SC 47D

Semiconductor devices packaging

 
export to xls file

SC 47D Project files (209)

Project

Reference

Current

Stage

Language

Frcst

Date

CLC

Document

Reference

Downloads
PNW 191-6/AMD1/FRAG1 ED1

Supplement to IEC 191-6 - Recommended values for dual-in-line packages of Form E

DEL
  • DEL
  • Deleted items
EN-FR U
PNW 191-6/AMD1/FRAG2 ED1

Supplement to IEC 191-6 - Recommended values for QFPs of form E

DEL
  • DEL
  • Deleted items
EN-FR U
PWI TR 47D-1 ED1

Future IEC TR 60191-7 Ed.1: Requirements to design electronics devices using thermal characteristics of semiconductor packages

PWI
  • PWI
  • Preliminary Work Item
EN U
PWI TR 47D-2 ED1

Future IEC TR 60191-7-3 Ed.1: Proposal of new thermal model format for semiconductor packages

PWI
  • PWI
  • Preliminary Work Item
EN U
PWI TR 47D-3 ED1

Future IEC TR 60191-7-5 Ed.1: 3D semiconductor package model for precise thermal analysis (JTAM)

PWI
  • PWI
  • Preliminary Work Item
EN U
PWI TR 47D-4 ED1

Future IEC TR 60191-7-1 Ed.1: A new transient thermal model of semiconductor packages (D2ELPHI)

PWI
  • PWI
  • Preliminary Work Item
EN U
PWI TR 47D-5 ED1

Future IEC TR 60191-7-2 Ed.1: Thermal conductivity measurement method and samples for electronic components

PWI
  • PWI
  • Preliminary Work Item
EN U
PWI TR 47D-6 ED1

Future IEC TR 60191-7-4 Ed.1: Printed circuit board specifications to evaluate thermal characteristics of fine pitch semiconductor packages

PWI
  • PWI
  • Preliminary Work Item
EN U
PNW 47D-213 ED1

The individual standard for 48 pins plastic fine pitch ball grid array (P-FBGA), 0,75 & 0,65 mm terminal pitch (Intended for inclusion into IEC 191-2)

DEL
  • DEL
  • Deleted items
EN U 47D/213/NP
PNW 47D-252 ED1

BGA (Ball Grid Array) package measuring method

DEL
  • DEL
  • Deleted items
EN U 47D/252/NP PDF file 787 kB
PNW 47D-503 ED1

Proposed new package outline, 3/4-land SMD

DEL
  • DEL
  • Deleted items
EN U 47D/503/NP PDF file 101 kB
PNW 47D-539 ED1

Proposed new package outline, DDRII SDRAM Family, 1,00 mm contact pitch

DEL
  • DEL
  • Deleted items
EN U 47D/539/NP PDF file 350 kB
PNW 47D-540 ED1

Proposed new package outline, Plastic, small outline family, 1,27 mm pitch, 7,5 mm body width and 14, 16, 18, 20, 24 and 28 lead counts

DEL
  • DEL
  • Deleted items
EN U 47D/540/NP PDF file 204 kB
PNW 47D-542 ED1

Proposed new package outline, Plastic small outline family, 1,27 mm pitch, 3,9 mm body width, 8, 14 and 16 leads

DEL
  • DEL
  • Deleted items
EN U 47D/542/NP PDF file 201 kB
PNW 47D-543 ED1

Proposed new package outline, Plastic small outline family, 25 mil pitch, 150 mil body width, 14, 16, 18, 20, 24 and 28 leads

DEL
  • DEL
  • Deleted items
EN U 47D/543/NP PDF file 257 kB
PNW 47D-652 ED1

Design guide for semiconductor packages - Ball Grid Array Package (BGA)

DEL
  • DEL
  • Deleted items
EN U 47D/652/NP PDF file 698 kB
PNW 47D-674 ED1

Proposed new package outline - 13 Pin reduced size MultiMediaCard (MMC) outline MMCmobile 18 x 24 x 1,4 mm

DEL
  • DEL
  • Deleted items
EN U 47D/674/NP PDF file 230 kB
PNW 47D-675 ED1

Proposed new package outline - 10 pin micro size Multimedia Card (MMC) outline MMCmicro 14 x 12 x 1,1 mm (Intended to become IEC 60191-2/F66, if approved)

DEL
  • DEL
  • Deleted items
EN U 47D/675/NP PDF file 180 kB
PNW 47D-676 ED1

Proposed new package outline - 13 Pin full size Multimedia Card (MMC) Outline MMCplus 32 x 24 x 1,4 mm (Intended to become IEC 60191-2/F67, if approved)

DEL
  • DEL
  • Deleted items
EN U 47D/676/NP PDF file 220 kB
PNW 47D-860 ED1

Standardization of semiconductor mechanical test methodology - Package warpage test sample preparation method by using BGA solder ball removal tool

DEL
  • DEL
  • Deleted items
EN U 47D/860/NP PDF file 812 kB
PNW 47D-866 ED1

Future IEC 60191-7 Ed.1: Package thermal characteristics guideline in semiconductor products

DEL
  • DEL
  • Deleted items
EN U 47D/866/NP PDF file 1617 kB
PNW 47D-894

Future IEC 60191-8: Mechanical standardization of semiconductor devices – Part 8: Requirements to Semiconductor Devices Packaging Materials from the Environment point of View - Low Cl and Br Molding Compound

