TC 91

Electronics assembly technology

 
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TC 91 Project files (658)

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Stage

Language

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Date

CLC

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Reference

Downloads
PNW 52-605 ED1

Revision of IEC 410

DEL
  • DEL
  • Deleted/abandoned
EN U 52/605/NP
PNW 52-609 ED1

Amendment to IEC 249-1 (1982) - Sub-clause 3.8.1

DEL
  • DEL
  • Deleted/abandoned
EN U 52/609/NP
PNW 52-685 ED1

New specification IEC 2326-XX: Specification for appearance of surfaces of flexible printed boards

DEL
  • DEL
  • Deleted/abandoned
EN U 52/685/NP
PNW 52-725 ED1

Specification for appearances of surfaces of flexible printed boards

DEL
  • DEL
  • Deleted/abandoned
EN U 52/725/NP
PNW 52-727 ED1

Process assessment schedule for mass lamination panels

DEL
  • DEL
  • Deleted/abandoned
EN U 52/727/NP
PNW 52-728 ED1

Technology approval schedule for printed boards

DEL
  • DEL
  • Deleted/abandoned
EN U 52/728/NP
PNW 52-729 ED1

Base material for printed boards

DEL
  • DEL
  • Deleted/abandoned
EN U 52/729/NP
PNW 52-730 ED1

Process assessment schedule for printed board design facilities

DEL
  • DEL
  • Deleted/abandoned
EN U 52/730/NP
PNW 52-756 ED1

Generic computer aided manufacturing format (GenCAM)

DEL
  • DEL
  • Deleted/abandoned
EN U 52/756/NP
PWI 52-807 ED1

IEC 61249-1: Materials for interconnecting structures - Part 1: Generic specification

DEL
  • DEL
  • Deleted/abandoned
EN U 52/807/NP PDF file 125 kB
PWI TR 91-1 ED1

Future IEC/TR 60068-3-82: Environmental Testing - Part 3-82: Supporting documentation and guidance − confIrmation of the performance of whisker test method

PWI
  • PWI
  • Preliminary work item
EN U
PNW 91-14-1 ED1

Revision of IEC 326-3 - New IEC 1188-2: Design and use requirements of printed boards and printed board assemblies - Part 2: Sectional design and use requirements - Engineering considerations. considerations

DEL
  • DEL
  • Deleted/abandoned
EN U 91/64/NP
PNW 91-15-1 ED1

New Standard IEC 1193: Guidance on the use of IEC and ISO publications and quality assessment systems for printed boards and printed board assemblies

DEL
  • DEL
  • Deleted/abandoned
EN U 91/65/NP
PNW 91-405 ED1

IEC 61249-1-1: Materials for printed boards and other interconnection structures - Part 1-1: Safety certification of base materials for rigid printed circuit boards

DEL
  • DEL
  • Deleted/abandoned
EN U 91/405/NP PDF file 1570 kB
PNW 91-407 ED1

IEC 61188-5-7 Design and use of printed boards and printed board assemblies - Part 5-7: Sectional requirements attachment (land/joint) considerations - components with post mounting leads on two sides (dips)

DEL
  • DEL
  • Deleted/abandoned
EN U 91/407/NP PDF file 304 kB
PNW 91-432 ED1

IEC xxx-xx: Test methods for lead-free solders - Part 1: Measurement of melting temperature ranges

DEL
  • DEL
  • Deleted/abandoned
EN U 91/432/NP PDF file 178 kB
PNW 91-433 ED1

IEC xxx-xx: Test methods for lead-free solder - Part 2: Testing of mechanical characteristics

DEL
  • DEL
  • Deleted/abandoned
EN U 91/433/NP PDF file 214 kB
PNW 91-469 ED1

Specification for Flexible Optical Board using Glass Fibre and its test methods

DEL
  • DEL
  • Deleted/abandoned
EN U 91/469/NP PDF file 126 kB
PNW 91-470 ED1

Specification for rigid optical board using planar waveguide and its test methods

DEL
  • DEL
  • Deleted/abandoned
EN U 91/470/NP PDF file 240 kB
PNW 91-471 ED1

Specification for optical board connector type SF using glass fibre

DEL
  • DEL
  • Deleted/abandoned
EN U 91/471/NP PDF file 357 kB
PNW 91-476 ED1

Marking, Symbols and Labels for Identification of Lead-Free and Other Reportable Materials in Lead-Free Assemblies, Components and Devices

DEL
  • DEL
  • Deleted/abandoned
EN U 91/476/NP PDF file 64 kB
PNW 91-486 ED1

Detail Specification for Right-angled Optical Board Connector using Glass Fibers

DEL
  • DEL
  • Deleted/abandoned
EN U 91/486/NP PDF file 3081 kB
PNW 91-563 ED1

Materials for printed boards and other interconnecting structures - Part 2-35: Reinforced base materials, clad and unclad - Modified epoxide woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly

DEL
  • DEL
  • Deleted/abandoned
EN U 91/563/NP PDF file 242 kB
PNW 91-592 ED1

Materials for printed boards and other interconnecting structures - Part 4-15: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional epoxide woven E-glass prepreg of defined flammability for lead-free compatible assembly

DEL
  • DEL
  • Deleted/abandoned
EN U 91/592/NP PDF file 460 kB
PNW 91-594 ED1

Materials for printed boards and other interconnecting structures - Part 4-16: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional non-halogenated epoxide woven E-glass prepreg of defined flammability for lead-free compatible assembly

DEL
  • DEL
  • Deleted/abandoned
EN U 91/594/NP PDF file 426 kB
PNW 91-595 ED1

Materials for printed boards and other interconnecting structures - Part 4-17: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Non-halogenated epoxide woven E-glass prepreg of defined flammability for lead-free compatible assembly

DEL
  • DEL
  • Deleted/abandoned
EN U 91/595/NP PDF file 455 kB
PNW 91-596 ED1

Materials for printed boards and other interconnecting structures - Part 2-36: Sectional specification set for reinforced based materials, clad and unclad - Epoxide woven glass fabric copper-clad sheet of defined flammability for lead-free assembly

DEL
  • DEL
  • Deleted/abandoned
EN U 91/596/NP PDF file 453 kB
PNW 91-597 ED1

Materials for printed boards and other interconnecting structures - Part 2-37: Sectional specification set for reinforced based materials, clad and unclad - Multi-functional, non-halogenated epoxide woven glass fabric copper-clad sheet of defined flammability for lead-free assembly

DEL
  • DEL
  • Deleted/abandoned
EN U 91/597/NP PDF file 465 kB
PNW 91-598 ED1

Materials for printed boards and other interconnecting structures - Part 2-38: Sectional specification set for reinforced based materials, clad and unclad - Non-halogenated epoxide woven glass fabric copper-clad sheet of defined flammability for lead-free assembly

DEL
  • DEL
  • Deleted/abandoned
EN U 91/598/NP PDF file 453 kB
PNW 91-902 ED1

Future IEC 61189-12: Test methods for electrical materials, interconnection structures and assemblies, Part-12 Erosion test method on the materials of solder bath or parts which contact with molten lead free solder.

DEL
  • DEL
  • Deleted/abandoned
EN U 91/902A/NP PDF file 339 kB
PNW 91-1035 ED1

Future IEC 61189-3-720: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-720: Electrochemical migration test method

DEL
  • DEL
  • Deleted/abandoned
EN U 91/1035/NP PDF file 3742 kB
PNW 91-1149 ED1

FinSimMath, as a model for HDLMath

DEL
  • DEL
  • Deleted/abandoned
EN U 91/1149/NP PDF file 83 kB
PNW 91-1247 ED1

Component shape data specification for CAD library Part 2: 3D shape data specifications

DEL
  • DEL
  • Deleted/abandoned
EN U 91/1247/NP PDF file 533 kB
PNW 91-1474

Future 61249-2-48: Materials For Printed Boards and Other Interconnecting Structures – Part 2-48: Reinforced base materials clad and unclad – High performance, epoxide, woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for automotive applications

DEL
  • DEL
  • Deleted/abandoned
EN 2020-10 Y 91/1474/NP PDF file 264 kB
PNW 91-1475

Future 61249-2-48: Materials For Printed Boards and Other Interconnecting Structures – Part 2-48: Reinforced base materials clad and unclad – High performance, epoxide, woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for automotive applications

DEL
  • DEL
  • Deleted/abandoned
EN 2020-10 Y 91/1475/NP PDF file 265 kB
PNW 91-1476

Future 61249-2-50: Materials For Printed Boards and Other Interconnecting Structures – Part 2-50: Reinforced base materials clad and unclad – High performance thermosetting resin, modified or unmodified woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for high frequency applications

DEL
  • DEL
  • Deleted/abandoned
EN 2020-10 Y 91/1476/NP PDF file 265 kB
PNW 91-1477

Future 61249-2-51: Materials For Printed Boards and Other Interconnecting Structures – Part 2-51: Reinforced base materials clad and unclad – High performance non-halogen thermosetting resin, modified or unmodified woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for high frequency applications

DEL
  • DEL
  • Deleted/abandoned
EN 2020-10 Y 91/1477/NP PDF file 266 kB
PNW 91-1478

Future 61189-2-xxx: Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-XXX: Test methods for base materials for rigid printed boards – Decomposition Temperature Td

DEL
  • DEL
  • Deleted/abandoned
EN 2020-10 Y 91/1478/NP PDF file 166 kB
PNW 91-1514

PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES – DESIGN AND USE Part 8: 3D shape data specification for CAD component library.

DEL
  • DEL
  • Deleted/abandoned
EN 2020-11 U 91/1514/NP PDF file 484 kB
PNW 91-1590

MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES – Part 6-11: Sectional specification set for reinforcement materials – Specification for finished fabric woven from “Low Dk” glass for printed boards

CAN
  • CAN
  • Draft Cancelled
EN 2021-12 U 91/1590/NP PDF file 262 kB
PNW 91-1706 ED1

Endurance test methods for die attach materials – Part 1: General specification

PNW
  • PNW
  • New work item proposal
EN 2023-11 U 91/1706/NP PDF file 608 kB
PNW 91-1707 ED1

Endurance test methods for die attach materials – Part 5: Temperature cycling test methods and reliability performance index for die attach materials (system soldering interconnection) applied to module type power electronic devices

PNW
  • PNW
  • New work item proposal
EN 2023-11 U 91/1707/NP PDF file 1154 kB
PNW 91-1709 ED1

Endurance test methods for die attach materials – Part 3: Power cycling test method and reliability performance index for die attach materials applied to discrete type power electronic devices

PRVN
  • PRVN
  • Preparation of RVN
EN 2023-11 U 91/1709/NP PDF file 137 kB
PNW 91-1710 ED1

Electrical test method of printed circuit board by measuring the capacitance

PNW
  • PNW
  • New work item proposal
EN 2024-05 U 91/1710/NP PDF file 355 kB
PNW 91-1718 ED1

Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-809: X/Y Coefficient of Thermal Expansion Test (CTE) for Thick Base Materials by TMA

PNW
  • PNW
  • New work item proposal
EN 2023-10 U 91/1718/NP PDF file 326 kB
PNW 91-1719 ED1

Future 61249-2-XXX:MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - Part 2-XXX: Reinforced base materials, clad and unclad - Base materials for Integrated Circuit card carrier tape,unclad

PNW
  • PNW
  • New work item proposal
EN 2023-10 U 91/1719/NP PDF file 410 kB
PNW 93-2 ED1

Library standard architecture (future IEC 62014-2) (TR)

DEL
  • DEL
  • Deleted/abandoned
EN U
PNW 93-3 ED1

Test information flow through the product life cycle (TR)

DEL
  • DEL
  • Deleted/abandoned
EN U
PNW 93-4 ED1

Models of integrated circuits for EMI behavioural simulation (future IEC 62014-3)

MERGED
  • MERGED
  • Fragment merged
EN U
PNW 93-4/FRAG1 ED1

Terminology and taxonomy for eletronic design automation

DEL
  • DEL
  • Deleted/abandoned
EN U
PNW 93-5 ED1

Library utilities for VHDL (TR)

DEL
  • DEL
  • Deleted/abandoned
EN U
PWI 93-7 ED1

Libraries of reusable parts for electrotechnical products

DEL
  • DEL
  • Deleted/abandoned
EN U 93/73/NP
PNW 93-9 ED1

AI Estate - Overview and Architecture (Fast Track request expected from USNC)

DEL
  • DEL
  • Deleted/abandoned
EN U
PNW 93-10 ED1

AI Estate - Data and Knowledge (Fast track request expected from USNC)

DEL
  • DEL
  • Deleted/abandoned
EN U
PNW 93-11 ED1

AI Estate - Service specification (Fast track request expected from USNC)

DEL
  • DEL
  • Deleted/abandoned
EN U
PNW 93-31 ED1

Electronic design automation - Verilog 1364 - The verilog hardware description language (HDL) reference manual

DEL
  • DEL
  • Deleted/abandoned
EN U 93/31/NP
PNW 93-39 ED1

Libraries of reusable parts for electrotechnical products: Development of models for CAD tools

DEL
  • DEL
  • Deleted/abandoned
EN U 93/39A/NP
PNW 93-40 ED1

Libraries of reusable parts for electrotechnical products: Component information representation

DEL
  • DEL
  • Deleted/abandoned
EN U 93/40A/NP
PNW 93-41 ED1

Libraries of reusable parts for electrotechnical products: Library organisation

DEL
  • DEL
  • Deleted/abandoned
EN U 93/41A/NP
PNW 93-60 ED1

IBIS models and EMC simulation

DEL
  • DEL
  • Deleted/abandoned
EN U 93/60/NP
PNW 93-80 ED1

Electronic CAD to CAM exchange

DEL
  • DEL
  • Deleted/abandoned
EN U 93/80/NP
PNW 93-127 ED1

Standard Hardware Description Language Based on the Verilog Hardware Description Language

DEL
  • DEL
  • Deleted/abandoned
EN U 93/127/NP Word file 30 kB
PDF file 5726 kB
PNW 93-128 ED1

Standard for Standard Delay Format (SDF) for the Electronic Design Process

DEL
  • DEL
  • Deleted/abandoned
EN U 93/128/NP Word file 30 kB
PDF file 518 kB
PNW 93-204 ED1

Interoperability of Formats and Schemas used for Electronic Assembly Material Declaration

DEL
  • DEL
  • Deleted/abandoned
EN U 93/204/NP PDF file 366 kB
PNW 93-209 ED1

Generic Requirements for Electronics Manufacturing Supply Chain Communication - Product Data eXchange (PDX)

DEL
  • DEL
  • Deleted/abandoned
EN U 93/209/NP PDF file 705 kB
PNW 93-283 ED1

IEC 61692-2 Ed 1.0: Common rules for circulation of electronic catalogue data - Part 2: Common exchange rules and Interoperability system (IOS)

DEL
  • DEL
  • Deleted/abandoned
EN 2010-12 U 93/283/NP PDF file 307 kB
IEC 60068-2-20:2021 ED6

Environmental testing - Part 2-20: Tests - Test Ta and Tb: Test methods for solderability and resistance to soldering heat of devices with leads

PPUB
  • PPUB
  • Publication issued
EN-FR 2021-04 Y Webstore
IEC 60068-2-20:2008 ED5

Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads

DELPUB
  • DELPUB
  • Deleted publication
EN-FR 2008-07 Y 91/764/FDIS
MERGED
  • MERGED
  • Publication merged with EN version
FR 2009-08 U
IEC 60068-2-20:1979 ED4

Environmental testing. Part 2: Tests. Test T: Soldering

DELPUB
  • DELPUB
  • Deleted publication
EN-FR U
IEC 60068-2-20:1979/AMD2:1987 ED4

