SC 47A

Integrated circuits

 
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SC 47A Publications (83)

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Reference, Edition, Date, Title
Language
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IEC 60748-1:2002

Edition 2.0 (2002-05-08)

Semiconductor devices - Integrated circuits - Part 1: General

EN-FR
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IEC 60748-2:1997

Edition 2.0 (1997-12-22)

Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits

EN-FR
Preview
IEC 60748-2-1:1991

Edition 1.0 (1991-10-01)

Semiconductor devices - Integrated circuits - Part 2-1: Digital integrated circuits - Blank detail specification for bipolar monolithic digital integrated circuit gates (excluding uncommitted logic arrays)

EN-FR, RU
Preview
IEC 60748-2-2:1992

Edition 1.0 (1992-02-29)

Semiconductor devices. Integrated circuits - Part 2: Digital integrated circuits - Section two: Family specification for HCMOS digital integrated circuits, series 54/74 HC, 54/74 HCT, 54/74 HCU

EN-FR
No preview
IEC 60748-2-2:1992/AMD1:1994

Edition 1.0 (1994-06-07)

Amendment 1 - Semiconductor devices. Integrated circuits - Part 2: Digital integrated circuits - Section two: Family specification for HCMOS digital integrated circuits, series 54/74 HC, 54/74 HCT, 54/74 HCU

EN-FR
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IEC 60748-2-3:1992

Edition 1.0 (1992-02-20)

Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits - Section three: Blank detail specification for HCMOS digital integrated circuits (series 54/74 HC, 54/74 HCT, 54/74 HCU)

EN-FR
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IEC 60748-2-4:1992

Edition 1.0 (1992-01-30)

Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits - Section four: Family specification for complementary MOS digital integrated circuits, series 4000 B and 4000 UB

EN-FR
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IEC 60748-2-5:1992

Edition 1.0 (1992-01-31)

Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits - Section five: Blank detail specification for complementary MOS digital integrated circuits (series 4000 B and 4000 UB)

EN-FR
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IEC 60748-2-6:1991

Edition 1.0 (1991-11-15)

Semiconductor devices. Integrated circuits - Part 2: Digital integrated circuits - Section Six: Blank detail specification for microprocessor integrated circuits

EN-FR
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IEC 60748-2-7:1992

Edition 1.0 (1992-10-23)

Semiconductor devices. Integrated circuits - Part 2: Digital integrated circuits - Section seven: Blank detail specification for integrated circuit fusible-link programmable bipolar read-only memories

EN-FR
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IEC 60748-2-8:1993

Edition 1.0 (1993-07-29)

Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits - Section Eight: Blank detail specification for integrated circuit static read/write memories

EN-FR
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IEC 60748-2-9:1994

Edition 1.0 (1994-12-21)

Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits - Section 9: Blank detail specification for MOS ultraviolet light erasable electrically programmable read-only memories

EN-FR
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IEC 60748-2-10:1994

Edition 1.0 (1994-12-21)

Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits - Section 10: Blank detail specification for integrated circuit dynamic read/write memories

EN-FR
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IEC 60748-2-11:1999

Edition 1.0 (1999-04-12)

Semiconductor devices - Integrated circuits - Part 2-11: Digital integrated circuits - Blank detail specification for single supply integrated circuit, electrically erasable, and programmable read-only memory

EN-FR
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IEC 60748-2-12:2001

Edition 1.0 (2001-01-30)

Semiconductor devices - Integrated circuits - part2-12: Digital integrated circuits - Blank detail specification for programmable logic devices (PLDs)

EN-FR
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IEC 60748-2-20:2008

Edition 2.0 (2008-02-27)

Semiconductor devices - Integrated circuits - Part 2-20: Digital integrated circuits - Family specification - Low voltage integrated circuits

EN-FR
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IEC 60748-3:1986

Edition 1.0 (1986-01-01)

Semiconductor devices - Integrated circuits - Part 3: Analogue integrated circuits

EN-FR, RU
No preview
IEC 60748-3:1986/AMD1:1991

Edition 1.0 (1991-11-15)

Amendment 1 - Semiconductor devices. Integrated circuits. Part 3: Analogue integrated circuits

EN-FR
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IEC 60748-3:1986/AMD2:1994

Edition 1.0 (1994-02-08)

Amendment 2 - Semiconductor devices. Integrated circuits. Part 3: Analogue integrated circuits