DEL
  • DEL
  • Deleted items
EN 2020-12 Y 47D/894/NP PDF file 1097 kB
PNW 47D-895

Future IEC 60191-8: Mechanical standardization of semiconductor devices – Part 8: Requirements to Semiconductor Devices Packaging Materials from the Environment point of View - Low Cl and Br Molding Compound

DEL
  • DEL
  • Deleted items
EN 2020-12 Y 47D/895/NP PDF file 246 kB
PNW 47D-919

Part model guideline for electronic-device packages – Part 1: XML requirements

DEL
  • DEL
  • Deleted items
EN 2023-03 U 47D/919/NP PDF file 1192 kB
PNW 47D-869A ED1

Future IEC 60191-X Ed.1: Requirement to semiconductor devices packaging materials from the environment point of view: Low Halogen Molding Compound

DEL
  • DEL
  • Deleted items
EN U 47D/869A/NP PDF file 252 kB
IEC 60191-1:2018 ED3

Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices

PPUB
  • PPUB
  • Publication issued
EN 2018-02 Y Webstore
IEC 60191-1:2007 ED2

Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices

DELPUB
  • DELPUB
  • Publication Deleted
EN-FR 2007-01 Y 47D/678/FDIS
MERGED
  • MERGED
  • Publication merged with EN version
FR 2012-03 U
IEC 60191-1:1966 ED1

Mechanical standardization of semiconductor devices. Part 1: Preparation of drawings of semiconductor devices

DELPUB
  • DELPUB
  • Publication Deleted
EN-FR U
IEC 60191-2 ED2

Restructuring of package outlines presently contained in IEC 191-2

DEL
  • DEL
  • Deleted items
EN U 47D/125/NP
IEC 60191-2/FRAG2 ED2

Tape ball grid array package, 0,6 mm ball diameter family (intended for inclusion into IEC 60191-2)

DEL
  • DEL
  • Deleted items
EN U 47D/343/CC PDF file 61 kB
IEC 60191-2/FRAG3 ED2

48 pins P-FBGA (Plastic Fine pitch Ball Grid Array), 0.75 and 0.65 mm pitch , face down (intended for inclusion into IEC 191-2)

DEL
  • DEL
  • Deleted items
EN U 47D/210/NP
IEC 60191-2/FRAG4 ED2

32 and 48 pins P-FBGA (Plastic Fine pitch Ball Grid Array), 0,8 mm pitch (Intended for inclusion into IEC 191-2)

DEL
  • DEL
  • Deleted items
EN N 47D/211/NP
IEC 60191-2:1966 ED1

Mechanical standardization of semiconductor devices. Part 2: Dimensions

PPUB
  • PPUB
  • Publication issued
EN-FR U Webstore
IEC 60191-2/FRAG1 ED1

Power semiconductor outline Form B, Types A and B, for inclusion into IEC 191-2

DEL
  • DEL
  • Deleted items
EN U 47D/56/NP
IEC 60191-2/FRAG2 ED1

Inclusion of an additional drawing of integrated circuit in the family drawing A50 of IEC 191-2

DEL
  • DEL
  • Deleted items
EN-FR U
IEC 60191-2/FRAG3 ED1

General rules for HSOP (Heat sink small outline package) - Supplement to IEC 191-2

DEL
  • DEL
  • Deleted items
EN U
IEC 60191-2/FRAG4 ED1

Tape ball grid array (TBGA) family (Intended for inclusion into 60191-2)

MERGED
  • MERGED
  • Fragment merged
EN U 47D/269/FDIS
IEC 60191-2/FRAG5 ED1

Drawing family of rectangular plastic leaded chip carrier (PLCCs) packages - Introduction of the outline family 124E in IEC 191-2

DEL
  • DEL
  • Deleted items
EN-FR N
IEC 60191-2/FRAG10 ED1

Mechanical standardization power devices. Proposal for tablet case outline drawings for two families to be introduced in IEC 191-2 for future use

DEL
  • DEL
  • Deleted items
EN U 47(SEC.)/1136/CD
IEC 60191-2/FRAG11 ED1

Ceramic quadrature flat packages, square type, for surface mounting - Introduction of the outline families 130E and 131E in IEC 191-2

DEL
  • DEL
  • Deleted items
EN-FR U
IEC 60191-2/FRAG16 ED1

Recommended values for QFP, 0.30, 0.40, 0.50, 0.65, 0.80 and 1.00 mm lead spacing, for inclusion into IEC 191-2

DEL
  • DEL
  • Deleted items
EN U 47D(SEC.)/29/CD
IEC 60191-2/FRAG17 ED1

Inclusion of a heat sink small outline (HSOP) family, similar to SOP family 075E contained in IEC 191-2

DEL
  • DEL
  • Deleted items
EN U 47D/142/CC
IEC 60191-2/FRAG24 ED1

Plastic small outline family, J-Lead (P-SOJ), 10,16 mm body family (to be published as outline 141E-d)

MERGED
  • MERGED
  • Fragment merged
EN-FR U 47D/283/FDIS
IEC 60191-2/FRAG25 ED1

Plastic thin small outline package P-TSOP II, 7,62 mm body family

MERGED
  • MERGED
  • Fragment merged
EN-FR U 47D/284/FDIS
IEC 60191-2/FRAG26 ED1

