SC 47A

Edition 2.0 (2002-05-08)

Semiconductor devices - Integrated circuits - Part 1: General

Edition 2.0 (1997-12-22)

Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits

Edition 1.0 (1991-10-01)

Semiconductor devices - Integrated circuits - Part 2-1: Digital integrated circuits - Blank detail specification for bipolar monolithic digital integrated circuit gates (excluding uncommitted logic arrays)

Edition 1.0 (1992-02-29)

Semiconductor devices. Integrated circuits - Part 2: Digital integrated circuits - Section two: Family specification for HCMOS digital integrated circuits, series 54/74 HC, 54/74 HCT, 54/74 HCU

Edition 1.0 (1994-06-07)

Amendment 1 - Semiconductor devices. Integrated circuits - Part 2: Digital integrated circuits - Section two: Family specification for HCMOS digital integrated circuits, series 54/74 HC, 54/74 HCT, 54/74 HCU

Edition 1.0 (1992-02-20)

Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits - Section three: Blank detail specification for HCMOS digital integrated circuits (series 54/74 HC, 54/74 HCT, 54/74 HCU)

Edition 1.0 (1992-01-30)

Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits - Section four: Family specification for complementary MOS digital integrated circuits, series 4000 B and 4000 UB

Edition 1.0 (1992-01-31)

Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits - Section five: Blank detail specification for complementary MOS digital integrated circuits (series 4000 B and 4000 UB)

Edition 1.0 (1991-11-15)

Semiconductor devices. Integrated circuits - Part 2: Digital integrated circuits - Section Six: Blank detail specification for microprocessor integrated circuits

Edition 1.0 (1992-10-23)

Semiconductor devices. Integrated circuits - Part 2: Digital integrated circuits - Section seven: Blank detail specification for integrated circuit fusible-link programmable bipolar read-only memories

Edition 1.0 (1993-07-29)

Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits - Section Eight: Blank detail specification for integrated circuit static read/write memories

Edition 1.0 (1994-12-21)

Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits - Section 9: Blank detail specification for MOS ultraviolet light erasable electrically programmable read-only memories

Edition 1.0 (1994-12-21)

Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits - Section 10: Blank detail specification for integrated circuit dynamic read/write memories

Edition 1.0 (1999-04-12)

Semiconductor devices - Integrated circuits - Part 2-11: Digital integrated circuits - Blank detail specification for single supply integrated circuit, electrically erasable, and programmable read-only memory

Edition 1.0 (2001-01-30)

Semiconductor devices - Integrated circuits - part2-12: Digital integrated circuits - Blank detail specification for programmable logic devices (PLDs)

Edition 2.0 (2008-02-27)

Semiconductor devices - Integrated circuits - Part 2-20: Digital integrated circuits - Family specification - Low voltage integrated circuits

Edition 1.0 (1986-01-01)

Semiconductor devices - Integrated circuits - Part 3: Analogue integrated circuits

Edition 1.0 (1991-11-15)

Amendment 1 - Semiconductor devices. Integrated circuits. Part 3: Analogue integrated circuits

Edition 1.0 (1994-02-08)

Amendment 2 - Semiconductor devices. Integrated circuits. Part 3: Analogue integrated circuits

Edition 1.0 (1996-06-11)

Corrigendum 1 to Amendment 2 - Semiconductor devices. Integrated circuits. Part 3: Analogue integrated circuits

Edition 1.0 (1991-08-02)

Semiconductor devices. Integrated circuits - Part 3: Analogue integrated circuits - Section one: Blank detail specification for monolithic integrated operational amplifiers

Edition 2.0 (1997-04-23)

Semiconductor devices - Integrated circuits - Part 4: Interface integrated circuits

Edition 1.0 (1993-11-11)

Semiconductor devices - Integrated circuits - Part 4: Interface integrated circuits - Section 1: Blank detail specification for linear digital-to-analogue converters (DAC)

Edition 1.0 (1993-11-11)

Semiconductor devices - Integrated circuits - Part 4: Interface integrated circuits - Section 2: Blank detail specification for linear analogue-to-digital converters (ADC)

Edition 1.0 (2006-08-29)

Semiconductor devices - Integrated circuits - Part 4-3: Interface integrated circuits - Dynamic criteria for analogue-digital converters (ADC)