Amendment 2 - Basic environmental testing procedures - Part 2-20: Tests - Test T: Soldering

DELPUB
  • DELPUB
  • Deleted publication
EN-FR U
IEC 60068-2-21 ED7

Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices

RFDIS
  • RFDIS
  • FDIS received and registered
EN 2021-09 Y 91/1622/CDV
PDF file 1677 kB
PDF file 1699 kB
IEC 60068-2-21:2006 ED6

Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices

PPUB
  • PPUB
  • Publication issued
EN-FR 2006-06 Y Webstore
MERGED
  • MERGED
  • Publication merged with EN version
FR 2011-08 U
IEC 60068-2-21:2006/COR1:2012 ED6

Corrigendum 1 - Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices

PPUB
  • PPUB
  • Publication issued
EN-FR U Webstore
IEC 60068-2-21:1999 ED5

Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices

DELPUB
  • DELPUB
  • Deleted publication
EN-FR Y 50/391A/CDV
IEC 60068-2-21/FRAGF ED5

Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices

MERGED
  • MERGED
  • Publication merged with EN version
EN-FR U
IEC 60068-2-21:1983 ED4

Environmental testing. Part 2: Tests. Test U: Robustness of terminations and integral mounting devices

DELPUB
  • DELPUB
  • Deleted publication
EN-FR U
IEC 60068-2-21:1983/AMD2:1991 ED4

Amendment 2 - Environmental testing. Part 2: Tests. Test U: Robustness of terminations and integral mounting devices

DELPUB
  • DELPUB
  • Deleted publication
EN-FR U
IEC 60068-2-21:1983/AMD3:1992 ED4

Amendment 3 - Environmental testing. Part 2: Tests. Test U: Robustness of terminations and integral mounting devices

DELPUB
  • DELPUB
  • Deleted publication
EN-FR U
IEC 60068-2-44:1995 ED2

Environmental testing - Part 2-44: Tests - Guidance on test T: Soldering

DELPUB
  • DELPUB
  • Deleted publication
EN-FR 1995-01 Y 50(SEC.)/335/CDV
IEC 60068-2-44:1979 ED1

Basic environmental testing procedures - Part 2: Tests - Tests - Guidance on Test T: Soldering

DELPUB
  • DELPUB
  • Deleted publication
EN-FR U
IEC 60068-2-54:2006 ED2

Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method

DELPUB
  • DELPUB
  • Deleted publication
EN-FR 2006-05 Y 91/576/FDIS
MERGED
  • MERGED
  • Publication merged with EN version
FR 2013-05 U
IEC 60068-2-54:1985 ED1

Environmental testing. Part 2: Tests. Test Ta: Soldering - Solderability testing by the wetting balance method

DELPUB
  • DELPUB
  • Deleted publication
EN-FR U
IEC 60068-2-58:2015 ED4

Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

PPUB
  • PPUB
  • Publication issued
EN-FR 2015-03 Y Webstore
IEC 60068-2-58:2015/AMD1:2017 ED4

Amendment 1 - Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

PPUB
  • PPUB
  • Publication issued
EN 2017-08 Y Webstore
IEC 60068-2-58:2004 ED3

Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

DELPUB
  • DELPUB
  • Deleted publication
EN-FR 2004-07 Y 91/447/FDIS
IEC 60068-2-58/FRAGF ED3

Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

MERGED
  • MERGED
  • Publication merged with EN version
EN-FR U
IEC 60068-2-58:1999 ED2

Environmental testing - Part 2-58: Tests - Test Td - Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

DELPUB
  • DELPUB
  • Deleted publication
EN Y 50/390/CDV
IEC 60068-2-58:1989 ED1

Environmental testing. Part 2: Tests. Test Td: Solderability, resistance to dissolution of metallization and to soldering heat of Surface Mounting Devices (SMD)

DELPUB
  • DELPUB
  • Deleted publication
EN-FR U
IEC 60068-2-69:2017 ED3

Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method

PPUB
  • PPUB
  • Publication issued
EN-FR 2017-03 Y Webstore
IEC 60068-2-69:2017/COR1:2018 ED3

Corrigendum 1 - Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement)

PPUB
  • PPUB
  • Publication issued
EN-FR 2017-03 Y Webstore
IEC 60068-2-69:2017/AMD1:2019 ED3

Amendment 1 - Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method

PPUB
  • PPUB
  • Publication issued
EN-FR 2019-06 Y Webstore
IEC 60068-2-69:2007 ED2

Environmental testing - Part 2-69: Tests - Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method

DELPUB
  • DELPUB
  • Deleted publication
EN-FR 2007-06 Y 91/648/FDIS
IEC 60068-2-69/FRAGF ED2

Environmental testing - Part 2-69: Tests - Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method

MERGED
  • MERGED
  • Publication merged with EN version
EN-FR 2008-04 U
IEC 60068-2-69:1995 ED1

Environmental testing - Part 2: Tests - Test Te: Solderability testing of electronic components for surface mount technology by the wetting balance method

DELPUB
  • DELPUB
  • Deleted publication
EN-FR 1995-12 Y 50/358/FDIS
IEC 60068-2-69/AMD1 ED1

Amendment 1 to IEC 60068-2-69

DEL
  • DEL
  • Deleted/abandoned
EN U 50/380/NP
IEC 60068-2-77:1999 ED1

Environmental testing - Part 2-77: Tests - Test 77: Body strength and impact shock

PPUB
  • PPUB
  • Publication issued
EN-FR Y Webstore
IEC 60068-2-77/FRAGF ED1

Environmental testing - Part 2-77: Tests - Test 77: Body strength and impact shock

MERGED
  • MERGED
  • Publication merged with EN version
EN-FR U
IEC 60068-2-82:2019 ED2

Environmental testing - Part 2-82: Tests - Test Xw1: Whisker test methods for components and parts used in electronic assemblies

PPUB
  • PPUB
  • Publication issued
EN-FR 2019-05 Y Webstore
IEC 60068-2-82:2007 ED1

Environmental testing - Part 2-82: Tests - Test XW1: Whisker test methods for electronic and electric components

DELPUB
  • DELPUB
  • Deleted publication
EN-FR 2007-07 Y 91/651/FDIS
IEC 60068-2-82/FRAGF ED1

Environmental testing - Part 2-82: Tests - Test Tx: Whisker test methods for electronic and electric components

MERGED
  • MERGED
  • Publication merged with EN version
EN-FR 2008-04 U
IEC 60068-2-82:2007/COR1:2009 ED1

Corrigendum 1 - Environmental testing - Part 2-82: Tests - Test XW1: Whisker test methods for electronic and electric components

DELPUB
  • DELPUB
  • Deleted publication
EN-FR U
IEC 60068-2-83:2011 ED1

Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste

PPUB
  • PPUB
  • Publication issued
EN-FR 2011-09 Y Webstore
IEC TR 60068-3-12:2014 ED2

Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile

PPUB
  • PPUB
  • Publication issued
EN-FR 2014-10 N Webstore
IEC TR 60068-3-12:2007 ED1

Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile

DELPUB
  • DELPUB
  • Deleted publication
EN 2007-03 N 91/601A/DTR PDF file 5926 kB
IEC 60068-3-13:2016 ED1

Environmental testing - Part 3-13: Supporting documentation and guidance on Test T - Soldering

PPUB
  • PPUB
  • Publication issued
EN-FR 2016-05 Y Webstore
IEC 60097 ED5

Systematic review of IEC 97 (1991)

DEL
  • DEL
  • Deleted/abandoned
EN-FR U
IEC 60097:1991 ED4

Grid systems for printed circuits

WPUB
  • WPUB
  • Publication withdrawn
EN-FR U 91/1413/RR PDF file 76 kB
IEC 60194:2015 ED6

Printed board design, manufacture and assembly - Terms and definitions

DELPUB
  • DELPUB
  • Deleted publication
EN-FR 2015-04 N 91/1236/FDIS

IEC 60194:2006 ED5

Printed board design, manufacture and assembly - Terms and definitions

DELPUB
  • DELPUB
  • Deleted publication
EN 2006-02 N 91/566/FDIS
IEC 60194:1999 ED4

Printed board design, manufacture and assembly - Terms and definitions

DELPUB
  • DELPUB
  • Deleted publication
EN U 52/801A/FDIS
IEC 60194/FRAG2 ED4

Terms and definitions for printed circuits and a proposal for a decimal classification code (DCC) for the categorization of the terms and definitions (Revision of IEC 194)

DEL
  • DEL
  • Deleted/abandoned
EN U 91/62/CC
IEC 60194:1988 ED3

Terms and definitions for printed circuits.

DELPUB
  • DELPUB
  • Deleted publication
EN-FR U
IEC 60194-1:2021 ED1

Printed boards design, manufacture and assembly - Vocabulary - Part 1: Common usage in printed board and electronic assembly technologies

PPUB
  • PPUB
  • Publication issued
EN-FR 2021-03 N Webstore
IEC 60194-2:2017 ED1

Printed boards design, manufacture and assembly - Vocabulary - Part 2: Common usage in electronic technologies as well as printed board and electronic assembly technologies

PPUB
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EN 2018-01 N Webstore
IEC 60249-1/FRAG1 ED3

Amendment to IEC 249-1 - Measurement method for glass transition temperature using differential scanning calorimetry (New Sub-clause 4.5)

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  • Deleted/abandoned
EN U
IEC 60249-1/FRAG2 ED3

Amendment to IEC 249-1 - Measurement method of cure factor (New Sub-clause 4.6)

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  • DEL
  • Deleted/abandoned
EN U
IEC 60249-1/FRAG3 ED3

Addition of a new Sub-clause 4.5.2 -Measurement method for glass transition temperature using thermomechanical analysis (TMA)- to IEC 249-1

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  • DEL
  • Deleted/abandoned
EN U
IEC 60249-1/FRAG4 ED3

Amendment to Sub-clause 2.2.1 and 2.2.2 of IEC 249-1

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  • Deleted/abandoned
EN U
IEC 60249-1:1982 ED2

Base materials for printed circuits. Part 1: Test methods

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EN-FR U
IEC 60249-1:1982/AMD4:1993 ED2

Amendment 4 - Base materials for printed circuits. Part 1: Test methods

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EN-FR U
IEC 60249-2-1:1985 ED2

Base materials for printed circuits. Part 2: Specifications. Specification No. 1: Phenolic cellulose paper copper-clad laminated sheet, high electrical quality

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EN-FR U
IEC 60249-2-1/FRAG2 ED2

Requirements for pull-off strength - Revision of Specification 249-2-1

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  • Deleted/abandoned
EN U 52/553/NP
IEC 60249-2-1:1985/AMD2:1993 ED2

Amendment No. 2 - Base materials for printed circuits - Part 2: Specifications - Specification No.1: Phenolic cellulose paper copper-clad laminated sheet, high electrical quality

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EN-FR U 52(SEC.)/323/CD
IEC 60249-2-1:1985/AMD3:1994 ED2

Amendment No. 3 - Base materials for printed circuits - Part 2: Specifications - Specifications Nos. 1, 3, 6, 7, 11 and 12

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EN-FR U 52(SEC.)/376/CD
IEC 60249-2-1:1985/AMD4:2000 ED2

Amendment 4 - Base materials for printed circuits. Part 2: Specifications. Specification No. 1: Phenolic cellulose paper copper-clad laminated sheet, high electrical quality

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EN-FR Y 52/835/FDIS
IEC 60249-2-2:1985 ED2

Base materials for printed circuits. Part 2: Specifications. Specification No. 2: Phenolic cellulose paper copper-clad laminated sheet, economic quality

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EN-FR U
IEC 60249-2-2/FRAG5 ED2

Requirements for pull-off strength - Revision of Specification 249-2-2

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  • Fragment merged
EN U 52/553/NP
IEC 60249-2-2:1985/AMD3:1993 ED2

Amendment 3 - Base materials for printed circuits - Part 2: Specifications - Specification No.2: Phenolic cellulose paper copper-clad laminated sheet, economic quality

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EN-FR U
IEC 60249-2-2:1985/AMD4:1994 ED2

Amendment 4 - Base materials for printed circuits - Part 2: Specifications - Specification No.2: Phenolic cellulose paper copper-clad laminated sheet, economic quality

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EN-FR U 52(SEC.)/376/CD
IEC 60249-2-2:1985/AMD5:2000 ED2

Amendment 5 - Base materials for printed circuits. Part 2: Specifications. Specification No. 2: Phenolic cellulose paper copper-clad laminated sheet, economic quality

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EN-FR Y 52/836/FDIS
IEC 60249-2-3:1987 ED2

Base materials for printed circuits. Part 2: Specifications. Specification No. 3: Epoxide cellulose paper copper-clad laminated sheet of defined flammability (vertical burning test)

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EN-FR U
IEC 60249-2-3/FRAG2 ED2

Requirements for pull-off strength - Revision of Specification 249-2-3

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EN U 52/553/NP
IEC 60249-2-3:1987/AMD2:1993 ED2

Amendment No. 2 - Base materials for printed circuits. Part 2: Specifications. Specification No. 3: Epoxide cellulose paper copper-clad laminated sheet of defined flammability (vertical burning test)

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EN-FR U
IEC 60249-2-3:1987/AMD3:1994 ED2

Amendment No. 3 - Base materials for printed circuits. Part 2: Specifications. Specification No. 3: Epoxide cellulose paper copper-clad laminated sheet of defined flammability (vertical burning test)

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EN-FR U 52(SEC.)/376/CD
IEC 60249-2-3:1987/AMD4:2000 ED2

Amendment 4 - Base materials for printed circuits. Part 2: Specifications. Specification No. 3: Epoxide cellulose paper copper-clad laminated sheet of defined flammability (vertical burning test)

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EN-FR Y 52/837/FDIS
IEC 60249-2-4:1987 ED2

Base materials for printed circuits. Part 2: Specifications. Specification No. 4: Epoxide woven glass fabric copper-clad laminated sheet, general purpose grade

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EN-FR U
IEC 60249-2-4:1987/AMD3:1993 ED2

Amendment 3 - Base materials for printed circuits. Part 2: Specifications. Specification No. 4: Epoxide woven glass fabric copper-clad laminated sheet, general purpose grade

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EN-FR U
IEC 60249-2-4:1987/AMD4:1994 ED2

Amendment 4 - Base materials for printed circuits. Part 2: Specifications. Specification No. 4: Epoxide woven glass fabric copper-clad laminated sheet, general purpose grade

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EN-FR U 52(SEC.)/376/CD
IEC 60249-2-4:1987/AMD5:2000 ED2

Amendment 5 - Base materials for printed circuits. Part 2: Specifications. Specification No. 4: Epoxide woven glass fabric copper-clad laminated sheet, general purpose grade

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EN-FR Y 52/838/FDIS
IEC 60249-2-5 ED3

Introduction of a new subclause 6.6 to IEC 249-2-4, 249-2-5, 249-2-11 and 249-2-12 concerning the requirements for glass transition temperature and cure factor

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EN-FR Y 52/670/CDV
IEC 60249-2-5:1987 ED2

Base materials for printed circuits. Part 2: Specifications. Specification No. 5: Epoxide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test)

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EN-FR U
IEC 60249-2-5/FRAG1 ED2

Requirements for pull-off strength - Revision of Specification 249-2-5

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  • Deleted/abandoned
EN U 52/553/NP
IEC 60249-2-5/FRAG2 ED2

Requirements for punching and machining properties of laminates - Revision of Specification 249-2-5 (Sub-clause 5.5)

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EN U 52/552/NP
IEC 60249-2-5:1987/AMD3:1993 ED2

Amendment 3 - Base materials for printed circuits. Part 2: Specifications. Specification No. 5: Epoxide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test)

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EN-FR U
IEC 60249-2-5:1987/AMD4:1994 ED2