P-TSOP II, 10,16 mm body family (if approved, to be included in outline 139 E)

MERGED
  • MERGED
  • Fragment merged
EN-FR U 47D/285/FDIS
IEC 60191-2/FRAG28 ED1

HSOP reverse bend, heatslug up

MERGED
  • MERGED
  • Fragment merged
EN-FR U 47D/286/FDIS
IEC 60191-2/FRAG29 ED1

Plastic thin small outline package J-Lead (P-TSOJ), 7,62 mm body family - (Supplement to IEC 191-2)

DEL
  • DEL
  • Deleted items
EN U 47D/87/NP
IEC 60191-2/FRAG31 ED1

Proposal for a tape ball grid array, 0.75 mm ball diameter family (intended for inclusion into IEC 60191-2) as outline 146E

MERGED
  • MERGED
  • Fragment merged
EN U 47D/256/CDV
IEC 60191-2/FRAG33 ED1

Ceramic thin LGA, 1,0 mm pitch outline family

MERGED
  • MERGED
  • Fragment merged
EN U 47D/399/FDIS
IEC 60191-2/FRAG35 ED1

4-leaded SMD (Body size DxE:2.00x1.25 mm) (for inclusion into IEC 191-2)

MERGED
  • MERGED
  • Fragment merged
EN U 47D/156/NP
IEC 60191-2/FRAG36 ED1

Surface Vertical Packages (SVP) - Outline family 155E

MERGED
  • MERGED
  • Fragment merged
EN U 47D/420/FDIS
IEC 60191-2/FRAG37 ED1

P-VSON (Plastic very small outline - Non-leaded packages) (will be published as Outline 164E-a)

MERGED
  • MERGED
  • Fragment merged
EN Y 47D/448/FDIS
IEC 60191-2/FRAG39 ED1

Proposal for 0,8 mm pitch P-FBGA (plastic fine pitch ball grid array)

DEL
  • DEL
  • Deleted items
EN U 47D/214/NP
IEC 60191-2/FRAG42 ED1

Proposal for a supplement of the rectangular type of QFN outline drawings to the outline family of 119E

MERGED
  • MERGED
  • Fragment merged
EN N 47D/436/FDIS
IEC 60191-2/FRAG43 ED1

Ceramic thin LGA, 0,8 mm pitch outline family

MERGED
  • MERGED
  • Fragment merged
EN U 47D/400/FDIS
IEC 60191-2/FRAG44 ED1

New package outline - Thin fine pitch ball grid array family (rectangular/square)

MERGED
  • MERGED
  • Fragment merged
EN U 47D/317/NP PDF file 321 kB
IEC 60191-2/FRAG46 ED1

Small Outline J-Lead Package (SOJ), 0.80 mm Pitch (Outline 163E)

MERGED
  • MERGED
  • Fragment merged
EN N 47D/481/FDIS
IEC 60191-2/FRAG47 ED1

Proposal for 3-Leaded SMD (Body Size D x E : 2.9 x 1.5 mm) Outline Family 162E

MERGED
  • MERGED
  • Fragment merged
EN N 47D/440/FDIS
IEC 60191-2/FRAG50 ED1

Plastic enhanced, low profile quad flat pack (HLQFP) outline family, heat slug down, L-PQFP-G (Outline 151E-a)

MERGED
  • MERGED
  • Fragment merged
EN N 47D/486/FDIS
IEC 60191-2/FRAG51 ED1

Plastic enhanced, thin profile quad flat pack (HTQFP) outline family, heat slug up, T-PQFP-G (Outline 152E)

MERGED
  • MERGED
  • Fragment merged
EN N 47D/487/FDIS
IEC 60191-2/FRAG52 ED1

Plastic enhanced, thin profile quad flat pack (HTQFP) outline family, heat slug down, T-PQFP-G (Outline 153E)

MERGED
  • MERGED
  • Fragment merged
EN N 47D/488/FDIS
IEC 60191-2/FRAG55 ED1

Small Power Package with 17 Pins (published as Outline 168E)

MERGED
  • MERGED
  • Fragment merged
EN N 47D/588/FDIS
IEC 60191-2/FRAG58 ED1

Proposed new package outline for P-DHVQFN family. (Plastic Dual in-line compatible Heatsink Very thin Quad Flat Pack No Leads)

DEL
  • DEL
  • Deleted items
EN U 47D/523/NP PDF file 1260 kB
IEC 60191-2/FRAG62 ED1

Amendment 17 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

MERGED
  • MERGED
  • Fragment merged
EN 2008-05 N 47D/712/FDIS
IEC 60191-2/FRAG64 ED1

Proposed new package outline - Small outline package (SOT) 3-, 5- and 6-Lead SMD (to be published as 182E outline)

CAN
  • CAN
  • Draft Cancelled
EN 2008-08 N 47D/665C/CC PDF file 361 kB
IEC 60191-2/FRAG67 ED1

Proposed new package outline - large power package with 6 load terminals, P-UMP-A6. To be published as outline 185B, if approved.

MERGED
  • MERGED
  • Fragment merged
EN-FR 2013-04 N 47D/817A/CDV PDF file 203 kB
PDF file 660 kB
IEC 60191-2/FRAG68 ED1

Proposed new package outline - flange mounted package with through hole leads, P-SFM-T3 - To be published as outline 186F. if approved.