EN-FR
No preview
IEC 60748-3:1986/AMD2:1994/COR1:1996

Edition 1.0 (1996-06-11)

Corrigendum 1 to Amendment 2 - Semiconductor devices. Integrated circuits. Part 3: Analogue integrated circuits

EN-FR
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IEC 60748-3-1:1991

Edition 1.0 (1991-08-02)

Semiconductor devices. Integrated circuits - Part 3: Analogue integrated circuits - Section one: Blank detail specification for monolithic integrated operational amplifiers

EN-FR
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IEC 60748-4:1997

Edition 2.0 (1997-04-23)

Semiconductor devices - Integrated circuits - Part 4: Interface integrated circuits

EN-FR
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IEC 60748-4-1:1993

Edition 1.0 (1993-11-11)

Semiconductor devices - Integrated circuits - Part 4: Interface integrated circuits - Section 1: Blank detail specification for linear digital-to-analogue converters (DAC)

EN-FR
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IEC 60748-4-2:1993

Edition 1.0 (1993-11-11)

Semiconductor devices - Integrated circuits - Part 4: Interface integrated circuits - Section 2: Blank detail specification for linear analogue-to-digital converters (ADC)

EN-FR
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IEC 60748-4-3:2006

Edition 1.0 (2006-08-29)

Semiconductor devices - Integrated circuits - Part 4-3: Interface integrated circuits - Dynamic criteria for analogue-digital converters (ADC)

EN
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IEC 60748-5:1997

Edition 1.0 (1997-05-30)

Semiconductor devices - Integrated circuits - Part 5: Semicustom integrated circuits

EN-FR
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IEC 60748-11:1990

Edition 1.0 (1990-12-20)

Semiconductor devices - Integrated circuits - Part 11: Sectional specification for semiconductor integrated circuits excluding hybrid circuits

EN-FR
No preview
IEC 60748-11:1990/AMD1:1995

Edition 1.0 (1995-06-06)

Amendment 1 - Semiconductor devices - Integrated circuits - Part 11: Sectional specification for semiconductor integrated circuits excluding hybrid circuits

EN-FR
No preview
IEC 60748-11:1990/AMD2:1999

Edition 1.0 (1999-04-16)

Amendment 2 - Semiconductor devices - Integrated circuits - Part 11: Sectional specification for semiconductor integrated circuits excluding hybrid circuits

EN-FR
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IEC 60748-11-1:1992

Edition 1.0 (1992-04-01)

Semiconductor devices - Integrated circuits - Part 11-1: Internal visual examination for semiconductor integrated circuits excluding hybrid circuits

EN-FR, RU
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IEC 60748-20:1988

Edition 1.0 (1988-06-30)

Semiconductor devices. Integrated circuits. Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits

EN-FR
No preview
IEC 60748-20:1988/AMD1:1995

Edition 1.0 (1995-09-22)

Amendment 1 - Semiconductor devices. Integrated circuits. Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits

EN-FR
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IEC 60748-20-1:1994

Edition 1.0 (1994-03-01)

Semiconductor devices - Integrated circuits - Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits - Section 1: Requirements for internal visual examination

EN-FR
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IEC 60748-21:1997

Edition 2.0 (1997-04-10)

Semiconductor devices - Integrated circuits - Part 21: Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of qualification approval procedures

EN-FR
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IEC 60748-21-1:1997

Edition 2.0 (1997-04-10)

Semiconductor devices - Integrated circuits - Part 21-1: Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of qualification approva lprocedures

EN-FR
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IEC 60748-22:1997

Edition 2.0 (1997-04-10)

Semiconductor devices - Integrated circuits - Part 22: Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures

EN-FR
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IEC 60748-22-1:1997

Edition 2.0 (1997-04-10)

Semiconductor devices - Integrated circuits - Part 22-1: Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures

EN-FR
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IEC 60748-23-1:2002

Edition 1.0 (2002-05-15)

Semiconductor devices - Integrated circuits - Part 23-1: Hybrid integrated circuits and film structures - Manufacturing line certification - Generic specification

EN
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IEC 60748-23-2:2002

Edition 1.0 (2002-05-23)

Semiconductor devices - Integrated circuits - Part 23-2: Hybrid integrated circuits and film structures - Manufacturing line certification - Internal visual inspection and special tests