Amendment 4 - Base materials for printed circuits. Part 2: Specifications. Specification No. 5: Epoxide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test)

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EN-FR U 52(SEC.)/376/CD
IEC 60249-2-5:1987/AMD5:2000 ED2

Amendment 5 - Base materials for printed circuits. Part 2: Specifications. Specification No. 5: Epoxide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test)

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EN-FR Y 52/844/FDIS
IEC 60249-2-6:1985 ED2

Base materials for printed circuits. Part 2: Specifications. Specification No. 6: Phenolic cellulose paper copper-clad laminated sheet of defined flammability (horizontal burning test)

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EN-FR U
IEC 60249-2-6:1985/AMD2:1993 ED2

Amendment 2 - Base materials for printed circuits. Part 2: Specifications. Specification No. 6: Phenolic cellulose paper copper-clad laminated sheet of defined flammability (horizontal burning test)

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EN-FR U
IEC 60249-2-6:1985/AMD3:1994 ED2

Amendment 3 - Base materials for printed circuits. Part 2: Specifications. Specification No. 6: Phenolic cellulose paper copper-clad laminated sheet of defined flammability (horizontal burning test)

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EN-FR U 52(SEC.)/376/CD
IEC 60249-2-6:1985/AMD4:2000 ED2

Amendment 4 - Base materials for printed circuits. Part 2: Specifications. Specification No. 6: Phenolic cellulose paper copper-clad laminated sheet of defined flammability (horizontal burning test)

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EN-FR Y 52/845/FDIS
IEC 60249-2-7:1987 ED2

Base materials for printed circuits. Part 2: Specifications. Specification No. 7: Phenolic cellulose paper copper-clad laminated sheet of defined flammability (vertical burning test)

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EN-FR U
IEC 60249-2-7/FRAG5 ED2

Requirements for surface waviness - Revision of Specification 249-2-7

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EN U 52/554/NP
IEC 60249-2-7/FRAG11 ED2

Requirements for glass transition temperature and cure factor - Revision of Specification 249-2-7

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  • Deleted/abandoned
EN U 52/555/NP
IEC 60249-2-7:1987/AMD2:1993 ED2

Amendment 2 - Base materials for printed circuits. Part 2: Specifications. Specification No. 7: Phenolic cellulose paper copper-clad laminated sheet of defined flammability (vertical burning test)

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EN-FR U
IEC 60249-2-7:1987/AMD3:1994 ED2

Amendment 3 - Base materials for printed circuits. Part 2: Specifications. Specification No. 7: Phenolic cellulose paper copper-clad laminated sheet of defined flammability (vertical burning test)

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EN-FR U 52(SEC.)/376/CD
IEC 60249-2-7:1987/AMD4:2000 ED2

Amendment 4 - Base materials for printed circuits. Part 2: Specifications. Specification No. 7: Phenolic cellulose paper copper-clad laminated sheet of defined flammability (vertical burning test)

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EN-FR Y 52/850/FDIS
IEC 60249-2-8:1987 ED1

Base materials for printed circuits. Part 2: Specifications. Specification No. 8: Flexible copper-clad polyester (PETP) film

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EN-FR U
IEC 60249-2-8:1987/AMD1:1993 ED1

Amendment 1 - Base materials for printed circuits. Part 2: Specifications. Specification No. 8: Flexible copper-clad polyester (PETP) film

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EN-FR U
IEC 60249-2-9:1987 ED1

Base materials for printed circuits. Part 2: Specifications. Specification No. 9: Epoxide cellulose paper core, epoxide glass cloth surfaces copper-clad laminated sheet of defined flammability (vertical burning test)

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EN-FR U
IEC 60249-2-9/FRAG7 ED1

Requirements for surface waviness - Revision of Specification 249-2-9

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EN U 52/554/NP
IEC 60249-2-9:1987/AMD3:1993 ED1

Amendment 3 - Base materials for printed circuits. Part 2: Specifications. Specification No. 9: Epoxide cellulose paper core epoxide glass cloth surfaces copper-clad laminated sheet of defined flammability (vertical burning test)

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EN-FR U
IEC 60249-2-9:1987/AMD4:1994 ED1

Amendment 4 - Base materials for printed circuits. Part 2: Specifications. Specification No. 9: Epoxide cellulose paper core, epoxide glass cloth surfaces copper-clad laminated sheet of defined flammability (vertical burning test)

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EN-FR U 52(SEC.)/376/CD
IEC 60249-2-9:1987/AMD5:2000 ED1

Amendment 5 - Base materials for printed circuits. Part 2: Specifications. Specification No. 9: Epoxide cellulose paper core, epoxide glass cloth surfaces copper-clad laminated sheet of defined flammability (vertical burning test)

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EN-FR Y 52/858/FDIS
IEC 60249-2-10:1987 ED1

Base materials for printed circuits. Part 2: Specifications. Specification No. 10: Epoxide non-woven/woven glass reinforced copper-clad laminated sheet of defined flammability (vertical burning test)

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EN-FR U
IEC 60249-2-10:1987/AMD3:1993 ED1

Amendment No. 3 - Base materials for printed circuits. Part 2: Specifications - Specification No. 10: Epoxide non-woven/woven glass reinforced copper-clad laminated sheet of defined flammability (vertical burning test)

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EN-FR U
IEC 60249-2-10:1987/AMD4:1994 ED1

Amendment No. 4 - Base materials for printed circuits. Part 2: Specifications - Specification No. 10: Epoxide non-woven/woven glass reinforced copper-clad laminated sheet of defined flammability (vertical burning test)

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EN-FR U 52(SEC.)/376/CD
IEC 60249-2-10:1987/AMD5:2000 ED1

Amendment 5 - Base materials for printed circuits. Part 2: Specifications. Specification No. 10: Epoxide non-woven/woven glass reinforced copper-clad laminated sheet of defined flammability (vertical burning test)

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EN-FR Y 52/859/FDIS
IEC 60249-2-11 ED2

Introduction of a new subclause 6.6. to IEC 249-2-4, 249-2-5, 249-2-11 and 249-2-12 concerning the requirements for glass transition temperature and cure factor

MERGED
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  • Fragment merged
EN-FR Y 52/670/CDV
IEC 60249-2-11:1987 ED1

Base materials for printed circuits. Part 2: Specifications. Specification No. 11: Thin epoxide woven glass fabric copper-clad laminated sheet, general purpose grade for use in the fabrication of multilayer printed boards

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EN-FR U
IEC 60249-2-11:1987/AMD2:1993 ED1

Amendment 2 - Base materials for printed circuits. Part 2: Specifications. Specification No. 11: Thin epoxide woven glass fabric copper-clad laminated sheet, general purpose grade for use in the fabrication of multilayer printed boards

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EN-FR U
IEC 60249-2-11:1987/AMD3:1994 ED1

Amendment 3 - Base materials for printed circuits. Part 2: Specifications. Specification No. 11: Thin epoxide woven glass fabric copper-clad laminated sheet, general purpose grade for use in the fabrication of multilayer printed boards

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EN-FR U 52(SEC.)/376/CD
IEC 60249-2-11:1987/AMD4:2000 ED1

Amendment 4 - Base materials for printed circuits. Part 2: Specifications. Specification No. 11: Thin epoxide woven glass fabric copper-clad laminated sheet, general purpose grade for use in the fabrication of multilayer printed boards

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EN-FR Y 52/860/FDIS
IEC 60249-2-12:1987/AMD2:1993 ED2

Amendment 2 - Base materials for printed circuits - Part 2: Specifications - Specification No 12: Thin epoxide woven glass fabric copper-clad laminated sheet of defined flammability, for use in the fabrication of multilayer printed boards

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EN-FR U
IEC 60249-2-12:1987/AMD3:1994 ED2

Amendment 3 - Base materials for printed circuits. Part 2: Specifications. Specification No. 12: Thin epoxide woven glass fabric copper-clad laminated sheet of defined flammability, for use in the fabrication of multilayer printed boards

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EN-FR U 52(SEC.)/376/CD
IEC 60249-2-12:1987/AMD4:2000 ED2

Amendment 4 - Base materials for printed circuits. Part 2: Specifications. Specification No. 12: Thin epoxide woven glass fabric copper-clad laminated sheet of defined flammability, for use in the fabrication of multilayer printed boards

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EN-FR 2000-04 Y 52/852/FDIS
IEC 60249-2-13:1987 ED1

Base materials for printed circuits. Part 2: Specifications. Specification No. 13: Flexible copper-clad polyimide film, general purpose grade

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EN-FR U
IEC 60249-2-13:1987/AMD1:1993 ED1

Amendment 1 - Base materials for printed circuits. Part 2: Specifications. Specification No. 13: Flexible copper-clad polyimide film, general purpose grade

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EN-FR U 52(SEC.)/323/CD
IEC 60249-2-14:1988 ED1

Base materials for printed circuits. Part 2: Specifications. Specification No. 14: Phenolic cellulose paper copper-clad laminated sheet of defined flammability (vertical burning test), economic quality

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EN-FR U
IEC 60249-2-14:1988/AMD3:1993 ED1

Amendment No. 3 - Base materials for printed circuits. Part 2: Specifications. Specification No. 14: Phenolic cellulose paper copper-clad laminated sheet of defined flammability (vertical burning test), economic quality

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EN-FR U
IEC 60249-2-14:1988/AMD4:1994 ED1

Amendment 4 - Base materials for printed circuits. Part 2: Specifications. Specification No. 14: Phenolic cellulose paper copper-clad laminated sheet of defined flammability (vertical burning test), economic quality

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EN-FR U 52(SEC.)/376/CD
IEC 60249-2-14:1988/AMD5:2000 ED1

Amendment 5 - Base materials for printed circuits. Part 2: Specifications. Specification No. 14: Phenolic cellulose paper copper-clad laminated sheet of defined flammability (vertical burning test), economic quality

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EN-FR Y 52/862/FDIS
IEC 60249-2-15:1987 ED1

Base materials for printed circuits. Part 2: Specifications. Specification No. 15: Flexible copper-clad polyimide film, of defined flammability

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EN-FR U
IEC 60249-2-15:1987/AMD1:1993 ED1

Amendment 1 - Base materials for printed circuits. Part 2: Specifications. Specification No. 15: Flexible copper-clad polyimide film, of defined flammability

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EN-FR U 52(SEC.)/323/CD
IEC 60249-2-16:1992 ED1

Base materials for printed circuits - Part 2: Specifications - Specification No. 16: Polyimide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test)

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EN-FR U
IEC 60249-2-16:1992/AMD1:1993 ED1

Amendment 1 - Base materials for printed circuits - Part 2: Specifications - Specification No. 16: Polyimide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test)

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EN-FR U 52(SEC.)/323/CD
IEC 60249-2-16:1992/AMD2:1994 ED1

Amendment No. 2 - Base materials for printed circuits - Part 2: Specifications - Specification No. 16: Polyimide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test)

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EN-FR U 52(SEC.)/376/CD
IEC 60249-2-16:1992/AMD3:2000 ED1

Amendment 3 - Base materials for printed circuits - Part 2: Specifications - Specification No. 16: Polyimide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test)

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EN-FR Y 52/863/FDIS
IEC 60249-2-17:1992 ED1

Base materials for printed circuits - Part 2: Specifications - Specification No. 17: Thin polyimide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards

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EN-FR U
IEC 60249-2-17:1992/AMD1:1993 ED1

Amendment 1 - Base materials for printed circuits - Part 2: Specifications - Specification No. 17: Thin polyimide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards

DELPUB
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EN-FR U 52(SEC.)/323/CD
IEC 60249-2-17:1992/AMD2:1994 ED1

Amendment 2 - Base materials for printed circuits - Part 2: Specifications - Specification No. 17: Thin polyimide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards

DELPUB
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  • Deleted publication
EN-FR U 52(SEC.)/376/CD
IEC 60249-2-17:1992/AMD3:2000 ED1

Amendment 3 - Base materials for printed circuits - Part 2: Specifications - Specification No. 17: Thin polyimide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards

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EN-FR Y 52/864/FDIS
IEC 60249-2-18:1992 ED1

Base materials for printed circuits - Part 2: Specifications - Specification No. 18: Bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test)

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EN-FR U
IEC 60249-2-18:1992/AMD1:1993 ED1

Amendment No. 1 - Base materials for printed circuits - Part 2: Specifications - Specification No. 18: Bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test)

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EN-FR U
IEC 60249-2-18:1992/AMD2:1994 ED1

Amendment No. 2 - Base materials for printed circuits - Part 2: Specifications - Specification No. 18: Bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test)

DELPUB
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EN-FR U 52(SEC.)/376/CD
IEC 60249-2-18:1992/AMD3:2000 ED1

Amendment 3 - Base materials for printed circuits - Part 2: Specifications - Specification No. 18: Bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test)

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EN-FR Y 52/865/FDIS
IEC 60249-2-19:1992 ED1

Base materials for printed circuits - Part 2: Specifications - Specification No. 19: Thin bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards

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EN-FR U
IEC 60249-2-19:1992/AMD1:1993 ED1

Amendment 1 - Base materials for printed circuits - Part 2: Specifications - Specification No. 19: Thin bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards

WPUB
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EN-FR U 52(SEC.)/323/CD
IEC 60249-2-19:1992/AMD2:1994 ED1

Amendment 2 - Base materials for printed circuits - Part 2: Specifications - Specification No. 19: Thin bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards

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EN-FR U 52(SEC.)/376/CD
IEC 60249-3-1 ED3

Systematic review of IEC 60249-3-1 (1981)

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  • Deleted/abandoned
EN-FR U
IEC 60249-3-1:1981 ED2

Base materials for printed circuits. Part 3: Special materials used in connection with printed circuits. Specification No. 1: Prepreg for use as bonding sheet material in the fabrication of multilayer printed boards

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EN-FR U
IEC 60249-3-3 ED2

Base materials for printed circuits - Part 3: Special materials used in connection with printed circuits - Specification No. 3: Permanent polymer coating materials (solder resist) for use in the fabrication of printed boards (Revision of IEC 249-3-3)

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  • DEL
  • Deleted/abandoned
EN U 52(SEC.)/356/NP
IEC 60249-3-3:1991 ED1

Base materials for printed circuits - Part 3: Special materials used in connection with printed circuits - Specification No. 3: Permanent polymer coating materials (solder resist) for use in the fabrication of printed boards

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EN-FR U
IEC 60249-3A ED2

Base materials for printed circuits - Part 3: Special materials used in connection with printed circuits - First supplement: Specification No. 2: Specification for copper foil for use in the manufacture of copper-clad base materials. Note: Still valid, will be renumbered as 249-3-2 when next revised

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EN-FR U
IEC 60321 ED2

Systematic review of IEC 321 (1970)

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  • DEL
  • Deleted/abandoned
EN-FR U
IEC 60321-2 ED2

Systematic review of IEC 321-2 (1987)

DEL
  • DEL
  • Deleted/abandoned
EN-FR U
IEC 60321-3 ED2

Systematic review of IEC 321-3 (1990)

DEL
  • DEL
  • Deleted/abandoned
EN-FR U
IEC 60321-3:1990 ED1

Auxiliary printed board information. Part 3: Guidelines for artwork

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EN-FR U
IEC 60326-1:1984 ED1

Printed boards - Part 1: General information for the specification writer

DELPUB
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EN-FR U
IEC 60326-2:1990 ED3

Printed boards. Part 2: Test methods

WPUB
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EN-FR U
IEC 60326-2:1990/AMD1:1992 ED3

Amendment 1 - Printed boards. Part 2: Test methods

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EN-FR U
IEC 60326-3 ED3

Systematic review of IEC 326-3 (1991)

DEL
  • DEL
  • Deleted/abandoned
EN-FR U
IEC 60326-3:1991 ED2

Printed boards - Part 3: Design and use of printed boards

WPUB
  • WPUB
  • Publication withdrawn
EN-FR U
IEC 60326-4 ED2

Systematic review of IEC 326-4 (1980)

DEL
  • DEL
  • Deleted/abandoned
EN-FR U
IEC 60326-4:1980 ED1

Printed boards - Part 4: Specification for single and double sided printed boards with plain holes

WPUB
  • WPUB
  • Publication withdrawn
EN-FR U
IEC 60326-4:1980/AMD1:1989 ED1

Amendment 1 - Printed boards. Part 4: Specification for single and double sided printed boards with plain holes

WPUB
  • WPUB
  • Publication withdrawn
EN-FR U
IEC 60326-5 ED2

Systematic review of IEC 326-5 (1980)

DEL
  • DEL
  • Deleted/abandoned
EN-FR U
IEC 60326-5:1980 ED1

Printed boards - Part 5: Specification for single and double sided printed boards with plated-through holes

WPUB
  • WPUB
  • Publication withdrawn
EN-FR U
IEC 60326-5:1980/AMD1:1989 ED1

Amendment 1 - Printed boards. Part 5: Specification for single and double sided printed boards with plated-through holes

WPUB
  • WPUB
  • Publication withdrawn
EN-FR U
IEC 60326-6:1980 ED1

Printed boards. Part 6: Specification for multilayer printed boards.