MERGED
  • MERGED
  • Fragment merged
EN-FR 2013-04 N 47D/818/CDV PDF file 377 kB
PDF file 532 kB
IEC 60191-2/FRAG69 ED1

Proposed new package outline - flange mount package with flat leads, P-SFM-F8 - To be published as outline 187E, if approved.

MERGED
  • MERGED
  • Fragment merged
EN 2013-04 N 47D/819/CDV PDF file 330 kB
PDF file 556 kB
IEC 60191-2/FRAG71 ED1

Proposed new package outline - P-ZMP-P89

MERGED
  • MERGED
  • Fragment merged
EN 2018-04 N 47D/864/CDV 177 kB
PDF file 595 kB
IEC 60191-2:1966/AMD1:2001 ED1

Amendment 1 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

PPUB
  • PPUB
  • Publication issued
EN U Webstore
IEC 60191-2/AMD1/FRAG1 ED1

Inclusion of three drawings for power modules - Supplement to IEC 191-2

MERGED
  • MERGED
  • Fragment merged
EN-FR U 47D(SEC.)/7/CDV
IEC 60191-2/AMD1/FRAG3 ED1

Additional outline drawing of power semiconductor device, to be included in IEC 191-2

MERGED
  • MERGED
  • Fragment merged
EN-FR U
IEC 60191-2/AMD1/FRAG4 ED1

Integrated circuits - Drawing family of leaded packages of Form E (Quad Flat packages), to be included in IEC 191-2

MERGED
  • MERGED
  • Fragment merged
EN-FR U
IEC 60191-2/AMD1/FRAG5 ED1

Amendment to Document 47(C.O.)1148: Inclusion of the outline drawings 121E and 122E in IEC 191-2

MERGED
  • MERGED
  • Fragment merged
EN-FR U
IEC 60191-2/AMD1/FRAG8 ED1

Surface mounted cylindrical diodes - Introduction of the outline family 100H in IEC 191-2

MERGED
  • MERGED
  • Fragment merged
EN-FR U
IEC 60191-2/AMD1/FRAG9 ED1

Surface mounted packages - Introduction of the outline family 129E in IEC 191-2

MERGED
  • MERGED
  • Fragment merged
EN-FR U
IEC 60191-2/AMD1/FRAG10 ED1

Dual in line packages for 0.07 inches pitch (1.778 mm) - Introduction of the outline family 101G in IEC 191-2

MERGED
  • MERGED
  • Fragment merged
EN-FR U
IEC 60191-2/AMD1/FRAG12 ED1

Amendment to IEC 191-2 - Single-ended package outline of Form A

MERGED
  • MERGED
  • Fragment merged
EN-FR U
IEC 60191-2:1966/AMD2:2001 ED1

Amendment 2 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

PPUB
  • PPUB
  • Publication issued
EN U Webstore
IEC 60191-2/AMD2/FRAG14 ED1

Standard outlines for non-cylindrical surface-mount semiconductors, to be added to IEC 191-2

MERGED
  • MERGED
  • Fragment merged
EN-FR U 47(SEC.)/1237/CDV
IEC 60191-2/AMD2/FRAG15 ED1

Inclusion in IEC 191-2 of a wire-ended diode package (small signal diode)

MERGED
  • MERGED
  • Fragment merged
EN U 47D(SEC.)/30/CD
IEC 60191-2/AMD2/FRAG18 ED1

Flange-mounted header family (peripheral terminals) - 0.100 spacing for inclusion in IEC 191-2

MERGED
  • MERGED
  • Fragment merged
EN U 47D(U.K.)/1/NP
IEC 60191-2:1966/AMD3:2001 ED1

Amendment 3 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

PPUB
  • PPUB
  • Publication issued
EN N Webstore
IEC 60191-2:1966/AMD4:2001 ED1

Amendment 4 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

PPUB
  • PPUB
  • Publication issued
EN N Webstore
IEC 60191-2:1966/AMD5:2002 ED1

Amendment 5 - Mechanical standardization of semiconductor devices. Part 2: Dimensions

PPUB
  • PPUB
  • Publication issued
EN-FR N Webstore
IEC 60191-2:1966/AMD6:2002 ED1

Amendment 6 - Mechanical standardization of semiconductor devices. Part 2: Dimensions

PPUB
  • PPUB
  • Publication issued
EN-FR N Webstore
IEC 60191-2:1966/AMD7:2002 ED1

Amendment 7 - Mechanical standardization of semiconductor devices. Part 2: Dimensions

PPUB
  • PPUB
  • Publication issued
EN-FR N Webstore
IEC 60191-2:1966/AMD8:2003 ED1

Amendment 8 - Mechanical standardization of semiconductor devices. Part 2: Dimensions

PPUB
  • PPUB
  • Publication issued
EN N Webstore
IEC 60191-2:1966/AMD9:2003 ED1

Amendment 9 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

PPUB
  • PPUB
  • Publication issued
EN-FR N Webstore
MERGED
  • MERGED
  • Fragment merged
EN-FR U
IEC 60191-2:1966/AMD10:2004 ED1

Amendment 10 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

PPUB
  • PPUB
  • Publication issued
EN N Webstore
IEC 60191-2:1966/AMD11:2004 ED1