EN
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IEC 60748-23-3:2002

Edition 1.0 (2002-05-17)

Semiconductor devices - Integrated circuits - Part 23-3: Hybrid integrated circuits and film structures - Manufacturing line certification - Manufacturers' self-audit checklist and report

EN
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IEC 60748-23-4:2002

Edition 1.0 (2002-05-17)

Semiconductor devices - Integrated circuits - Part 23-4: Hybrid integrated circuits and film structures - Manufacturing line certification - Blank detail specification

EN
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IEC 60748-23-5:2003

Edition 1.0 (2003-10-03)

Semiconductor devices - Integrated circuits, Part 23-5: Hybrid integrated circuits and film structures - Manufacturing line certification - Procedure for qualification approval

EN
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IEC 61739:1996

Edition 1.0 (1996-10-30)

Integrated circuits - Part 1: Procedures for manufacturing line approval and quality management

EN-FR
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IEC 61943:1999

Edition 1.0 (1999-03-19)

Integrated circuits - Manufacturing line approval application guideline

EN-FR
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IEC TS 61944:2000

Edition 1.0 (2000-01-31)

Integrated circuits - Manufacturing line approval - Demonstration vehicles

EN-FR
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IEC TS 61945:2000

Edition 1.0 (2000-03-10)

Interated circuits - Manufacturing line approval - Methodology for technology and failure analysis

EN-FR
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IEC 61964:1999

Edition 1.0 (1999-04-30)

Integrated circuits - Memory devices pin configurations

EN-FR
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IEC 61967-1:2018

Edition 2.0 (2018-12-12)

Integrated circuits - Measurement of electromagnetic emissions - Part 1: General conditions and definitions

EN-FR
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IEC 61967-1:2018 RLV

Edition 2.0 (2018-12-12)

Integrated circuits - Measurement of electromagnetic emissions - Part 1: General conditions and definitions

EN
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IEC TR 61967-1-1:2015

Edition 2.0 (2015-08-28)

Integrated circuits - Measurement of electromagnetic emissions - Part 1-1: General conditions and definitions - Near-field scan data exchange format

EN
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IEC 61967-2:2005

Edition 1.0 (2005-09-29)

Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 2: Measurement of radiated emissions - TEM cell and wideband TEM cell method

EN-FR
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IEC TS 61967-3:2014

Edition 2.0 (2014-08-25)

Integrated circuits - Measurement of electromagnetic emissions - Part 3: Measurement of radiated emissions - Surface scan method

EN-FR
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IEC 61967-4:2021

Edition 2.0 (2021-03-16)

Integrated circuits - Measurement of electromagnetic emissions - Part 4: Measurement of conducted emissions - 1 ohm/150 ohm direct coupling method

EN-FR
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IEC 61967-4:2021 RLV

Edition 2.0 (2021-03-16)

Integrated circuits - Measurement of electromagnetic emissions - Part 4: Measurement of conducted emissions - 1 ohm/150 ohm direct coupling method

EN
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IEC TR 61967-4-1:2005

Edition 1.0 (2005-02-07)

Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 4-1: Measurement of conducted emissions - 1 Ω/150 Ω direct coupling method - Application guidance to IEC 61967-4

EN
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IEC 61967-5:2003

Edition 1.0 (2003-02-13)

Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 5: Measurement of conducted emissions - Workbench Faraday Cage method

EN-FR
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IEC 61967-6:2002+AMD1:2008 CSV

Edition 1.1 (2008-06-24)

Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 6: Measurement of conducted emissions - Magnetic probe method

EN-FR
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IEC 61967-6:2002

Edition 1.0 (2002-06-25)

Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 6: Measurement of conducted emissions - Magnetic probe method

EN-FR
No preview
IEC 61967-6:2002/COR1:2010

Edition 1.0 (2010-08-30)

Corrigendum 1 - Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 6: Measurement of conducted emissions - Magnetic probe method

EN-FR
No preview
IEC 61967-6:2002/AMD1:2008

Edition 1.0 (2008-03-12)

Amendment 1 - Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 6: Measurement of conducted emissions - Magnetic probe method

EN-FR
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IEC 61967-8:2011

Edition 1.0 (2011-08-11)

Integrated circuits - Measurement of electromagnetic emissions - Part 8: Measurement of radiated emissions - IC stripline method

EN-FR
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IEC 62132-1:2015

Edition 2.0 (2015-10-29)