DELPUB
  • DELPUB
  • Deleted publication
EN-FR U
IEC 60326-6:1980/AMD2:1990 ED1

Amendment 2 - Printed boards. Part 6: Specification for multilayer printed boards.

DELPUB
  • DELPUB
  • Deleted publication
EN-FR U
IEC 60326-7 ED2

Systematic review of IEC 326-7 (1981)

DEL
  • DEL
  • Deleted/abandoned
EN-FR U
IEC 60326-7:1981 ED1

Printed boards. Part 7: Specification for single and double sided flexible printed boards without through connections

WPUB
  • WPUB
  • Publication withdrawn
EN-FR U
IEC 60326-7:1981/AMD1:1989 ED1

Amendment 1 - Printed boards. Part 7: Specification for single and double sided flexible printed boards without through connections

WPUB
  • WPUB
  • Publication withdrawn
EN-FR U
IEC 60326-8 ED2

Systematic review of IEC 326-8 (1981)

DEL
  • DEL
  • Deleted/abandoned
EN-FR U
IEC 60326-8:1981 ED1

Printed boards. Part 8: Specification for single and double sided flexible printed boards with through connections

WPUB
  • WPUB
  • Publication withdrawn
EN-FR U
IEC 60326-8:1981/AMD1:1989 ED1

Amendment 1 - Printed boards. Part 8: Specification for single and double sided flexible printed boards with through connections

WPUB
  • WPUB
  • Publication withdrawn
EN-FR U
IEC 60326-9 ED2

Systematic review of IEC 326-9 (1991)

DEL
  • DEL
  • Deleted/abandoned
EN-FR U
IEC 60326-9:1991 ED1

Printed boards - Part 9: Specification for flexible multilayer printed boards with through connections

WPUB
  • WPUB
  • Publication withdrawn
EN-FR U
IEC 60326-10 ED2

Systematic review of IEC 326-10 (1991)

DEL
  • DEL
  • Deleted/abandoned
EN-FR U
IEC 60326-10:1991 ED1

Printed boards - Part 10: Specification for flex-rigid double-sided printed boards with through connections

WPUB
  • WPUB
  • Publication withdrawn
EN-FR U
IEC 60326-11 ED2

Systematic review of IEC 326-11 (1991)

DEL
  • DEL
  • Deleted/abandoned
EN-FR U
IEC 60326-11:1991 ED1

Printed boards - Part 11: Specification for flex-rigid multilayer printed boards with through connections

WPUB
  • WPUB
  • Publication withdrawn
EN-FR U
IEC 60326-12:1992 ED1

Printed boards - Part 12: Specification for mass lamination panels (semi-manufactured multilayer printed boards)

WPUB
  • WPUB
  • Publication withdrawn
EN-FR U
IEC 61182-1:1994 ED1

Printed boards - Electronic data description and transfer - Part 1: Printed board description in digital form

WPUB
  • WPUB
  • Publication withdrawn
EN-FR U 91/1407/RR PDF file 77 kB
IEC 61182-2:2006 ED1

Printed board assembly products - Manufacturing description data and transfer methodology - Part 2: Generic requirements

WPUB
  • WPUB
  • Publication withdrawn
EN 2006-03 N 91/1411/RR PDF file 78 kB
IEC 61182-2-2:2012 ED1

Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2: Sectional requirements for implementation of printed board fabrication data description

WPUB
  • WPUB
  • Publication withdrawn
EN-FR 2012-05 Y 91/1412/RR PDF file 78 kB
IEC 61182-7:1995 ED1

Printed boards - Electronic data description and transfer - Part 7: Bare board electrical test information in digital form

WPUB
  • WPUB
  • Publication withdrawn
EN-FR Y 91/1408/RR PDF file 78 kB
IEC 61182-7:1995/COR1:2002 ED1

Corrigendum 1 - Printed boards - Electronic data description and transfer - Part 7: Bare board electrical test information in digital form

WPUB
  • WPUB
  • Publication withdrawn
EN-FR U
IEC 61182-10:1999 ED1

Printed boards - Electronic data description and transfer - Part 10: Electronic data hierarchy

WPUB
  • WPUB
  • Publication withdrawn
EN U 91/1409/RR PDF file 77 kB
IEC PAS 61182-12:2014 ED1

Generic requirements for printed board assembly products manufacturing description data and transfer methodology

PPUB
  • PPUB
  • Publication issued
EN 2014-08 U Webstore
IEC 61185/AMD2/FRAG1 ED1

Fiducial standard specification

DEL
  • DEL
  • Deleted/abandoned
EN U 91(SEC.)/36/CD
IEC 61188-1-1:1997 ED1

Printed boards and printed board assemblies - Design and use - Part 1-1: Generic requirements - Flatness considerations for electronic assemblies

WPUB
  • WPUB
  • Publication withdrawn
EN-FR Y 91/1669/RR PDF file 76 kB
IEC 61188-1-2:1998 ED1

Printed boards and printed board assemblies - Design and use - Part 1-2: Generic requirements - Controlled impedance

WPUB
  • WPUB
  • Publication withdrawn
EN-FR Y 91/1670/RR PDF file 76 kB
IEC 61188-2 ED1

Design and use of printed boards and printed board assemlies - Part 2: Guide to the use of printed wiring board substrate materials - Surface mount technology

DEL
  • DEL
  • Deleted/abandoned
EN-FR N 52/686/CDV
IEC 61188-5 ED1

IEC 1188-5 - Design of printed boards and printed boards assemblies - Part 5: Sectional design requirements - Attachment (land/joint) considerations (Revision of IEC 321)

DEL
  • DEL
  • Deleted/abandoned
EN U 91(SEC.)/59/NP
IEC 61188-5-1:2002 ED1

Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements

DELPUB
  • DELPUB
  • Deleted publication
EN-FR Y 52/826/CDV PDF file 55193 kB
IEC 61188-5-2:2003 ED1

Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components

PPUB
  • PPUB
  • Publication issued
EN-FR Y Webstore
IEC 61188-5-3:2007 ED1

Printed boards and printed board assemblies - Design and use - Part 5-3: Attachment (land/joint) considerations - Components with gull-wing leads on two sides

PPUB
  • PPUB
  • Publication issued
EN-FR 2007-11 Y Webstore
MERGED
  • MERGED
  • Publication merged with EN version
FR 2009-08 U
IEC 61188-5-4:2007 ED1

Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides

PPUB
  • PPUB
  • Publication issued
EN-FR 2007-11 Y Webstore
MERGED
  • MERGED
  • Publication merged with EN version
FR 2009-10 U
IEC 61188-5-5:2007 ED1

Printed boards and printed board assemblies - Design and use - Part 5-5: Attachment (land/joint) considerations - Components with gull-wing leads on four sides

PPUB
  • PPUB
  • Publication issued
EN-FR 2007-11 Y Webstore
MERGED
  • MERGED
  • Publication merged with EN version
FR 2009-10 U
IEC 61188-5-6:2003 ED1

Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations - Chip carriers with J-leads on four sides

PPUB
  • PPUB
  • Publication issued
EN-FR Y Webstore
IEC 61188-5-7 ED1

Design and use of printed boards and printed board assemblies - Part 5: Sectional design and use requirements - Attachment (Land/joint) considerations - Section 7: Components with Post (DIP) mounting leads on two sides

DEL
  • DEL
  • Deleted/abandoned
EN Y 52/619/CC PDF file 162 kB
IEC 61188-5-8:2007 ED1

Printed board and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA)

PPUB
  • PPUB
  • Publication issued
EN-FR 2007-11 Y Webstore
MERGED
  • MERGED
  • Publication merged with EN version
FR 2010-01 U
IEC 61188-6-1:2021 ED1

Circuit boards and circuit board assemblies - Design and use - Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards

PPUB
  • PPUB
  • Publication issued
EN-FR 2021-03 Y Webstore
IEC 61188-6-2:2021 ED1

Circuit boards and circuit board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD)

PPUB
  • PPUB
  • Publication issued
EN-FR 2021-03 Y Webstore
IEC 61188-6-3 ED1

Circuit boards and circuit board assemblies - Design and use - Part 6-3: Land pattern design - Description of land pattern for through hole components (THT)

PCC
  • PCC
  • Preparation of CC
EN 2022-12 Y 91/1700/CD
PDF file 478 kB
IEC 61188-6-4:2019 ED1

Printed boards and printed board assemblies - Design and use - Part 6-4: Land pattern design - Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design

PPUB
  • PPUB
  • Publication issued
EN-FR 2019-05 Y Webstore
IEC 61188-7:2017 ED2

Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction

PPUB
  • PPUB
  • Publication issued
EN 2017-04 Y Webstore
IEC 61188-7/FRAGF ED2

Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction

MERGED
  • MERGED
  • Publication merged with EN version
FR Y
IEC 61188-7:2009 ED1

Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction

DELPUB
  • DELPUB
  • Deleted publication
EN-FR 2009-06 Y 91/854/FDIS
MERGED
  • MERGED
  • Publication merged with EN version
FR 2009-11 U
IEC 61188-7:2009/COR1:2009 ED1

Corrigendum 1 - Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction

DELPUB
  • DELPUB
  • Deleted publication
EN U
IEC TR 61188-8:2021 ED1

Circuit boards and circuit board assemblies - Design and use - Part 8: 3D shape data for CAD component library

PPUB
  • PPUB
  • Publication issued
EN 2021-01 U Webstore
IEC 61188-8-1 ED1

Component shape data specification for CAD library - Part 8-1 Generic Descriptions of the 2D and 3D description

DEL
  • DEL
  • Deleted/abandoned
EN 2010-12 U 91/885/CC Word file 101 kB
PDF file 209 kB
IEC 61189-1:1997+AMD1:2001 CSV ED1.1

Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology

PPUB
  • PPUB
  • Publication issued
EN-FR U Webstore
IEC 61189-1:1997 ED1

Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology

PPUB
  • PPUB
  • Publication issued
EN-FR Y Webstore
IEC 61189-1/FRAG2 ED1

Test methods for interconnection structures (printed boards) - Test N11: Pre-conditioning, 125°C

MERGED
  • MERGED
  • Fragment merged
EN Y 52/541/CC
IEC 61189-1:1997/AMD1:2001 ED1

Amendment 1 - Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology

PPUB
  • PPUB
  • Publication issued
EN-FR Y Webstore
IEC 61189-2:2006 ED2

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures

PPUB
  • PPUB
  • Publication issued
EN 2006-03 Y Webstore
IEC 61189-2:1997 ED1

Test methods for electrical materials, interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures

DELPUB
  • DELPUB
  • Deleted publication
EN-FR Y 52/636/FDIS
IEC 61189-2/FRAG1 ED1

Test Method for Halogen-free Copper-Clad Laminates

MERGED
  • MERGED
  • Fragment merged
EN U 91/240/NP PDF file 47 kB
IEC 61189-2:1997/AMD1:2000 ED1

Amendment 1 - Test methods for electrical materials, interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures

DELPUB
  • DELPUB
  • Deleted publication
EN Y 52/832/FDIS
IEC 61189-2/AMD1/FRAG16 ED1

Test mehods for materials for interconnection structures - Test E14: Arc resistance

MERGED
  • MERGED
  • Fragment merged
EN Y 52/529/CC
IEC 61189-2/AMD1/FRAG17 ED1

Test methods for materials for interconnection structures - Test M25: Time to delamination by TMA

MERGED
  • MERGED
  • Fragment merged
EN Y 52/530/CC
IEC 61189-2/AMD1/FRAG18 ED1

Test methods for materials for interconnection structures - Test M27: Resin flow properties of coverlay films, bonding films and adhesive cast films used in the fabrication of flexible printed wiring boards

MERGED
  • MERGED
  • Fragment merged
EN Y 52/531/CC
IEC 61189-2/AMD2 ED1

Amendment 2 to IEC 1189-2: Test methods for electrical materials, interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures

CAN
  • CAN
  • Draft Cancelled
EN Y 52/794/CDV PDF file 95 kB
IEC 61189-2-501 ED1

Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-501: Test methods for materials for interconnection structures – Measurement of Resilience strength and Resilience strength Retention Factor of Flexible Dielectric Materials

PRVC
  • PRVC
  • Preparation of RVC
EN-FR 2022-02 Y 91/1661/CDV
PDF file 851 kB
PDF file 830 kB
IEC 61189-2-628 ED1

IEC 61189-2-628,Ed.1: Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-628: Mechanical test methods for printed board and assembly materials - Glass transition temperature of base material by dynamic mechanical analysis(DMA; bend and pull)

DEL
  • DEL
  • Deleted/abandoned
EN 2012-03 U 91/805/NP PDF file 182 kB
IEC 61189-2-629 ED1

Test method of adhesion between a dielectric and inkjet printed circuits to be used for printed elecronics sheet(board) application

DEL
  • DEL
  • Deleted/abandoned
EN 2015-03 U 91/1000/NP PDF file 395 kB
IEC 61189-2-630:2018 ED1

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-630: Test methods for materials for interconnection structures - Moisture absorption after pressure vessel conditioning

PPUB
  • PPUB
  • Publication issued
EN-FR 2018-06 Y Webstore
IEC 61189-2-719:2016 ED1

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-719: Test methods for materials for interconnection structures - Relative permittivity and loss tangent (500 MHz to 10 GHz)

PPUB
  • PPUB
  • Publication issued
EN-FR 2016-07 Y Webstore
IEC 61189-2-719/FRAG1 ED1

Future IEC 61189-2-719 Ed. 1.0: Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-719: Electrical test methods for printed board and assembly materials - Relative permittivity and dissipation factor (500MHz to 10GHz)

DEL
  • DEL
  • Deleted/abandoned
EN 2012-03 U 91/806/NP PDF file 237 kB
IEC 61189-2-720 ED1

Future IEC 61189-2-720 Ed. 1.0: Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-720: Electrical test methods for printed board and assembly materials - Relative permittivity and dissipation factor (1MHz)

DEL
  • DEL
  • Deleted/abandoned
EN 2012-03 U 91/807/NP PDF file 221 kB
IEC 61189-2-721:2015 ED1

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-721: Test methods for materials for interconnection structures - Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency using a split post dielectric resonator

PPUB
  • PPUB
  • Publication issued
EN-FR 2015-05 Y Webstore
IEC 61189-2-801 ED1

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-801: Thermal conductivity test for base materials