Amendment 11 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

PPUB
  • PPUB
  • Publication issued
EN-FR N Webstore
IEC 60191-2:1966/AMD12:2006 ED1

Amendment 12 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

PPUB
  • PPUB
  • Publication issued
EN-FR 2006-03 N Webstore
IEC 60191-2:1966/AMD13:2006 ED1

Amendment 13 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

PPUB
  • PPUB
  • Publication issued
EN-FR 2006-09 N Webstore
IEC 60191-2:1966/AMD14:2006 ED1

Amendment 14 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

PPUB
  • PPUB
  • Publication issued
EN-FR 2006-09 N Webstore
IEC 60191-2:1966/AMD15:2006 ED1

Amendment 15 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

PPUB
  • PPUB
  • Publication issued
EN-FR 2007-09 N Webstore
IEC 60191-2:1966/AMD16:2007 ED1

Amendment 16 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

PPUB
  • PPUB
  • Publication issued
EN-FR 2007-09 N Webstore
IEC 60191-2:1966/AMD17:2008 ED1

Amendment 17 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

PPUB
  • PPUB
  • Publication issued
EN-FR 2008-05 N Webstore
IEC 60191-2:1966/AMD18:2011 ED1

Amendment 18 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

PPUB
  • PPUB
  • Publication issued
EN-FR 2011-10 N Webstore
IEC 60191-2:1966/AMD19:2012 ED1

Amendment 19 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

PPUB
  • PPUB
  • Publication issued
EN-FR 2012-09 N Webstore
IEC 60191-2:1966/AMD20:2018 ED1

Amendment 20 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

PPUB
  • PPUB
  • Publication issued
EN 2018-05 N Webstore
IEC 60191-2:1966/AMD21:2020 ED1

Amendment 21 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

PPUB
  • PPUB
  • Publication issued
EN 2020-02 N Webstore
IEC 60191-3:1999 ED2

Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits

PPUB
  • PPUB
  • Publication issued
EN-FR Y Webstore
IEC 60191-3/FRAG1 ED2

Mold flash, interlead flash, gate burrs, and protrusion for plastic packages

MERGED
  • MERGED
  • Fragment merged
EN-FR Y 47D/165/CDV
IEC 60191-3/FRAG2 ED2

Definition of mold flash, interlead flash, gate burrs and protrusions for plastic packages, to be introduced into IEC 191-2

MERGED
  • MERGED
  • Fragment merged
EN Y 47D(SEC.)/40/NP
IEC 60191-3/FRAG3 ED2

Standardization of Pin #1 mark for identification in automatic handling systems

MERGED
  • MERGED
  • Fragment merged
EN-FR U 47D/120/CDV
IEC 60191-3/FRAG4 ED2

Definition of pin No. 1 orientation for TAB packages (intended for inclusion into IEC 191-3)

MERGED
  • MERGED
  • Fragment merged
EN U 47D/95/CC
IEC 60191-3:1974 ED1

Mechanical standardization of semiconductor devices. Part 3: General rules for the preparation of outline drawings of integrated circuits

DELPUB
  • DELPUB
  • Publication Deleted
EN-FR U
IEC 60191-3:1974/AMD1:1983 ED1

Amendment 1 - Mechanical standardization of semiconductor devices. Part 3: General rules for the preparation of outline drawings of integrated circuits

DELPUB
  • DELPUB
  • Publication Deleted
EN-FR U
IEC 60191-3:1974/AMD2:1995 ED1

Amendment 2 - Mechanical standardization of semiconductor devices. Part 3: General rules for the preparation of outline drawings of integrated circuits

DELPUB
  • DELPUB
  • Publication Deleted
EN-FR U 47D(SEC.)/14/CDV
IEC 60191-3/AMD2/FRAG1 ED1

Amendment to Sub-clause 4.5 of IEC 191-3 - Devices with terminals disposed in three or more rows in each orthogonal direction

MERGED
  • MERGED
  • Fragment merged
EN-FR U 47D(SEC.)/31/CDV
IEC 60191-4:2013 ED3

Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages

PPUB
  • PPUB
  • Publication issued
EN-FR Y Webstore
IEC 60191-4:2013/AMD1:2018 ED3

Amendment 1 - Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages

PPUB
  • PPUB
  • Publication issued
EN-FR 2018-04 Y Webstore
IEC 60191-4:1999+AMD1:2001+AMD2:2002 CSV ED2.2

Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages

DELPUB
  • DELPUB
  • Publication Deleted
EN-FR U
IEC 60191-4:1999 ED2

Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages

DELPUB
  • DELPUB
  • Publication Deleted
EN-FR 1999-10 Y 47D/298/FDIS
IEC 60191-4/FRAG1 ED2

Proposed replacement of IEC 191-4: Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor devices

MERGED
  • MERGED
  • Fragment merged
EN U 47D/98/NP
IEC 60191-4/FRAG2 ED2

Amendment to IEC 191-4 to add a package style and a descriptive designator for high power semiconductor packages (100 ... 1700 V/10 ... 1000 A)

MERGED
  • MERGED
  • Fragment merged
EN U 47D/124/NP
IEC 60191-4/FRAG3 ED2

Definition and value of L, T

MERGED
  • MERGED
  • Fragment merged
EN U 47D/132/NP
IEC 60191-4:1999/AMD1:2001 ED2

