

Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices

Edition 1.0 (2015-05-19)

Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices

Edition 1.0 (2018-03-13)

Amendment 1 - Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices

Edition 1.0 (2004-11-24)

The technology roadmap for industry data dictionary structure, utilization and implementation

Edition 1.0 (1999-10-18)

Design automation - Part 1: Standard test language for all systems - Common abbreviated test language for all systems (C/ATLAS)

Edition 1.0 (2002-12-04)

Electronic design automation libraries - Part 3: Models of integrated circuits for EMI behavioural simulation

Edition 1.0 (2015-03-11)

IP-XACT, Standard Structure for Packaging, Integrating, and Reusing IP within Tool Flows

Edition 1.0 (2015-03-11)

Quality of Electronic and Software Intellectual Property Used in System and System on Chip (SoC) Designs

Edition 2.0 (2017-04-11)

Product package labels for electronic components using bar code and two-dimensional symbologies

Edition 1.0 (2007-07-11)

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test

Edition 1.0 (2007-07-25)

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test

Edition 1.0 (2008-11-27)

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test

Edition 1.0 (2009-01-26)

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-4: Cyclic bending test

Edition 1.0 (2009-02-11)

Surface mounting technology - Environmental and endurance test methods for surface mount solder joints - Part 1-5: Mechanical shear fatigue test

Edition 1.0 (2011-11-08)

Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints

Edition 1.0 (2014-10-09)

Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices

Edition 2.0 (2012-06-21)

Artificial Intelligence Exchange and Service Tie to All Test Environments (AI-ESTATE)

Edition 2.0 (2002-03-05)

Printed boards - Part 1: Generic specification

Edition 1.0 (1996-12-19)

Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification

Edition 1.0 (1996-12-19)

Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification - Section 1: Capability detail specification - Performance levels A, B and C

Edition 1.0 (2016-02-03)

Printed boards - Part 20: Printed circuit boards for high-brightness LEDs

Edition 1.0 (2007-08-24)

Electronics assembly technology - Electronic modules

Edition 1.0 (2007-11-07)

Standard Test Interface Language (STIL) for Digital Test Vector Data

Edition 1.0 (2007-11-07)

Standard for Extensions to Standard Test Interface Language (STIL) for Semiconductor Design Environments

Edition 1.0 (2007-11-07)

Standard for Extensions to Standard Test Interface Language (STIL) for DC Level Specification

Edition 1.0 (2007-11-07)

Standard Testability Method for Embedded Core-based Integrated Circuits

Edition 2.0 (2012-06-21)

Standard for Signal and Test Definition

Edition 2.0 (2011-05-19)

SystemVerilog - Unified Hardware Design, Specification, and Verification Language

Edition 2.0 (2012-06-21)

Property Specification Language (PSL)

Edition 1.0 (2014-12-16)

Mapping rules and exchange methods for heterogeneous electronic parts libraries - Part 1: Building an integrated search system

Edition 1.0 (2013-06-18)

Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 1: Erosion test method for metal materials without surface processing

Edition 1.0 (2016-07-13)

Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 2: Erosion test method for metal materials with surface processing

Edition 1.0 (2017-01-06)

Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 3: Selection guidance of erosion test methods

Edition 1.0 (2013-08-07)

Documentation on design automation subjects - The Bird's-eye View of Design Languages (BVDL)

Edition 1.0 (2014-05-07)

Electrochemical migration in printed wiring boards and assemblies - Mechanisms and testing

Edition 1.0 (2019-10-14)

Device embedding assembly technology - Part 1: Generic specification for device embedded substrates

Edition 1.0 (2015-05-20)

Device embedded substrate - Part 1-1: Generic specification - Test methods

Edition 1.0 (2015-03-30)

Device embedded substrate - Part 2-1: Guidelines - General description of technology

Edition 1.0 (2015-12-04)

Device embedded substrate - Part 2-2: Guidelines - Electrical testing

Edition 1.0 (2015-03-27)

Device embedded substrate - Part 2-3: Guidelines - Design guide

Edition 1.0 (2015-03-27)

Device embedded substrate - Part 2-4: Guidelines - Test element groups (TEG)

Edition 1.0 (2019-09-16)

Device embedding assembly technology - Part 2-5: Guidelines - Implementation of a 3D data format for device embedded substrate

Edition 1.0 (2019-03-20)

Device embedding assembly technology - Part 2-7: Guidelines - Accelerated stress testing of passive embedded circuit boards

Edition 1.0 (2015-12-14)

Standard for the common test interface pin map configuration for high-density, single-tier electronics test requirements utilizing IEEE Std 1505™

Edition 1.0 (2015-12-14)

Standard for receiver fixture interface

Edition 1.0 (2015-12-16)

Flexible printed circuit boards (FPCBs) - Method of compensation of impedance variations

Edition 1.0 (2015-12-16)

Flexible printed circuit boards (FPCBs) - Method to decrease signal loss by using noise suppression materials

Edition 1.0 (2017-01-10)

Documentation on design automation subjects - Mathematical algorithm hardware description languages for system level modeling and verification (HDLMath)

Edition 1.0 (2016-11-08)

Format for LSI-Package-Board Interoperable design