CDM
  • CDM
  • CD to be discussed at meeting
EN 2022-04 Y 91/1611/CC PDF file 133 kB
Word file 36 kB
IEC 61189-2-803 ED1

Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-803: Test methods for Z-Axis Expansion of base materials and printed board

CDM
  • CDM
  • CD to be discussed at meeting
EN 2022-04 Y 91/1612/CC PDF file 182 kB
Word file 36 kB
IEC 61189-2-804 ED1

Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-804: Test methods for time to delamination – T260, T288, T300

CDM
  • CDM
  • CD to be discussed at meeting
EN 2022-04 Y 91/1613/CC PDF file 153 kB
Word file 35 kB
IEC 61189-2-805 ED1

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-805: X/Y CTE Test for Thin Base Materials by TMA

PCC
  • PCC
  • Preparation of CC
EN 2022-08 Y 91/1696/CD
PDF file 741 kB
IEC 61189-2-807 ED1

Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-807: Test methods for materials for interconnection structures – Decomposition Temperature (Td) using TGA

CCDV
  • CCDV
  • Draft circulated as CDV
EN-FR 2022-03 Y 91/1697/CDV
PDF file 281 kB
PDF file 240 kB
IEC 61189-2-808 ED1

Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-808: Thermal resistance of dielectric layer by thermal transient method

PCC
  • PCC
  • Preparation of CC
EN 2023-10 Y 91/1690/CD
PDF file 687 kB
IEC 61189-3:2007 ED2

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)

PPUB
  • PPUB
  • Publication issued
EN-FR 2007-10 Y Webstore
MERGED
  • MERGED
  • Publication merged with EN version
FR 2012-01 U
IEC 61189-3:1997+AMD1:1999 CSV ED1.1

Test methods for electrical materials, interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)

DELPUB
  • DELPUB
  • Deleted publication
EN-FR U
IEC 61189-3:1997 ED1

Test methods for electrical materials, interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)

DELPUB
  • DELPUB
  • Deleted publication
EN-FR 1997-03 Y 52/627/FDIS
IEC 61189-3:1997/AMD1:1999 ED1

Amendment 1 - Test methods for electrical materials, interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)

DELPUB
  • DELPUB
  • Deleted publication
EN-FR 1999-07 Y 52/805/FDIS
IEC 61189-3/AMD1/FRAG1 ED1

Amendment No. 1 to IEC 1189-3 - Tests 3N01, 3N04 to 3N06, 3N08, 3X07 and 3X10

MERGED
  • MERGED
  • Fragment merged
EN-FR Y 52/589/CDV
IEC 61189-3/AMD1/FRAG6 ED1

Test methods for interconnection structures (printed boards) - Test N04: Thermal shock , dip soldering

MERGED
  • MERGED
  • Fragment merged
EN U 52/536/CC
IEC 61189-3/AMD1/FRAG7 ED1

Test methods for interconnection structures (printed boards) - Test N05: Thermal shock, floating, solder bath 280°C

MERGED
  • MERGED
  • Fragment merged
EN U 52/537/CC
IEC 61189-3/AMD1/FRAG8 ED1

Test methods for interconnection structures (printed boards) - Test N06: Damp heat, steady state

MERGED
  • MERGED
  • Fragment merged
EN U 52/538/CC
IEC 61189-3/AMD1/FRAG9 ED1

Test methods for interconnection structures (printed boards) - Test N08: Thermal shock, immersion, fluidized sand bath

MERGED
  • MERGED
  • Fragment merged
EN Y 52/539/CC
IEC 61189-3/AMD1/FRAGF ED1

Amendment 1 - Test methods for electrical materials, interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)

MERGED
  • MERGED
  • Publication merged with EN version
EN-FR U
IEC 61189-3/AMD1/FRAG12 ED1

Test methods for interconnection structures (printed boards) - Test X07: Edge dip test for surface mount conductors and attachment lands

MERGED
  • MERGED
  • Fragment merged
EN Y 52/542/CC
IEC 61189-3/AMD1/FRAG13 ED1

Test methods for interconnection structures (printed boards) - Test X10: Rotary dip test for plated through holes, surface mount conductors and attachment lands

MERGED
  • MERGED
  • Fragment merged
EN Y 52/543/CC
IEC 61189-3/AMD2 ED1

Amendment 2 to IEC 61189-3: Test methods for electrical materials, interconnection structures and assemblies - Part 3: Test methods for interconnection structures

CAN
  • CAN
  • Draft Cancelled
EN Y 52/795/CDV PDF file 66 kB
IEC 61189-3/AMD2/FRAG1 ED1

Test methods for interconnection structures (printed boards) - Test E08: PTH resistance change, thermal cycling

MERGED
  • MERGED
  • Fragment merged
EN U 52/533/CC
IEC TS 61189-3-301:2016 ED1

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-301: Test methods for interconnection structures (printed boards) - Appearance inspection method for plated surfaces on PWB

PPUB
  • PPUB
  • Publication issued
EN 2016-08 N Webstore
IEC 61189-3-719:2016 ED1

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling

PPUB
  • PPUB
  • Publication issued
EN-FR 2016-01 Y Webstore
IEC 61189-3-913:2016 ED1

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-913: Test method for thermal conductivity of electronic circuit boards for high-brightness LEDs

PPUB
  • PPUB
  • Publication issued
EN-FR 2016-01 Y Webstore
IEC PAS 61189-3-913:2011 ED1

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-913: Test methods for interconnection structures (printed boards) - Electronic circuit board for high-brightness LEDs

DELPUB
  • DELPUB
  • Deleted publication
EN 2011-03 U 91/928/PAS PDF file 1313 kB
IEC TR 61189-3-914:2017 ED1

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-914: Test method for thermal conductivity of printed circuit boards for high-brightness LEDs - Guidelines

PPUB
  • PPUB
  • Publication issued
EN 2017-04 N Webstore
IEC 61189-4/FRAG5 ED1

Test method of ultrasonic cleaning

DEL
  • DEL
  • Deleted/abandoned
EN U 91/75/CC
IEC 61189-5:2006 ED1

Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies

PPUB
  • PPUB
  • Publication issued
EN-FR 2006-08 Y Webstore
IEC 61189-5/FRAGF ED1

Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies

MERGED
  • MERGED
  • Publication merged with EN version
EN-FR 2008-05 U
IEC 61189-5-1:2016 ED1

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies

PPUB
  • PPUB
  • Publication issued
EN-FR 2016-06 Y Webstore
IEC 61189-5-2:2015 ED1

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies

PPUB
  • PPUB
  • Publication issued
EN-FR 2015-01 Y Webstore
IEC 61189-5-3:2015 ED1

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies

PPUB
  • PPUB
  • Publication issued
EN-FR 2015-01 Y Webstore
IEC 61189-5-4:2015 ED1

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies

PPUB
  • PPUB
  • Publication issued
EN-FR 2015-01 Y Webstore
IEC 61189-5-5 ED1

Test methods for electrical materials, interconnection structures and assemblies - Part 5-5: Test methods for printed board assemblies - Surface insulation resistance (SIR)

DEL
  • DEL
  • Deleted/abandoned
EN 2014-09 Y 91/1021/RR PDF file 78 kB
IEC 61189-5-301:2021 ED1

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-301: General test methods for materials and assemblies - Soldering paste using fine solder particles

PPUB
  • PPUB
  • Publication issued
EN-FR 2021-04 Y Webstore
IEC 61189-5-501:2021 ED1

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-501: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of solder fluxes

PPUB
  • PPUB
  • Publication issued
EN-FR 2021-02 Y Webstore
IEC 61189-5-502:2021 ED1

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-502: General test methods for materials and assemblies - Surface Insulation Resistance (SIR) testing of assemblies

PPUB
  • PPUB
  • Publication issued
EN-FR 2021-02 Y Webstore
IEC 61189-5-503:2017 ED1

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards

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EN 2017-06 Y Webstore
IEC 61189-5-503/FRAGF ED1

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards

MERGED
  • MERGED
  • Publication merged with EN version
FR Y
IEC 61189-5-504:2020 ED1

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-504: General test methods for materials and assemblies - Process ionic contamination testing (PICT)

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EN-FR 2020-05 Y Webstore
IEC TR 61189-5-506:2019 ED1

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-506: General test methods for materials and assemblies - An intercomparison evaluation to implement the use of fine-pitch test structures for surface insulation resistance (SIR) testing of solder fluxes in accordance with IEC 61189-5-501

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EN 2019-07 U Webstore
IEC 61189-5-601:2021 ED1

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-601: General test methods for materials and assemblies - Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards

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EN-FR 2021-02 Y Webstore
IEC 61189-6:2006 ED1

Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in manufacturing electronic assemblies

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EN-FR 2006-08 Y Webstore
IEC 61189-6/FRAGF ED1

Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in manufacturing electronic assemblies

MERGED
  • MERGED
  • Publication merged with EN version
EN-FR 2008-05 U
IEC 61189-11:2013 ED1

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys

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EN-FR 2013-05 Y Webstore
IEC 61190-1-1:2002 ED1

Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly

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  • Publication issued
EN-FR Y Webstore
IEC 61190-1-2:2014 ED3

Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly

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  • Publication issued
EN-FR 2014-03 Y Webstore
IEC 61190-1-2:2007 ED2

Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly

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EN-FR 2007-04 Y 91/646/FDIS
IEC 61190-1-2/FRAGF ED2

Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly

MERGED
  • MERGED
  • Publication merged with EN version
EN-FR 2008-05 U
IEC 61190-1-2:2002 ED1

Attachment materials for electronic assembly - Part 1-2: Requirements for solder pastes for high-quality interconnections in electronics assembly

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EN-FR 2002-04 Y 91/278/FDIS

IEC 61190-1-3:2017 ED3

Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications

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EN-FR 2018-01 Y Webstore
IEC 61190-1-3:2007+AMD1:2010 CSV ED2.1

Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

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EN-FR U
IEC 61190-1-3:2007 ED2

Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

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EN-FR 2007-06 Y 91/647/FDIS
IEC 61190-1-3/FRAGF ED2

Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

MERGED
  • MERGED
  • Publication merged with EN version
EN-FR 2008-05 U
IEC 61190-1-3:2007/AMD1:2010 ED2

Amendment 1 - Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

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EN-FR 2010-06 Y 91/920/FDIS

IEC 61190-1-3:2002 ED1

Attachment materials for electronic assembly - Part 1-3:Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

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EN-FR 2002-04 Y 91/279/FDIS

IEC 61190-1-6 ED1

Attachment materials for electronic assembly - Part-1-6: Requirements for electronic grade lead free solder alloys and fluxed and non-fluxed lead free solid solder for electronic soldering applications

CAN
  • CAN
  • Draft Cancelled
EN 2007-04 U 91/378/NP PDF file 269 kB
IEC 61190-1-7 ED1

Attachment materials for electronic assembly - Part-1-7: Requirements for lead free solder pastes for high quality interconnections in electronics assembly

CAN
  • CAN
  • Draft Cancelled
EN 2007-04 U 91/379/NP PDF file 909 kB
IEC 61191-1:2018 ED3

Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies

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EN-FR 2018-10 Y Webstore
IEC 61191-1:2013 ED2

Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies

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EN-FR 2013-05 Y 91/1089A/FDIS

IEC 61191-1:1998 ED1

Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies

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EN-FR 1998-09 Y 91/131/FDIS
IEC 61191-2:2017 ED3

Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies

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EN 2017-05 Y Webstore
IEC 61191-2/FRAGF ED3

Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies

MERGED
  • MERGED
  • Publication merged with EN version
FR Y
IEC 61191-2:2017/COR1:2019 ED3

Corrigendum 1 - Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies

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EN Y Webstore
IEC 61191-2:2013 ED2

Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies

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EN-FR 2013-06 Y 91/1091/FDIS

IEC 61191-2:1998 ED1

Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies

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EN-FR 1998-09 Y 91/136/FDIS
IEC 61191-3:2017 ED2

Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies

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EN 2017-06 Y Webstore
IEC 61191-3/FRAGF ED2

Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies

MERGED
  • MERGED
  • Publication merged with EN version
FR Y
IEC 61191-3:1998 ED1

Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies

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  • Deleted publication
EN-FR Y 91/133/FDIS
IEC 61191-4:2017 ED2

Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies

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EN 2017-08 Y Webstore
IEC 61191-4:1998 ED1

Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies

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  • Deleted publication
EN-FR Y 91/135/FDIS
IEC 61191-6:2010 ED1

Printed board assemblies - Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method

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EN-FR 2010-02 Y Webstore
IEC TR 61191-7:2020 ED1

Printed board assemblies - Part 7: Technical cleanliness of components and printed board assemblies

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EN 2020-04 U Webstore
IEC TR 61191-8:2021 ED1

Printed board assemblies - Part 8: Voiding in solder joints of printed board assemblies for use in automotive electronic control units - Best practices

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EN 2021-04 N Webstore
IEC 61192-1:2003 ED1

Workmanship requirements for soldered electronic assemblies - Part 1: General

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EN-FR Y 91/1537/RR PDF file 80 kB
IEC 61192-2:2003 ED1

Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assemblies

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  • Publication withdrawn
EN-FR Y 91/1538A/RR PDF file 82 kB
IEC 61192-3:2002 ED1

Workmanship requirements for soldered electronic assemblies - Part 3: Through-hole mount assemblies

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  • Publication withdrawn
EN-FR Y 91/1539A/RR PDF file 82 kB
IEC 61192-4:2002 ED1

Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies

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  • Publication withdrawn
EN-FR Y 91/1540A/RR PDF file 82 kB
IEC 61192-5:2007 ED1

Workmanship requirements for soldered electronic assemblies - Part 5: Rework, modification and repair of soldered electronic assemblies

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EN-FR 2007-07 Y 91/1541/RR PDF file 79 kB
IEC 61192-5/FRAGF ED1

Workmanship requirements for soldered electronic assemblies - Part 5: Rework, modification and repair of soldered electronic assemblies

MERGED
  • MERGED
  • Publication merged with EN version
EN-FR 2008-05 U
IEC 61192-6 ED1

Product performance requirements - Part 6: Guide to the rework of unassembled boards

DEL
  • DEL
  • Deleted/abandoned
EN U 91/245/NP PDF file 141 kB
IEC 61193-1:2001 ED1

Quality assessment systems - Part 1: Registration and analysis of defects on printed board assemblies

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EN-FR Y Webstore
MERGED
  • MERGED
  • Publication merged with EN version
FR U
IEC 61193-2:2007 ED1

Quality assessment systems - Part 2: Selection and use of sampling plans for inspection of electronic components and packages

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EN 2007-09 Y Webstore
IEC 61193-3:2013 ED1

Quality assessment systems - Part 3: Selection and use of sampling plans for printed board and laminate end-product and in-process auditing

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EN-FR 2013-02 Y Webstore
IEC 61249-2 ED1

Generic specification for reinforced base materials, clad and unclad

CAN
  • CAN
  • Draft Cancelled
EN U 52/514/NP PDF file 129 kB
IEC 61249-2-1:2005 ED1

Materials for printed boards and other interconnecting structures - Part 2-1: Reinforced base materials, clad and unclad - Phenolic cellulose paper reinforced laminated sheets, economic grade, copper clad

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EN-FR Y Webstore
IEC 61249-2-1/FRAG1 ED1

Requirements for punching and machining properties of laminates - Revision of Specification 249-2-1 to (Sub-clause 5.5)

DEL
  • DEL
  • Deleted/abandoned
EN U 52/552/NP
IEC 61249-2-1/FRAG3 ED1

Requirements for pull-off strength - Revision of Specification 249-2-1

DEL
  • DEL
  • Deleted/abandoned
EN U 52/553/NP
IEC 61249-2-2:2005 ED1

Materials for printed boards and other interconnecting structures - Part 2-2: Reinforced base materials, clad and unclad - Phenolic cellulose paper reinforced laminated sheets, high electrical grade, copper-clad