Amendment 1 - Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages

DELPUB
  • DELPUB
  • Publication Deleted
EN-FR 2001-12 Y 47D/461/FDIS

IEC 60191-4:1999/AMD2:2002 ED2

Amendment 2 - Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages

DELPUB
  • DELPUB
  • Publication Deleted
EN-FR 2002-08 Y 47D/505/FDIS

IEC 60191-4:1987 ED1

Mechanical standardization of semiconductor devices. Part 4: Coding systems and classification into forms of package outlines for semiconductor devices

DELPUB
  • DELPUB
  • Publication Deleted
EN-FR U
IEC 60191-5:1997 ED2

Mechanical standardization of semiconductor devices - Part 5: Recommendations applying to integrated circuit packages using tape automated bonding (TAB)

PPUB
  • PPUB
  • Publication issued
EN-FR U Webstore
IEC 60191-5:1987 ED1

Mechanical standardization of semiconductor devices. Part 5: Recommendations applying to tape automated bonding (TAB) of integrated circuits.

DELPUB
  • DELPUB
  • Publication Deleted
EN-FR U
IEC 60191-6:2009 ED3

Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages

PPUB
  • PPUB
  • Publication issued
EN-FR 2009-11 Y Webstore
IEC 60191-6:2004 ED2

Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages

DELPUB
  • DELPUB
  • Publication Deleted
EN 2004-09 Y 47D/584/FDIS
IEC 60191-6:1990 ED1

Mechanical standardization of semiconductor devices. Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages

DELPUB
  • DELPUB
  • Publication Deleted
EN-FR U
IEC 60191-6:1990/AMD1:1999 ED1

Amendment 1 - Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages

DELPUB
  • DELPUB
  • Publication Deleted
EN U 47D/320/FDIS
IEC 60191-6/AMD1/FRAG1 ED1

Inclusion of an SVP outline family into IEC 191-6

DEL
  • DEL
  • Deleted items
EN U 47D/47/CD
IEC 60191-6/AMD1/FRAG3 ED1

O value of leaded packages with two parallel rows of terminals in IEC 191-6, Appendix B1

DEL
  • DEL
  • Deleted items
EN U 47D/133/NP
IEC 60191-6/AMD1/FRAG5 ED1

IEC 191-6 - General rules for TSOP (Thin small outline package) Type II

MERGED
  • MERGED
  • Fragment merged
EN U 47D/170/CDV
IEC 60191-6/AMD2/FRAG8 ED1

Amendment to IEC 60191-6 - Renaming 'terminal land area' to 'terminal position area'

DELPUB
  • DELPUB
  • Publication Deleted
EN U 47D/189/NP
IEC 60191-6-1 ED2

IEC 60191-6-1 Ed.2: Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull-wing lead terminals

DEL
  • DEL
  • Deleted items
EN-FR 2012-07 Y 47D/804/CDV PDF file 371 kB
PDF file 377 kB
IEC 60191-6-1:2001 ED1

Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull-wing lead terminals

PPUB
  • PPUB
  • Publication issued
EN Y Webstore
IEC 60191-6-2:2001 ED1

Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor devices packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages

PPUB
  • PPUB
  • Publication issued
EN-FR Y Webstore
MERGED
  • MERGED
  • Publication merged with EN version
FR 2012-09 U
IEC 60191-6-2:2001/COR1:2002 ED1

Corrigendum 1 - Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages

PPUB
  • PPUB
  • Publication issued
EN U Webstore
IEC 60191-6-3:2000 ED1

Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP)

PPUB
  • PPUB
  • Publication issued
EN-FR Y Webstore
MERGED
  • MERGED
  • Publication merged with EN version
FR 2012-09 U
IEC 60191-6-4:2003 ED1

Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)

PPUB
  • PPUB
  • Publication issued
EN-FR Y Webstore
MERGED
  • MERGED
  • Publication merged with EN version
FR 2012-09 U
IEC 60191-6-5 ED2

Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA)

DEL
  • DEL
  • Deleted items
EN-FR 2013-12 Y 47D/829/FDIS

IEC 60191-6-5:2001 ED1

Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA)

PPUB
  • PPUB
  • Publication issued
EN Y Webstore
IEC 60191-6-6:2001 ED1

Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA)

PPUB
  • PPUB
  • Publication issued
EN-FR Y Webstore
MERGED
  • MERGED
  • Publication merged with EN version
FR 2012-09 U
IEC 60191-6-7 ED1

Mechanical standardization of semiconductor devices - part 6-7: General rules for the dimensions of P-VQFN

CAN
  • CAN
  • Draft Cancelled
EN Y 47D/534/CDV PDF file 219 kB
IEC 60191-6-8:2001 ED1

Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for glass sealed ceramic quad flatpack (G-QFP)

PPUB
  • PPUB
  • Publication issued
EN-FR Y Webstore
MERGED
  • MERGED
  • Publication merged with EN version
FR 2012-09 U
IEC 60191-6-9 ED1

Mechanical standardization of semiconductor devices - Part 6-9: General rules for the preparation of outline drawing of surface mounted semiconductor device packages - Design guideline of integrated circuits for Plastic Quad Flat Package (P-QFP)