Integrated circuits - Measurement of electromagnetic immunity - Part 1: General conditions and definitions

EN-FR
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IEC 62132-2:2010

Edition 1.0 (2010-03-30)

Integrated circuits - Measurement of electromagnetic immunity - Part 2: Measurement of radiated immunity - TEM cell and wideband TEM cell method

EN-FR
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IEC 62132-4:2006

Edition 1.0 (2006-02-21)

Integrated circuits - Measurement of electromagnetic immunity 150 kHz to 1 GHz - Part 4: Direct RF power injection method

EN-FR
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IEC 62132-5:2005

Edition 1.0 (2005-10-10)

Integrated circuits - Measurement of electromagnetic immunity, 150 kHz to 1 GHz - Part 5: Workbench Faraday cage method

EN-FR
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IEC 62132-8:2012

Edition 1.0 (2012-07-06)

Integrated circuits - Measurement of electromagnetic immunity - Part 8: Measurement of radiated immunity - IC stripline method

EN-FR
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IEC TS 62132-9:2014

Edition 1.0 (2014-08-21)

Integrated circuits - Measurement of electromagnetic immunity - Part 9: Measurement of radiated immunity - Surface scan method

EN-FR
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IEC TS 62215-2:2007

Edition 1.0 (2007-09-10)

Integrated circuits - Measurement of impulse immunity - Part 2: Synchronous transient injection method

EN
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IEC 62215-3:2013

Edition 1.0 (2013-07-17)

Integrated circuits - Measurement of impulse immunity - Part 3: Non-synchronous transient injection method

EN-FR
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IEC 62228-1:2018

Edition 1.0 (2018-01-09)

Integrated circuits - EMC evaluation of transceivers - Part 1: General conditions and definitions

EN-FR, EN
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IEC 62228-2:2016

Edition 1.0 (2016-11-18)

Integrated circuits - EMC evaluation of transceivers - Part 2: LIN transceivers

EN-FR
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IEC 62228-3:2019

Edition 1.0 (2019-03-11)

Integrated circuits - EMC evaluation of transceivers - Part 3: CAN transceivers

EN-FR
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IEC TS 62404:2007

Edition 1.0 (2007-02-20)

Logic digital integrated circuits - Specification for I/O interface model for integrated circuit (IMIC version 1.3)

EN
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IEC 62433-1:2019

Edition 1.0 (2019-03-08)

EMC IC modelling - Part 1: General modelling framework

EN-FR, EN
No preview
IEC 62433-1:2019/COR1:2020

Edition 1.0 (2020-07-10)

Corrigendum 1 - EMC IC modelling - Part 1: General modelling framework

EN
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IEC 62433-2:2017

Edition 2.0 (2017-01-27)

EMC IC modelling - Part 2: Models of integrated circuits for EMI behavioural simulation - Conducted emissions modelling (ICEM-CE)

EN-FR
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IEC TR 62433-2-1:2010

Edition 1.0 (2010-10-05)

EMC IC modelling - Part 2-1: Theory of black box modelling for conducted emission

EN-FR
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IEC 62433-3:2017

Edition 1.0 (2017-01-27)

EMC IC modelling - Part 3: Models of integrated circuits for EMI behavioural simulation - Radiated emissions modelling (ICEM-RE)

EN-FR
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IEC 62433-4:2016

Edition 1.0 (2016-05-25)

EMC IC modelling - Part 4: Models of integrated circuits for RF immunity behavioural simulation - Conducted immunity modelling (ICIM-CI)

EN-FR
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IEC 62433-6:2020

Edition 1.0 (2020-09-22)

EMC IC modelling - Part 6: Models of integrated circuits for pulse immunity behavioural simulation - Conducted pulse immunity modelling (ICIM-CPI)

EN-FR
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IEC 63011-1:2018

Edition 1.0 (2018-11-28)

Integrated circuits - Three dimensional integrated circuits - Part 1: Terminology

EN-FR
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IEC 63011-2:2018

Edition 1.0 (2018-11-28)

Integrated circuits - Three dimensional integrated circuits - Part 2: Alignment of stacked dies having fine pitch interconnect

EN-FR
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IEC 63011-3:2018

Edition 1.0 (2018-11-28)

Integrated circuits - Three dimensional integrated circuits - Part 3: Model and measurement conditions of through-silicon via

EN-FR