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EN-FR Y Webstore
IEC 61249-2-2/FRAG1 ED1

Requirements for pull-off strength - Revision of Specification 249-2-2

DEL
  • DEL
  • Deleted/abandoned
EN U 52/553/NP
IEC 61249-2-2/FRAG2 ED1

Requirements for punching and machining properties of laminates - Revision of Specification 249-2-2 (Sub-clause 5.5)

DEL
  • DEL
  • Deleted/abandoned
EN U 52/552/NP
IEC 61249-2-4:2001 ED1

Materials for printed boards and other interconnecting structures - Part 2-4: Reinforced base materials, clad and unclad - Polyester non-woven/woven fibreglass laminated sheet of defined flammability (vertical burning test), copper-clad

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  • Publication issued
EN-FR Y Webstore
IEC 61249-2-5:2003 ED1

Materials for printed boards and other interconnecting structures - Part 2-5: Reinforced base materials, clad and unclad - Brominated epoxide cellulose paper reinforced core/woven E-glass reinforced surfaces laminated sheets of defined flammability (vertical burning test), copper-clad

PPUB
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  • Publication issued
EN-FR Y Webstore
IEC 61249-2-6:2003 ED1

Materials for printed boards and other interconnecting structures - Part 2-6: Reinforced base materials, clad and unclad - Brominated epoxide non-woven/woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad

PPUB
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  • Publication issued
EN-FR Y Webstore
IEC 61249-2-7:2002 ED1

Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad

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EN-FR Y Webstore
IEC 61249-2-7/FRAG4 ED1

Requirements for glass transition temperature and cure factor - Revision of Specification 249-2-7

DEL
  • DEL
  • Deleted/abandoned
EN U 52/555/NP
IEC 61249-2-7/FRAG6 ED1

Requirements for surface waviness - Revision of Specification 249-2-7

DEL
  • DEL
  • Deleted/abandoned
EN U 52/554/NP
IEC 61249-2-7/FRAG7 ED1

Requirements for glass transition temperature and cure factor - Revision of Specification 249-2-7

DEL
  • DEL
  • Deleted/abandoned
EN U 52/555/NP
IEC 61249-2-7/FRAG8 ED1

Requirements for surface waviness - Amendment to Specification 249-2-7

DEL
  • DEL
  • Deleted/abandoned
EN U 52/554/NP
IEC 61249-2-7/FRAG9 ED1

Requirements for glass transition temperature and cure factor - Amendment to Specification 249-2-7

DEL
  • DEL
  • Deleted/abandoned
EN U 52/555/NP
IEC 61249-2-7/FRAG12 ED1

Requirements for punching and machining properties of laminates - Revision of Specification 249-2-7 (Sub-clause 5.5)

DEL
  • DEL
  • Deleted/abandoned
EN U 52/552/NP
IEC 61249-2-7/FRAG13 ED1

Requirements for surface waviness - Revision of Specification 249-2-7

DEL
  • DEL
  • Deleted/abandoned
EN U 52/554/NP
IEC 61249-2-7/FRAG14 ED1

Laminate construction - Revision of IEC 249-2-7

DEL
  • DEL
  • Deleted/abandoned
EN U 52(DE)/209/NP
IEC 61249-2-8:2003 ED1

Materials for printed boards and other interconnecting structures - Part 2-8: Reinforced base materials clad and unclad - Modified brominated epoxide woven fibreglass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad

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EN-FR Y Webstore
IEC 61249-2-9:2003 ED1

Materials for printed boards and other interconnecting structures - Part 2-9: Reinforced base materials, clad and unclad - Bismaleimide/triazine modified epoxide or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad

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EN-FR 2002-12 Y Webstore
IEC 61249-2-9/FRAG5 ED1

Requirements for surface waviness - Revision of Specification 249-2-9

DEL
  • DEL
  • Deleted/abandoned
EN U 52/554/NP
IEC 61249-2-9/FRAG6 ED1

Requirements for pull-off strength - Revision of Specification 249-2-9

DEL
  • DEL
  • Deleted/abandoned
EN U 52/553/NP
IEC 61249-2-10:2003 ED1

Materials for printed boards and other interconnecting structures - Part 2-10: Reinforced base materials clad and unclad - Cyanate ester, brominated epoxide, modified or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad

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EN-FR Y Webstore
IEC 61249-2-11:2003 ED1

Materials for printed boards and other interconnecting structures - Part 2-11: Reinforced base materials, clad and unclad - Polyimide, brominated epoxide modified or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad

PPUB
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EN-FR Y Webstore
IEC 61249-2-11/FRAG2 ED1

Requirements for surface waviness - Amendment to Specification 249-2-11

DEL
  • DEL
  • Deleted/abandoned
EN U 52/554/NP
IEC 61249-2-12:1999 ED1

Materials for printed boards and other interconnecting structures - Part 2-12: Sectional specification set for reinforced base materials, clad and unclad - Epoxide non-woven aramid laminate of defined flammability, copper-clad

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  • Publication issued
EN-FR Y Webstore
IEC 61249-2-12/FRAGF ED1

Materials for printed boards and other interconnecting structures - Part 2-12: Sectional specification set for reinforced base materials, clad and unclad - Epoxide non-woven aramid laminate of defined flammability, copper-clad

MERGED
  • MERGED
  • Publication merged with EN version
EN-FR U
IEC 61249-2-13:1999 ED1

Materials for printed boards and other interconnecting structures - Part 2-13: Sectional specification set for reinforced base materials, clad and unclad - Cyanate ester non-woven aramid laminate of defined flammability, copper-clad

PPUB
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  • Publication issued
EN-FR Y Webstore
IEC 61249-2-13/FRAGF ED1

Materials for printed boards and other interconnecting structures - Part 2-13: Sectional specification set for reinforced base materials, clad and unclad - Cyanate ester non-woven aramid laminate of defined flammability, copper-clad

MERGED
  • MERGED
  • Publication merged with EN version
EN-FR U
IEC 61249-2-18:2002 ED1

Materials for printed boards and other interconnecting structures - Part 2-18: Reinforced base materials, clad and unclad - Polyester non-woven fibreglass reinforced laminated sheet of defined flammability (vertical burning test), copper-clad

PPUB
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EN-FR Y Webstore
IEC 61249-2-19:2001 ED1

Materials for printed boards and other interconnecting structures - Part 2-19: Reinforced base materials, clad and unclad - Epoxide cross-plied linear fibreglass-reinforced laminated sheets of defined flammability (vertical burning test), copper clad

PPUB
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  • Publication issued
EN-FR Y Webstore
IEC 61249-2-21:2003 ED1

Materials for printed boards and other interconnecting structures - Part 2-21: Reinforced base materials, clad and unclad - Non-halogenated epoxide woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad

PPUB
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  • Publication issued
EN-FR Y Webstore
IEC 61249-2-22:2005 ED1

Materials for printed boards and other interconnecting structures - Part 2-22: Reinforced base materials clad and unclad - Modified non-halogenated epoxide woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad

PPUB
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  • Publication issued
EN-FR Y Webstore
IEC 61249-2-23:2005 ED1

Materials for printed boards and other interconnecting structures - Part 2-23: Reinforced base materials, clad and unclad - Non-halogenated phenolic cellulose paper reinforced laminated sheets, economic grade, copper clad

PPUB
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  • Publication issued
EN-FR Y Webstore
IEC 61249-2-26:2005 ED1

Materials for printed boards and other interconnecting structures - Part 2-26: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad

PPUB
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  • Publication issued
EN-FR Y Webstore
IEC 61249-2-27:2012 ED1

Materials for printed boards and other interconnecting structures - Part 2-27: Reinforced base materials clad and unclad - Bismaleimide/triazine modified with non-halogenated epoxide woven glass laminate sheets of defined flammability (vertical burning test), copper-clad

PPUB
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  • Publication issued
EN-FR 2012-11 Y Webstore
IEC 61249-2-30:2012 ED1

Materials for printed boards and other interconnecting structures - Part 2-30: Reinforced base materials clad and unclad - Non-halogenated epoxide modified cyanate ester woven glass laminate of defined flammability (vertical burning test), copper-clad

PPUB
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  • Publication issued
EN-FR 2012-11 Y Webstore
IEC 61249-2-31:2009 ED1

Materials for printed boards and other interconnecting structures - Part 2-31: Reinforced base materials, clad and unclad - Halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined relative permittivity (equal to or less than 4,1 at 1 GHz) and flammability (vertical burning test), copper-clad

PPUB
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  • Publication issued
EN-FR 2009-02 Y Webstore
IEC 61249-2-32:2009 ED1

Materials for printed boards and other interconnecting structures - Part 2-32: Reinforced base materials, clad and unclad - Halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined relative permittivity (equal to or less than 3,7 at 1 GHz) and flammability (vertical burning test), copper-clad

PPUB
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  • Publication issued
EN-FR 2009-02 Y Webstore
IEC 61249-2-33:2009 ED1

Materials for printed boards and other interconnecting structures - Part 2-33: Reinforced base materials, clad and unclad - Non-halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined relative permittivity (equal to or less than 4,1 at 1 GHz) and flammability (vertical burning test), copper-clad

PPUB
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  • Publication issued
EN-FR 2009-02 Y Webstore
IEC 61249-2-34:2009 ED1

Materials for printed boards and other interconnecting structures - Part 2-34: Reinforced base materials, clad and unclad - Non-halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined relative permittivity (equal to or less than 3,7 at 1 GHz) and flammability (vertical burning test), copper-clad

PPUB
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  • Publication issued
EN-FR 2009-02 Y Webstore
IEC 61249-2-35:2008 ED1

Materials for printed boards and other interconnecting structures - Part 2-35: Reinforced base materials, clad and unclad - Modified epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly

PPUB
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  • Publication issued
EN-FR 2008-12 Y Webstore
IEC 61249-2-36:2008 ED1

Materials for printed boards and other interconnecting structures - Part 2-36: Reinforced base materials, clad and unclad - Epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly

PPUB
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  • Publication issued
EN-FR 2008-12 Y Webstore
IEC 61249-2-37:2008 ED1

Materials for printed boards and other interconnecting structures - Part 2-37: Reinforced base materials, clad and unclad - Modified non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly

PPUB
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  • Publication issued
EN-FR 2008-12 Y Webstore
IEC 61249-2-38:2008 ED1

Materials for printed boards and other interconnecting structures - Part 2-38: Reinforced base materials, clad and unclad - Non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly

PPUB
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  • Publication issued
EN-FR 2008-12 Y Webstore
IEC 61249-2-39:2012 ED1

Materials for printed boards and other interconnecting structures - Part 2-39: Reinforced base materials clad and unclad - High performance epoxide and non-epoxide, woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly

PPUB
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  • Publication issued
EN-FR 2012-11 Y Webstore
IEC 61249-2-40:2012 ED1

Materials for printed boards and other interconnecting structures - Part 2-40: Reinforced base materials, clad and unclad - High performance, non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly

PPUB
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  • Publication issued
EN-FR 2012-11 Y Webstore
IEC 61249-2-41:2010 ED1

Materials for printed boards and other interconnecting structures - Part 2-41: Reinforced base materials clad and unclad - Brominated epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly

PPUB
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  • Publication issued
EN-FR 2010-04 Y Webstore
IEC 61249-2-42:2010 ED1

Materials for printed boards and other interconnecting structures - Part 2-42: Reinforced base materials clad and unclad - Brominated epoxide non-woven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly

PPUB
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  • Publication issued
EN-FR 2010-04 Y Webstore
IEC 61249-2-43:2016 ED1

Materials for printed boards and other interconnecting structures - Part 2-43: Reinforced base materials clad and unclad - Non-halogenated epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly

PPUB
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  • Publication issued
EN-FR 2016-05 Y Webstore
IEC 61249-2-44:2016 ED1

Materials for printed boards and other interconnecting structures - Part 2-44: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly

PPUB
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  • Publication issued
EN-FR 2016-05 Y Webstore
IEC 61249-2-45:2018 ED1

Materials for printed boards and other interconnecting structures - Part 2-45: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 1,0 W/(m•K) and defined flammability (vertical burning test), copper-clad for lead-free assembly

PPUB
  • PPUB
  • Publication issued
EN 2018-01 Y Webstore
IEC 61249-2-45/FRAGF ED1

Materials for printed boards and other interconnecting structures - Part 2-45: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 1,0 W/(m•K) and defined flammability (vertical burning test), copper-clad for lead-free assembly

MERGED
  • MERGED
  • Publication merged with EN version
FR Y
IEC 61249-2-46:2018 ED1

Materials for printed boards and other interconnecting structures - Part 2-46: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 1,5 W/(m•K) and defined flammability (vertical burning test), copper-clad for lead-free assembly

PPUB
  • PPUB
  • Publication issued
EN 2018-01 Y Webstore
IEC 61249-2-46/FRAGF ED1

Materials for printed boards and other interconnecting structures - Part 2-46: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 1,5 W/(m•K) and defined flammability (vertical burning test), copper-clad for lead-free assembly

MERGED
  • MERGED
  • Publication merged with EN version
FR Y
IEC 61249-2-47:2018 ED1

Materials for printed boards and other interconnecting structures - Part 2-47: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 2,0 W/(m•K) and defined flammability (vertical burning test), copper-clad for lead-free assembly

PPUB
  • PPUB
  • Publication issued
EN 2018-01 Y Webstore
IEC 61249-2-50 ED3

Bow and twist requirements - Amendment to IEC 249-2-1 to 7, 9, 10, 14, 16, 18

MERGED
  • MERGED
  • Fragment merged
EN Y 52/733/CC
IEC PAS 61249-3-1:2007 ED1

Materials for printed boards and other interconnecting structures - Part 3-1: Copper-clad laminates for flexible boards (adhesive and non-adhesive types)

WPUB
  • WPUB
  • Publication withdrawn
EN 2007-05 U 91/1237/RR PDF file 21 kB
IEC TS 61249-3-1 ED1

Materials for printed boards and other interconnecting structures - Copper-Clad Laminates for Flexible Boards (Adhesive and Non-adhesive types)

CAN
  • CAN
  • Draft Cancelled
EN 2011-01 Y 91/818B/CC PDF file 214 kB
IEC 61249-3-3:1999 ED1

Materials for printed boards and other interconnecting structures - Part 3-3: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Adhesive coated flexible polyester film

PPUB
  • PPUB
  • Publication issued
EN-FR Y Webstore
IEC 61249-3-3/FRAGF ED1

Materials for printed boards and other interconnecting structures - Part 3-3: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Adhesive coated flexible polyester film

MERGED
  • MERGED
  • Publication merged with EN version
EN-FR U
IEC 61249-3-4:1999 ED1

Materials for printed boards and other interconnecting structures - Part 3-4: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Adhesive coated flexible polyimide film

PPUB
  • PPUB
  • Publication issued
EN-FR Y Webstore
IEC 61249-3-4/FRAGF ED1

Materials for printed boards and other interconnecting structures - Part 3-4: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Adhesive coated flexible polyimide film

MERGED
  • MERGED
  • Publication merged with EN version
EN-FR U
IEC 61249-3-5:1999 ED1

Materials for printed boards and other interconnecting structures - Part 3-5: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Transfer adhesive films

PPUB
  • PPUB
  • Publication issued
EN-FR Y Webstore
IEC 61249-3-5/FRAGF ED1

Materials for printed boards and other interconnecting structures - Part 3-5: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Transfer adhesive films

MERGED
  • MERGED
  • Publication merged with EN version
EN-FR U
IEC 61249-4 ED1

Sectional specification set for prepreg materials, B-stage, unclad (for use as bonding sheets)