CAN
  • CAN
  • Draft Cancelled
EN U 47D/552/CC PDF file 113 kB
IEC 60191-6-10:2003 ED1

Mechanical standardization of semiconductor devices - Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Dimensions of P-VSON

PPUB
  • PPUB
  • Publication issued
EN-FR Y Webstore
MERGED
  • MERGED
  • Publication merged with EN version
FR 2012-09 U
IEC 60191-6-11 ED1

Mechanical standardization of semiconductor devices - Part 6-11: General design guidelines for rectangular Fine Pitch Ball Grid Array Packages (FBGA)

DEL
  • DEL
  • Deleted items
EN Y 47D/482/CDV PDF file 151 kB
IEC 60191-6-12:2011 ED2

Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guidelines for fine-pitch land grid array (FLGA)

PPUB
  • PPUB
  • Publication issued
EN-FR 2011-06 Y Webstore
IEC 60191-6-12:2002 ED1

Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch land grid array (FLGA) - Rectangular type

DELPUB
  • DELPUB
  • Publication Deleted
EN 2002-07 Y 47D/493/FDIS
IEC 60191-6-13:2016 ED2

Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA)

PPUB
  • PPUB
  • Publication issued
EN-FR 2016-10 Y Webstore
IEC 60191-6-13:2007 ED1

Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA/FLGA)

DELPUB
  • DELPUB
  • Publication Deleted
EN-FR 2007-06 Y 47D/681/FDIS
MERGED
  • MERGED
  • Publication merged with EN version
FR 2008-09 U
IEC 60191-6-14 ED1

Mechanical standardization of semiconductor devices - Part 6-14: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ)

DEL
  • DEL
  • Deleted items
EN 2007-12 U 47D/670/NP PDF file 383 kB
IEC 60191-6-15 ED1

Mechanical standardization of semiconductor devices - Part 6-15: General rules for the preparation of outline drawings of surface mounted semiconductor device packages- Measuring methods for package dimensions of small outline packages (SOP)

DEL
  • DEL
  • Deleted items
EN 2007-12 U 47D/672/NP PDF file 283 kB
IEC 60191-6-16 ED2

Semiconductor Packaging - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA

DEL
  • DEL
  • Deleted items
EN 2014-12 Y 47D/840A/CC Word file 93 kB
PDF file 54 kB
IEC 60191-6-16:2007 ED1

Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA

PPUB
  • PPUB
  • Publication issued
EN-FR 2007-06 Y Webstore
MERGED
  • MERGED
  • Publication merged with EN version
FR 2012-04 U
IEC 60191-6-17:2011 ED1

Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA)

PPUB
  • PPUB
  • Publication issued
EN-FR 2011-02 Y Webstore
IEC PAS 60191-6-18:2008 ED1

Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

DELPUB
  • DELPUB
  • Publication Deleted
EN 2007-11 U 47D/677/NP PDF file 1086 kB
IEC 60191-6-18:2010 ED1

Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

PPUB
  • PPUB
  • Publication issued
EN-FR 2010-01 Y Webstore
IEC 60191-6-18:2010/COR1:2010 ED1

Corrigendum 1 - Mechanical stardardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

PPUB
  • PPUB
  • Publication issued
EN-FR U Webstore
IEC 60191-6-18:2010/COR2:2010 ED1

Corrigendum 2 - Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

PPUB
  • PPUB
  • Publication issued
EN-FR U Webstore
IEC PAS 60191-6-19:2008 ED1

Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of package warpage at elevated temperature and the maximum permissible warpage

DELPUB
  • DELPUB
  • Publication Deleted
EN 2007-12 U 47D/691/NP PDF file 386 kB
IEC 60191-6-19:2010 ED1

Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage

PPUB
  • PPUB
  • Publication issued
EN-FR 2010-02 Y Webstore
IEC 60191-6-20:2010 ED1

Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ)

PPUB
  • PPUB
  • Publication issued
EN-FR 2010-09 Y Webstore
IEC 60191-6-21:2010 ED1

Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP)

PPUB
  • PPUB
  • Publication issued
EN-FR 2010-09 Y Webstore
IEC 60191-6-22:2012 ED1

Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)

PPUB
  • PPUB
  • Publication issued
EN-FR 2012-12 Y Webstore
IEC 60191-1A:1969 ED1

Mechanical standardization of semiconductor devices - Part 1: Preparation of drawings of semiconductor devices - First supplement

DELPUB
  • DELPUB
  • Publication Deleted
EN-FR U
IEC 60191-1B:1970 ED1

Mechanical standardization of semiconductor devices - Part 1: Preparation of drawings of semiconductor devices - Second supplement

DELPUB
  • DELPUB
  • Publication Deleted
EN-FR U
IEC 60191-1C:1974 ED1

Mechanical standardization of semiconductor devices - Part 1: Preparation of drawings of semiconductor devices - Third supplement

DELPUB
  • DELPUB
  • Publication Deleted
EN-FR U
IEC 60191-2A:1967 ED1

First supplement to Publication 191-2 (1966) Mechanical standardization of semiconductor devices - Part 2: Dimensions Part 2: Dimensions

DELPUB
  • DELPUB
  • Publication Deleted
EN-FR U
IEC 60191-2B:1969 ED1

Second supplement - Mechanical standardization of semiconductor devices - Part 2: Dimensions