Edition 1.0 (1997-05-30)

Semiconductor devices - Integrated circuits - Part 5: Semicustom integrated circuits

Edition 1.0 (1990-12-20)

Semiconductor devices - Integrated circuits - Part 11: Sectional specification for semiconductor integrated circuits excluding hybrid circuits

Edition 1.0 (1995-06-06)

Amendment 1 - Semiconductor devices - Integrated circuits - Part 11: Sectional specification for semiconductor integrated circuits excluding hybrid circuits

Edition 1.0 (1999-04-16)

Amendment 2 - Semiconductor devices - Integrated circuits - Part 11: Sectional specification for semiconductor integrated circuits excluding hybrid circuits

Edition 1.0 (1992-04-01)

Semiconductor devices - Integrated circuits - Part 11-1: Internal visual examination for semiconductor integrated circuits excluding hybrid circuits

Edition 1.0 (1988-06-30)

Semiconductor devices. Integrated circuits. Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits

Edition 1.0 (1995-09-22)

Amendment 1 - Semiconductor devices. Integrated circuits. Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits

Edition 1.0 (1994-03-01)

Semiconductor devices - Integrated circuits - Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits - Section 1: Requirements for internal visual examination

Edition 2.0 (1997-04-10)

Semiconductor devices - Integrated circuits - Part 21: Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of qualification approval procedures

Edition 2.0 (1997-04-10)

Semiconductor devices - Integrated circuits - Part 21-1: Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of qualification approva lprocedures

Edition 2.0 (1997-04-10)

Semiconductor devices - Integrated circuits - Part 22: Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures

Edition 2.0 (1997-04-10)

Semiconductor devices - Integrated circuits - Part 22-1: Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures

Edition 1.0 (2002-05-15)

Semiconductor devices - Integrated circuits - Part 23-1: Hybrid integrated circuits and film structures - Manufacturing line certification - Generic specification

Edition 1.0 (2002-05-23)

Semiconductor devices - Integrated circuits - Part 23-2: Hybrid integrated circuits and film structures - Manufacturing line certification - Internal visual inspection and special tests

Edition 1.0 (2002-05-17)

Semiconductor devices - Integrated circuits - Part 23-3: Hybrid integrated circuits and film structures - Manufacturing line certification - Manufacturers' self-audit checklist and report

Edition 1.0 (2002-05-17)

Semiconductor devices - Integrated circuits - Part 23-4: Hybrid integrated circuits and film structures - Manufacturing line certification - Blank detail specification

Edition 1.0 (2003-10-03)

Semiconductor devices - Integrated circuits, Part 23-5: Hybrid integrated circuits and film structures - Manufacturing line certification - Procedure for qualification approval

Edition 1.0 (1996-10-30)

Integrated circuits - Part 1: Procedures for manufacturing line approval and quality management

Edition 1.0 (1999-03-19)

Integrated circuits - Manufacturing line approval application guideline

Edition 1.0 (2000-01-31)

Integrated circuits - Manufacturing line approval - Demonstration vehicles

Edition 1.0 (2000-03-10)

Interated circuits - Manufacturing line approval - Methodology for technology and failure analysis

Edition 1.0 (1999-04-30)

Integrated circuits - Memory devices pin configurations

Edition 2.0 (2018-12-12)

Integrated circuits - Measurement of electromagnetic emissions - Part 1: General conditions and definitions

Edition 2.0 (2018-12-12)

Integrated circuits - Measurement of electromagnetic emissions - Part 1: General conditions and definitions

Edition 2.0 (2015-08-28)

Integrated circuits - Measurement of electromagnetic emissions - Part 1-1: General conditions and definitions - Near-field scan data exchange format

Edition 1.0 (2005-09-29)

Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 2: Measurement of radiated emissions - TEM cell and wideband TEM cell method

Edition 2.0 (2014-08-25)

Integrated circuits - Measurement of electromagnetic emissions - Part 3: Measurement of radiated emissions - Surface scan method

Edition 2.0 (2021-03-16)

Integrated circuits - Measurement of electromagnetic emissions - Part 4: Measurement of conducted emissions - 1 ohm/150 ohm direct coupling method

Edition 2.0 (2021-03-16)

Integrated circuits - Measurement of electromagnetic emissions - Part 4: Measurement of conducted emissions - 1 ohm/150 ohm direct coupling method