DEL
  • DEL
  • Deleted/abandoned
EN U 52/516/NP
IEC 61249-4-1:2008 ED1

Materials for printed boards and other interconnecting structures - Part 4-1: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability

PPUB
  • PPUB
  • Publication issued
EN-FR 2008-02 Y Webstore
IEC 61249-4-1/FRAG2 ED1

Selection of prepregs for multilayer board construction - Revision of Specification 249-4-1

DEL
  • DEL
  • Deleted/abandoned
EN U 52/556/NP
IEC 61249-4-1/FRAG3 ED1

Selection of prepregs for multilayer board construction - Revision of Specifiction 249-4-1 (or 326-3)

DEL
  • DEL
  • Deleted/abandoned
EN U 52/556/NP
IEC 61249-4-1/FRAG4 ED1

Requirements for melting viscosity - Revision to Specification 249-4-1

DEL
  • DEL
  • Deleted/abandoned
EN U 52/557/NP
MERGED
  • MERGED
  • Publication merged with EN version
FR 2009-08 U
IEC 61249-4-2:2005 ED1

Materials for printed boards and other interconnecting structures - Part 4-2: Sectional specification set for prepreg materials, unclad - Multifunctional epoxide woven E-glass prepreg of defined flammability

PPUB
  • PPUB
  • Publication issued
EN Y Webstore
IEC 61249-4-5:2005 ED1

Materials for printed boards and other interconnecting structures - Part 4-5: Sectional specification set for prepreg materials, unclad - Polyimide, modified or unmodified, woven E-glass prepreg of defined flammability

PPUB
  • PPUB
  • Publication issued
EN Y Webstore
IEC 61249-4-11:2005 ED1

Materials for printed boards and other interconnecting structures - Part 4-11: Sectional specification set for prepreg materials, unclad - Non-halogenated epoxide, woven E-glass prepreg of defined flammability

PPUB
  • PPUB
  • Publication issued
EN-FR Y Webstore
IEC 61249-4-12:2005 ED1

Materials for printed boards and other interconnecting structures - Part 4-12: Sectional specification set for prepreg materials, unclad - Non-halogenated multifunctional epoxide woven E-glass prepreg of defined flammability

PPUB
  • PPUB
  • Publication issued
EN-FR Y Webstore
IEC 61249-4-14:2009 ED1

Materials for printed boards and other interconnecting structures - Part 4-14: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly

PPUB
  • PPUB
  • Publication issued
EN-FR 2009-06 Y Webstore
MERGED
  • MERGED
  • Publication merged with EN version
FR 2009-10 U
IEC 61249-4-15:2009 ED1

Materials for printed boards and other interconnecting structures - Part 4-15: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly

PPUB
  • PPUB
  • Publication issued
EN-FR 2009-06 Y Webstore
MERGED
  • MERGED
  • Publication merged with EN version
FR 2009-10 U
IEC 61249-4-16:2009 ED1

Materials for printed boards and other interconnecting structures - Part 4-16: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly

PPUB
  • PPUB
  • Publication issued
EN-FR 2009-06 Y Webstore
MERGED
  • MERGED
  • Publication merged with EN version
FR 2009-10 U
IEC 61249-4-17:2009 ED1

Materials for printed boards and other interconnecting structures - Part 4-17: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly

PPUB
  • PPUB
  • Publication issued
EN-FR 2009-06 Y Webstore
MERGED
  • MERGED
  • Publication merged with EN version
FR 2009-10 U
IEC 61249-4-18:2013 ED1

Materials for printed boards and other interconnecting structures - Part 4-18: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly

PPUB
  • PPUB
  • Publication issued
EN-FR 2013-10 Y Webstore
IEC 61249-4-19:2013 ED1

Materials for printed boards and other interconnecting structures - Part 4-19: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly

PPUB
  • PPUB
  • Publication issued
EN-FR 2013-10 Y Webstore
IEC 61249-5-1:1995 ED1

Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with and without coatings - Section 1: Copper foils (for the manufacture of copper-clad base materials)

PPUB
  • PPUB
  • Publication issued
EN-FR Y Webstore
IEC 61249-5-4:1996 ED1

Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with or without coatings - Section 4: Conductive inks

PPUB
  • PPUB
  • Publication issued
EN-FR Y Webstore
IEC 61249-6-3 ED1

Materials for printed boards and other interconnecting structures – Part 6-3: Sectional specification set for reinforcement materials - Specification for finished fabric woven from “E” glass for printed boards

PRVC
  • PRVC
  • Preparation of RVC
EN-FR 2022-01 Y 91/1680/CDV PDF file 319 kB

PDF file 348 kB
IEC PAS 61249-6-3:2011 ED1

Specification for finished fabric woven from "E" glass for printed boards

PPUB
  • PPUB
  • Publication issued
EN 2011-07 U Webstore
IEC 61249-7-1:1995 ED1

Materials for interconnection structures - Part 7: Sectional specification set for restraining core materials - Section 1: Copper/invar/copper

PPUB
  • PPUB
  • Publication issued
EN-FR Y Webstore
IEC PAS 61249-8-1:2014 ED1

Qualification and performance of electrical insulating compound for printed wiring assemblies

PPUB
  • PPUB
  • Publication issued
EN 2014-09 U Webstore
IEC PAS 61249-8-5:2014 ED1

Qualification and performance specification of permanent solder mask and flexible cover materials

PPUB
  • PPUB
  • Publication issued
EN 2014-09 U Webstore
IEC 61249-8-7:1996 ED1

Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 7: Marking legend inks

PPUB
  • PPUB
  • Publication issued
EN-FR Y Webstore
IEC 61249-8-8:1997 ED1

Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 8: Temporary polymer coatings

PPUB
  • PPUB
  • Publication issued
EN-FR Y Webstore
IEC 61445:2012 ED1

Digital Test Interchange Format (DTIF)

PPUB
  • PPUB
  • Publication issued
EN 2012-05 N Webstore
IEC 61523-1:2012 ED2

Delay and power calculation standards - Part 1: Integrated circuit delay and power calculation systems

PPUB
  • PPUB
  • Publication issued
EN 2012-07 N Webstore
IEC 61523-1:2001 ED1

Delay and power calculation standards - Part 1: Integrated circuit delay and power calculation systems

DELPUB
  • DELPUB
  • Deleted publication
EN 2001-10 Y 93/143/FDIS
IEC 61523-2:2002 ED1

Delay and power calculation standards - Part 2: Pre-layout delay calculation specification for CMOS ASIC libraries

WPUB
  • WPUB
  • Publication withdrawn
EN 2002-05 Y 93/311/RR PDF file 21 kB
IEC 61523-3:2004 ED1

Delay and power calculation standards - Part 3: Standard Delay Format (SDF) for the electronic design process

PPUB
  • PPUB
  • Publication issued
EN U Webstore
IEC 61523-4:2015 ED1

Design and Verification of Low-Power Integrated Circuits

PPUB
  • PPUB
  • Publication issued
EN 2015-03 N Webstore
IEC 61636 ED2

Software Interface for Maintenance Information Collection and Analysis (SIMICA) (IEEE Std 1636-2018)

CFDIS
  • CFDIS
  • Draft circulated as FDIS
EN 2021-06 N 91/1716/FDIS PDF file 2366 kB
IEC 61636:2016 ED1

Software interface for Maintenance Information Collection and Analysis (SIMICA)

PPUB
  • PPUB
  • Publication issued
EN 2016-08 U Webstore
IEC 61636-1 ED2

Software interface for maintenance information collection and analysis (SIMICA): Exchanging test results and session information via the extensible markup language (XML) (IEEE Std 1636.1-2018)

CFDIS
  • CFDIS
  • Draft circulated as FDIS
EN 2021-06 N 91/1717/FDIS PDF file 2297 kB
IEC 61636-1:2016 ED1

Software interface for maintenance information collection and analysis (SIMICA): Exchanging test results and session information via the extensible markup language (XML)

PPUB
  • PPUB
  • Publication issued
EN 2016-08 U Webstore
IEC 61636-99:2016 ED1

Software Interface for Maintenance Information Collection and Analysis (SIMICA): Common Information Elements

PPUB
  • PPUB
  • Publication issued
EN 2016-08 U Webstore
IEC 61671:2012 ED1

Automatic Test Markup Language (ATML) for Exchanging Automatic Test Equipment and Test Information via XML

PPUB
  • PPUB
  • Publication issued
EN 2012-06 N Webstore
IEC 61671-2:2016 ED1

Standard for automatic test markup language (ATML) instrument description

PPUB
  • PPUB
  • Publication issued
EN 2016-03 N Webstore
IEC 61671-4:2016 ED1

Standard for automatic test markup language (ATML) test configuration

PPUB
  • PPUB
  • Publication issued
EN 2016-03 N Webstore
IEC 61671-5:2016 ED1

Standard for automatic test markup language (ATML) test adapter description

PPUB
  • PPUB
  • Publication issued
EN 2016-03 N Webstore
IEC 61671-6:2016 ED1

Standard for automatic test markup language (ATML) test station description

PPUB
  • PPUB
  • Publication issued
EN 2016-04 N Webstore
IEC 61690-1:2000 ED1

Electronic design interchange format (EDIF) - Part 1: Version 3 0 0. (This publication is available in electronic HTML format only)

PPUB
  • PPUB
  • Publication issued
EN Y Webstore
MERGED
  • MERGED
  • Publication merged with EN version
FR 2014-02 U
IEC 61690-2:2000 ED1

Electronic design interchange format (EDIF) - Part 2: Version 4 0 0. (This publication is available in electronic HTML format only)

PPUB
  • PPUB
  • Publication issued
EN-FR Y Webstore
MERGED
  • MERGED
  • Publication merged with EN version
FR 2014-02 U
IEC 61691-1 ED2

Electronic design automation - Part 1: VHSIC Hardware description language VHDL 1076a

DEL
  • DEL
  • Deleted/abandoned
EN U 93/22/NP
IEC 61691-1:1997 ED1

Design automation - Part 1: VHDL language reference manual

WPUB
  • WPUB
  • Publication withdrawn
EN Y 93/42/FDIS
IEC 61691-1-1:2011 ED2

Behavioural languages - Part 1-1: VHDL Language Reference Manual

PPUB
  • PPUB
  • Publication issued
EN N Webstore
IEC 61691-1-1:2004 ED1

Behavioural languages - Part 1-1: VHDL language reference manual

DELPUB
  • DELPUB
  • Deleted publication
EN 2004-06 U 93/193/FDIS
IEC 61691-2:2001 ED1

Behavioural languages - Part 2: VHDL multilogic system for model interoperability

WPUB
  • WPUB
  • Publication withdrawn
EN 1996-12 Y 93/311/RR PDF file 21 kB
IEC 61691-3-1 ED1

Electronic design automation - Part 3-1: Extensions to and supplementary packages for the VHSIC Hardware Description Language VHDL 1076-1993 - Analog description in VHDL (P1076.1)

DEL
  • DEL
  • Deleted/abandoned
EN U 93/23/NP
IEC 61691-3-2:2001 ED1

Behavioural languages - Part 3-2: Mathematical operation in VHDL

WPUB
  • WPUB
  • Publication withdrawn
EN 2001-06 Y 93/311/RR PDF file 21 kB
IEC 61691-3-3:2001 ED1

Behavioural languages - Part 3-3: Synthesis in VHDL

WPUB
  • WPUB
  • Publication withdrawn
EN 2001-06 Y 93/311/RR PDF file 21 kB
IEC 61691-4:2004 ED1

Behavioural languages - Part 4: Verilog® hardware description language

WPUB
  • WPUB
  • Publication withdrawn
EN 2004-06 U 93/311/RR PDF file 21 kB
IEC 61691-5:2004 ED1

Behavioural languages - Part 5: VITAL ASIC (application specific integrated circuit) modeling specification

WPUB
  • WPUB
  • Publication withdrawn
EN U 93/294/RR PDF file 19 kB
IEC TR 61691-5 ED1

Electronic desing automation - Part 5: Library utilities for VHDL

CAN
  • CAN
  • Draft Cancelled
EN U 93/23/NP
IEC 61691-6 ED2

Behavioural languages – Part 6: VHDL Analog and Mixed-Signal Extensions (IEEE Std 1076.1-2017)

CFDIS
  • CFDIS
  • Draft circulated as FDIS
EN 2021-06 N 91/1715/FDIS PDF file 6524 kB
IEC 61691-6:2009 ED1

Behavioural languages - Part 6: VHDL Analog and Mixed-Signal Extensions

PPUB
  • PPUB
  • Publication issued
EN 2009-11 N Webstore
IEC 61691-6-1 ED1

Standard VHDL analog and mixed-signal extensions - Packages for multiple energy domain support (IEEE 1076.1.1-2004)

CAN
  • CAN
  • Draft Cancelled
EN 2009-09 N 93/278/FDIS PDF file 13 kB
IEC 61691-7:2009 ED1

Behavioural languages - Part 7: SystemC R Language Reference Manual

PPUB
  • PPUB
  • Publication issued
EN 2009-11 N Webstore
IEC 61691-8 ED1

Behavioural languages – Part 8: Standard SystemC Analog/Mixed-Signal Extensions Language Reference Manual (IEEE Std 1666.1-2016)

CFDIS
  • CFDIS
  • Draft circulated as FDIS
EN 2021-06 N 91/1712/FDIS PDF file 4673 kB
IEC 61692-1 ED1

Common rules for circulation of electronic catalogue data - Part 1: Extended mapping rules and methods

DEL
  • DEL
  • Deleted/abandoned
EN 1995-12 U 93/282/NP PDF file 269 kB
IEC 61693-1 ED1

Guidelines for test, validation, conformance and qualification for standards

DEL
  • DEL
  • Deleted/abandoned
EN U 93(US)/2A/NP
IEC 61760-1:2020 ED3

Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)

PPUB
  • PPUB
  • Publication issued
EN-FR 2020-07 Y Webstore
IEC 61760-1:2006 ED2

Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)

DELPUB
  • DELPUB
  • Deleted publication
EN-FR 2006-05 Y 91/577/FDIS
MERGED
  • MERGED
  • Publication merged with EN version
FR 2013-09 U
IEC 61760-1:1998 ED1

Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)

DELPUB
  • DELPUB
  • Deleted publication
EN-FR Y 91/134/FDIS
IEC 61760-2 ED3

Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide

APUB
  • APUB
  • Approved for publication
EN-FR 2021-11 Y 91/1666/CDV
PDF file 540 kB
PDF file 573 kB
IEC 61760-2:2007 ED2

Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide

PPUB
  • PPUB
  • Publication issued
EN-FR 2007-03 Y Webstore
IEC 61760-2/FRAGF ED2

Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide

MERGED
  • MERGED
  • Publication merged with EN version
EN-FR 2008-05 U
IEC 61760-2:1998 ED1

Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide

DELPUB
  • DELPUB
  • Deleted publication
EN-FR 1998-03 Y 91/124/FDIS
IEC 61760-3:2021 ED2

Surface mounting technology - Part 3: Standard method for the specification of components for through-hole reflow (THR) soldering

PPUB
  • PPUB
  • Publication issued
EN-FR 2021-02 Y Webstore
IEC 61760-3:2010 ED1

Surface mounting technology - Part 3: Standard method for the specification of components for through hole reflow (THR) soldering

DELPUB
  • DELPUB
  • Deleted publication
EN-FR 2010-03 Y 91/856/CDV PDF file 206 kB
PDF file 227 kB
IEC 61760-4:2015 ED1

Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices

PPUB
  • PPUB
  • Publication issued
EN-FR 2015-05 Y Webstore
IEC 61760-4:2015/AMD1:2018 ED1