DELPUB
  • DELPUB
  • Publication Deleted
EN-FR U
IEC 60191-2C:1970 ED1

Third supplement

DELPUB
  • DELPUB
  • Publication Deleted
EN-FR U
IEC 60191-2D:1971 ED1

Fourth supplement

DELPUB
  • DELPUB
  • Publication Deleted
EN-FR U
IEC 60191-2E:1974 ED1

Fifth supplement

DELPUB
  • DELPUB
  • Publication Deleted
EN-FR U
IEC 60191-2F:1976 ED1

Sixth supplement

DELPUB
  • DELPUB
  • Publication Deleted
EN-FR U
IEC 60191-2G:1978 ED1

Seventh supplement

DELPUB
  • DELPUB
  • Publication Deleted
EN-FR U
IEC 60191-2H:1978 ED1

Eigth supplement

DELPUB
  • DELPUB
  • Publication Deleted
EN-FR U
IEC 60191-2J:1980 ED1

Ninth supplement - Mechanical standardization of semiconductor devices - Part 2: Dimensions

DELPUB
  • DELPUB
  • Publication Deleted
EN-FR U
IEC 60191-2K:1981 ED1

Tenth supplement - Mechanical standardization of semiconductor devices - Part 2: Dimensions

DELPUB
  • DELPUB
  • Publication Deleted
EN-FR U
IEC 60191-2L:1982 ED1

Eleventh supplement

DELPUB
  • DELPUB
  • Publication Deleted
EN-FR U
IEC 60191-2M:1983 ED1

Twelfth supplement

DELPUB
  • DELPUB
  • Publication Deleted
EN-FR U
IEC 60191-2N:1987 ED1

Thirteenth supplement - Mechanical standardization of semiconductor devices - Part 2: Dimensions

DELPUB
  • DELPUB
  • Publication Deleted
EN-FR U
IEC 60191-2P:1988 ED1

Fourteenth supplement

DELPUB
  • DELPUB
  • Publication Deleted
EN-FR U
IEC 60191-2Q:1990 ED1

fifteenth complement

DELPUB
  • DELPUB
  • Publication Deleted
EN-FR U
IEC 60191-2R:1995 ED1

Sixteenth supplement

DELPUB
  • DELPUB
  • Publication Deleted
EN-FR U
IEC 60191-2S:1995 ED1

Seventeenth supplement

DELPUB
  • DELPUB
  • Publication Deleted
EN-FR U 47(SEC.)/1242/NP
IEC 60191-2T:1996 ED1

Eighteenth supplement

PPUB
  • PPUB
  • Publication issued
EN-FR U Webstore
IEC 60191-2U:1997 ED1

Nineteenth supplement

PPUB
  • PPUB
  • Publication issued
EN-FR U Webstore
IEC 60191-2V:1998 ED1

Twentieth supplement

PPUB
  • PPUB
  • Publication issued
EN-FR U Webstore
IEC 60191-2W:1999 ED1

Twenty-first supplement

PPUB
  • PPUB
  • Publication issued
EN-FR U Webstore
IEC 60191-2W/FRAG1 ED1

Proposal for a plastic thin shrink small outline package (TSSOP/HTSSOP), 1,00 mm lead length outline family, R-PDSO-G

MERGED
  • MERGED
  • Fragment merged
EN U 47D/233/FDIS
IEC 60191-2X:1999 ED1

Mechanical standardization of semiconductor devices - Part 2: Dimensions

PPUB
  • PPUB
  • Publication issued
EN-FR U Webstore
IEC 60191-2X:1999/COR1:2000 ED1

Corrigendum 1 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

PPUB
  • PPUB
  • Publication issued
EN-FR U Webstore
IEC 60191-2Y:2000 ED1

Twenty-third supplement - Mechanical standardization of semiconductor devices - Part 2: Dimensions

PPUB
  • PPUB
  • Publication issued
EN U Webstore
IEC 60191-2Y/FRAG30 ED1

Addition to the metric plastic quad flatpack family; 1.0 mm, 0,80 mm and 0,65 mm

MERGED
  • MERGED
  • Fragment merged
EN U 47D/342/FDIS
IEC 60191-2Z:2000 ED1

Twenty-fourth supplement - Mechanical standardization of semiconductor devices - Part 2: Dimensions

PPUB
  • PPUB
  • Publication issued
EN U Webstore
IEC 60191-3A:1976 ED1

Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits - First supplement

DELPUB
  • DELPUB
  • Publication Deleted
EN-FR U
IEC 60191-3B:1978 ED1

Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits - Second supplement

DELPUB
  • DELPUB
  • Publication Deleted
EN-FR U
IEC 60191-3C:1987 ED1

Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits - Third supplement

DELPUB
  • DELPUB
  • Publication Deleted
EN-FR U
IEC 60191-3D:1988 ED1

Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits - Fourth supplement

DELPUB
  • DELPUB
  • Publication Deleted
EN-FR U
IEC 60191-3E:1990 ED1

Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits - Fifth supplement

DELPUB
  • DELPUB
  • Publication Deleted
EN-FR U
IEC 60191-3F:1994 ED1

Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits - Sixth supplement

DELPUB
  • DELPUB
  • Publication Deleted
EN-FR U
IEC 61927 ED1

Dimensional check of surface mounted devices

DEL
  • DEL
  • Deleted items
EN U 47A/406/NP