Edition 1.0 (2005-02-07)

Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 4-1: Measurement of conducted emissions - 1 Ω/150 Ω direct coupling method - Application guidance to IEC 61967-4

Edition 1.0 (2003-02-13)

Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 5: Measurement of conducted emissions - Workbench Faraday Cage method

Edition 1.1 (2008-06-24)

Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 6: Measurement of conducted emissions - Magnetic probe method

Edition 1.0 (2002-06-25)

Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 6: Measurement of conducted emissions - Magnetic probe method

Edition 1.0 (2010-08-30)

Corrigendum 1 - Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 6: Measurement of conducted emissions - Magnetic probe method

Edition 1.0 (2008-03-12)

Amendment 1 - Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 6: Measurement of conducted emissions - Magnetic probe method

Edition 1.0 (2011-08-11)

Integrated circuits - Measurement of electromagnetic emissions - Part 8: Measurement of radiated emissions - IC stripline method

Edition 2.0 (2015-10-29)

Integrated circuits - Measurement of electromagnetic immunity - Part 1: General conditions and definitions

Edition 1.0 (2010-03-30)

Integrated circuits - Measurement of electromagnetic immunity - Part 2: Measurement of radiated immunity - TEM cell and wideband TEM cell method

Edition 1.0 (2006-02-21)

Integrated circuits - Measurement of electromagnetic immunity 150 kHz to 1 GHz - Part 4: Direct RF power injection method

Edition 1.0 (2005-10-10)

Integrated circuits - Measurement of electromagnetic immunity, 150 kHz to 1 GHz - Part 5: Workbench Faraday cage method

Edition 1.0 (2012-07-06)

Integrated circuits - Measurement of electromagnetic immunity - Part 8: Measurement of radiated immunity - IC stripline method

Edition 1.0 (2014-08-21)

Integrated circuits - Measurement of electromagnetic immunity - Part 9: Measurement of radiated immunity - Surface scan method

Edition 1.0 (2007-09-10)

Integrated circuits - Measurement of impulse immunity - Part 2: Synchronous transient injection method

Edition 1.0 (2013-07-17)

Integrated circuits - Measurement of impulse immunity - Part 3: Non-synchronous transient injection method

Edition 1.0 (2018-01-09)

Integrated circuits - EMC evaluation of transceivers - Part 1: General conditions and definitions

Edition 1.0 (2016-11-18)

Integrated circuits - EMC evaluation of transceivers - Part 2: LIN transceivers

Edition 1.0 (2019-03-11)

Integrated circuits - EMC evaluation of transceivers - Part 3: CAN transceivers

Edition 1.0 (2007-02-20)

Logic digital integrated circuits - Specification for I/O interface model for integrated circuit (IMIC version 1.3)

Edition 1.0 (2019-03-08)

EMC IC modelling - Part 1: General modelling framework

Edition 1.0 (2020-07-10)

Corrigendum 1 - EMC IC modelling - Part 1: General modelling framework

Edition 2.0 (2017-01-27)

EMC IC modelling - Part 2: Models of integrated circuits for EMI behavioural simulation - Conducted emissions modelling (ICEM-CE)

Edition 1.0 (2010-10-05)

EMC IC modelling - Part 2-1: Theory of black box modelling for conducted emission

Edition 1.0 (2017-01-27)

EMC IC modelling - Part 3: Models of integrated circuits for EMI behavioural simulation - Radiated emissions modelling (ICEM-RE)

Edition 1.0 (2016-05-25)

EMC IC modelling - Part 4: Models of integrated circuits for RF immunity behavioural simulation - Conducted immunity modelling (ICIM-CI)

Edition 1.0 (2020-09-22)

EMC IC modelling - Part 6: Models of integrated circuits for pulse immunity behavioural simulation - Conducted pulse immunity modelling (ICIM-CPI)

Edition 1.0 (2018-11-28)

Integrated circuits - Three dimensional integrated circuits - Part 1: Terminology

Edition 1.0 (2018-11-28)

Integrated circuits - Three dimensional integrated circuits - Part 2: Alignment of stacked dies having fine pitch interconnect

Edition 1.0 (2018-11-28)

Integrated circuits - Three dimensional integrated circuits - Part 3: Model and measurement conditions of through-silicon via