Amendment 1 - Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices

PPUB
  • PPUB
  • Publication issued
EN-FR 2018-03 Y Webstore
IEC 61761 ED1

Generic specification - Capability approval for surface mount technologies

DEL
  • DEL
  • Deleted/abandoned
EN U 91/119/CD
IEC 61768 ED1

Solderability tests for component leads, terminations, lugs, terminals and wires

DEL
  • DEL
  • Deleted/abandoned
EN U 91(SEC.)/35/CC
IEC TR 61908:2004 ED1

The technology roadmap for industry data dictionary structure, utilization and implementation

PPUB
  • PPUB
  • Publication issued
EN N Webstore
IEC 61910 ED1

Interoperability Verilog and VHDL (Technical report)

DEL
  • DEL
  • Deleted/abandoned
EN U 93/167/NP PDF file 117 kB
IEC 61926-1:1999 ED1

Design automation - Part 1: Standard test language for all systems - Common abbreviated test language for all systems (C/ATLAS)

PPUB
  • PPUB
  • Publication issued
EN Y Webstore
IEC TR 61926-1-1:1999 ED1

Design automation - Part 1-1: Harmonization of ATLAS test languages

WPUB
  • WPUB
  • Publication withdrawn
EN U 91/1542/RR PDF file 79 kB
IEC 61926-2 ED1

IEC 61926-2 Standard Test Languages; Part 2; Test Language for All Systems Requirements

CAN
  • CAN
  • Draft Cancelled
EN U 93/166/NP PDF file 172 kB
IEC 62014-1:2001 ED1

Electronic design automation libraries - Part 1: Input/output buffer information specifications (IBIS version 3.2)

WPUB
  • WPUB
  • Publication withdrawn
EN Y 91/1414/RR PDF file 76 kB
IEC TR 62014-3:2002 ED1

Electronic design automation libraries - Part 3: Models of integrated circuits for EMI behavioural simulation

PPUB
  • PPUB
  • Publication issued
EN N Webstore
IEC 62014-4:2015 ED1

IP-XACT, Standard Structure for Packaging, Integrating, and Reusing IP within Tool Flows

PPUB
  • PPUB
  • Publication issued
EN 2015-04 N Webstore
IEC TR 62014-4 ED1

Cookbook for integrated Circuit model IECM described in IEC 62014-3

CAN
  • CAN
  • Draft Cancelled
EN N 93/155/DTR PDF file 364 kB
IEC 62014-5:2015 ED1

Quality of Electronic and Software Intellectual Property Used in System and System on Chip (SoC) Designs

PPUB
  • PPUB
  • Publication issued
EN 2015-02 N Webstore
IEC 62015-1 ED1

Design automation - Chip Hierarchical Design Systems Technical Data (CHDStd)

DEL
  • DEL
  • Deleted/abandoned
EN U 93/49/NP
IEC 62015-2 ED1

Advanced intermediate representation with extensibility/common environment (AIRE/CE)

DEL
  • DEL
  • Deleted/abandoned
EN U 93/72/NP
IEC 62016:2003 ED1

Core model of the electronics domain

WPUB
  • WPUB
  • Publication withdrawn
EN 1997-12 Y 91/1088/RR PDF file 65 kB
IEC TR 62017-1:2001 ED1

Documentation on design automation subjects - Part 1: EDA industry standards roadmap

WPUB
  • WPUB
  • Publication withdrawn
EN 2002-04 U 93/311/RR PDF file 21 kB
IEC TR 62017-2:2001 ED1

Documentation on design automation subjects - Part 2: EIAJ-EDA Technology Roadmap toward 2002

WPUB
  • WPUB
  • Publication withdrawn
EN 2001-02 U 93/311/RR PDF file 21 kB
IEC 62050:2005 ED1

VHDL Register Transfer Level (RTL) synthesis

WPUB
  • WPUB
  • Publication withdrawn
EN N 93/291/RR PDF file 19 kB
IEC PAS 62084:1998 ED1

Implementation of flip chip and chip scale technology

WPUB
  • WPUB
  • Publication withdrawn
EN U 91/139/PAS
IEC 62084 ED1

Implementation of flip chip and chip scale technology

DEL
  • DEL
  • Deleted/abandoned
EN U 91/139/PAS
IEC PAS 62085:1998 ED1

Implementation of ball grid array and other high density technology

WPUB
  • WPUB
  • Publication withdrawn
EN U 91/140/PAS
IEC 62085 ED1

Implementation of ball grid array and other high density technology

DEL
  • DEL
  • Deleted/abandoned
EN U 91/140/PAS
IEC 62090:2017 ED2

Product package labels for electronic components using bar code and two-dimensional symbologies

PPUB
  • PPUB
  • Publication issued
EN 2017-05 Y Webstore
IEC 62090/FRAGF ED2

Product package labels for electronic components using bar code and two-dimensional symbologies

MERGED
  • MERGED
  • Publication merged with EN version
FR Y
IEC 62090:2002 ED1

Product package labels for electronic components using bar code and two-dimensional symbologies

DELPUB
  • DELPUB
  • Deleted publication
EN-FR Y 91/329/FDIS

IEC 62119 ED1

Generic requirements for implementation of product manufacturing description data and transfer methodology

DEL
  • DEL
  • Deleted/abandoned
EN U 52/827/PAS PDF file 1363 kB
IEC PAS 62119:1999 ED1

Generic requirements for implementation of product manufacturing description data and transfer methodology

WPUB
  • WPUB
  • Publication withdrawn
EN U 52/827/PAS PDF file 1363 kB
IEC 62123 ED1

Performance guide Manual for single and double-sided flexible printed wiring boards

DEL
  • DEL
  • Deleted/abandoned
EN U 52/809/PAS PDF file 2334 kB
IEC PAS 62123:1999 ED1

Performance guide Manual for single- and double-sided flexible printed wiring boards

WPUB
  • WPUB
  • Publication withdrawn
EN U 52/809/PAS PDF file 2334 kB
IEC 62137:2004 ED1

Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN

DELPUB
  • DELPUB
  • Deleted publication
EN-FR 2004-06 Y 91/444/FDIS
IEC 62137/FRAGf ED1

Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN

MERGED
  • MERGED
  • Fragment merged
EN-FR U
IEC 62137:2004/COR1:2005 ED1

Corrigendum 1 - Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN

DELPUB
  • DELPUB
  • Deleted publication
EN U
IEC 62137-1-1:2007 ED1

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test

PPUB
  • PPUB
  • Publication issued
EN-FR 2007-08 Y Webstore
IEC 62137-1-1/FRAGF ED1

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test

MERGED
  • MERGED
  • Publication merged with EN version
EN-FR 2008-05 U
IEC 62137-1-2:2007 ED1

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test

PPUB
  • PPUB
  • Publication issued
EN-FR 2007-08 Y Webstore
IEC 62137-1-2/FRAGF ED1

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test

MERGED
  • MERGED
  • Publication merged with EN version
EN-FR 2008-05 U
IEC 62137-1-3:2008 ED1

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test

PPUB
  • PPUB
  • Publication issued
EN-FR 2008-12 Y Webstore
IEC 62137-1-4:2009 ED1

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-4: Cyclic bending test

PPUB
  • PPUB
  • Publication issued
EN-FR 2009-01 Y Webstore
IEC 62137-1-5:2009 ED1

Surface mounting technology - Environmental and endurance test methods for surface mount solder joints - Part 1-5: Mechanical shear fatigue test

PPUB
  • PPUB
  • Publication issued
EN-FR 2009-02 Y Webstore
IEC 62137-3:2011 ED1

Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints

PPUB
  • PPUB
  • Publication issued
EN-FR 2011-10 Y Webstore
IEC PAS 62137-3:2008 ED1

Electronics assembly technology - Selection guidance of environmental and endurance test methods for solder joints

DELPUB
  • DELPUB
  • Deleted publication
EN 2009-04 U 91/784/PAS PDF file 1006 kB
IEC 62137-4:2014 ED1

Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices

PPUB
  • PPUB
  • Publication issued
EN-FR 2014-10 Y Webstore
IEC 62142:2005 ED1

Verilog (R) register transfer level synthesis

WPUB
  • WPUB
  • Publication withdrawn
EN N 93/292/RR PDF file 19 kB
IEC PAS 62158:2000 ED1

Printed Board Manufacturers' Qualification Profile (MQP)

WPUB
  • WPUB
  • Publication withdrawn
EN U 52/841/PAS PDF file 351 kB
IEC 62158 ED1

Printed board manufacturers' qualification profile (MQP)

DEL
  • DEL
  • Deleted/abandoned
EN U 52/841/PAS PDF file 351 kB
IEC PAS 62159:2000 ED1

Electronic Assembly Manufacturers' Qualification Profile (AQP)

WPUB
  • WPUB
  • Publication withdrawn
EN U 52/842/PAS PDF file 438 kB
IEC 62159 ED1

Electronic assembly manufacturers' qualification profile (AQP)

DEL
  • DEL
  • Deleted/abandoned
EN U 52/842/PAS PDF file 438 kB
IEC 62160 ED1

Laminator qualification profile

DEL
  • DEL
  • Deleted/abandoned
EN U 52/843/PAS PDF file 315 kB
IEC PAS 62160:2000 ED1

Laminator Qualification Profile

WPUB
  • WPUB
  • Publication withdrawn
EN U 52/843/PAS PDF file 315 kB
IEC 62212 ED1

IPC-4130 - Specification and characterization methods for nonwoven "E" glass mat

DEL
  • DEL
  • Deleted/abandoned
EN U 52/870/PAS PDF file 64 kB
IEC PAS 62212:2001 ED1

Specification and characterization methods for nonwoven "E" glass mat

WPUB
  • WPUB
  • Publication withdrawn
EN U 52/870/PAS PDF file 64 kB
IEC PAS 62213:2001 ED1

Specification and characterization methods for nonwoven para-aramid reinforcement

WPUB
  • WPUB
  • Publication withdrawn
EN U 52/871/PAS PDF file 67 kB
IEC 62213 ED1

IPC-4411 - Specification and characterization methods for nonwoven para-aramid reinforcement

DEL
  • DEL
  • Deleted/abandoned
EN U 52/871/PAS PDF file 67 kB
IEC PAS 62214:2001 ED1

Generic performance specification for printed boards

WPUB
  • WPUB
  • Publication withdrawn
EN U 52/872/PAS PDF file 100 kB
IEC 62214 ED1

IPC-6011 - Generic performance specification for printed boards

DEL
  • DEL
  • Deleted/abandoned
EN U 52/872/PAS PDF file 100 kB
IEC 62218 ED1

Surface Insulation Resistance (SIR) - Test method for Assembled Printed Wiring Boards (PWB) - Test 5E02

DEL
  • DEL
  • Deleted/abandoned
EN U 91/224/CC PDF file 15 kB
IEC 62243:2012 ED2

Artificial Intelligence Exchange and Service Tie to All Test Environments (AI-ESTATE)

PPUB
  • PPUB
  • Publication issued
EN 2012-05 N Webstore
IEC 62243:2005 ED1

Artificial intelligence exchange and service tie to all test environments (Al-ESTATE)

DELPUB
  • DELPUB
  • Deleted publication
EN 2005-05 N 93/214/FDIS
IEC TR 62248:2002 ED1

Approaches to conformance and certification testing for automation standards

WPUB
  • WPUB
  • Publication withdrawn
EN 2002-12 N 93/311/RR PDF file 21 kB
IEC 62249 ED1

Qualification and performance specification for flexible printed boards (IPC-6013 with Amendment 1)

DEL
  • DEL
  • Deleted/abandoned
EN U 91/209/PAS PDF file 783 kB
IEC PAS 62249:2001 ED1

Qualification and performance specification for flexible printed boards

WPUB
  • WPUB
  • Publication withdrawn
EN U 91/209/PAS PDF file 783 kB
IEC PAS 62250:2001 ED1

Qualification and performance specification for rigid printed boards (IPC 6012A with Amendment 1)

WPUB
  • WPUB
  • Publication withdrawn
EN U 91/210/PAS PDF file 175 kB
IEC 62250 ED1

Qualification and performance specification for rigid printed boards (IPC-6012A with Amendment 1)

DEL
  • DEL
  • Deleted/abandoned
EN U 91/210/PAS PDF file 175 kB
IEC 62265:2005 ED1

Advanced Library Format (ALF) describing Integrated Circuit (IC) technology, cells and blocks

WPUB
  • WPUB
  • Publication withdrawn
EN N 93/293/RR PDF file 19 kB
IEC 62293 ED1

Qualification and performance specification for high density interconnect (HDI) layers or boards (IPC 6016)

DEL
  • DEL
  • Deleted/abandoned
EN U 91/248/PAS PDF file 305 kB
IEC PAS 62293:2001 ED1

Qualification and performance specification for high density interconnect (HDI) layers or boards (IPC 6016)

WPUB
  • WPUB
  • Publication withdrawn
EN U 91/248/PAS PDF file 305 kB
IEC 62326-1:2002 ED2

Printed boards - Part 1: Generic specification

PPUB
  • PPUB
  • Publication issued
EN-FR Y Webstore
IEC 62326-1:1996 ED1

Printed boards - Part 1: Generic specification

DELPUB
  • DELPUB
  • Deleted publication
EN-FR Y 52/654/FDIS
IEC 62326-2 ED1

Printed boards - Part 2: Rigid single and double-sided printed boards without interlayer connections - Sectional specification

DEL
  • DEL
  • Deleted/abandoned
EN Y 52/734/CC
IEC 62326-2/FRAG1 ED1

Additions to IEC 326-2: Ionic surface contamination test

DEL
  • DEL
  • Deleted/abandoned
EN U 52(SEC.)/329/CD
IEC 62326-2/FRAG2 ED1

Solderability test for printed boards - Updating 4 tests already existing in IEC 326-2

DEL
  • DEL
  • Deleted/abandoned
EN U 52(US)/127/NP
IEC 62326-2/FRAG3 ED1

Addition to IEC 326-2 - Test 14b: Solderability, wetting balance method

DEL
  • DEL
  • Deleted/abandoned
EN U 52(SEC.)/310/CD
IEC 62326-2-1 ED1

Printed boards - Part 2: Rigid single and double-sided printed boards without interlayer connections - Section 1: Capability detail specification - Performance level A, B and C

DEL
  • DEL
  • Deleted/abandoned
EN Y 52/735/CC
IEC 62326-3 ED1

Printed boards - Part 3: Rigid single and double-sided printed boards with interlayer connections - Sectional specification

DEL
  • DEL
  • Deleted/abandoned
EN 2006-09 Y 91/445/CDV PDF file 463 kB
IEC 62326-3-1 ED1

Printed boards - Part 3: Rigid single and double-sided printed boards with interlayer connections - Section 1: Capability detail specification - Performance level A, B and C

DEL
  • DEL
  • Deleted/abandoned
EN Y 52/737/CC
IEC 62326-4:1996 ED1

Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification

PPUB
  • PPUB
  • Publication issued
EN-FR Y Webstore
IEC 62326-4-1:1996 ED1

Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification - Section 1: Capability detail specification - Performance levels A, B and C

PPUB
  • PPUB
  • Publication issued
EN-FR Y Webstore
IEC 62326-7 ED1

Sectional specification for IECQ

DEL
  • DEL
  • Deleted/abandoned
EN U
IEC TS 62326-7-1 ED1

Printed boards - Part 7-1: Performance guide for single-and double-sided flexible printed boards

CAN
  • CAN
  • Draft Cancelled
EN 2011-01 Y 91/817B/CC PDF file 234 kB
IEC PAS 62326-7-1:2007 ED1

Performance guide for single- and double-sided flexible printed wiring boards

WPUB
  • WPUB
  • Publication withdrawn
EN 2007-04 U 91/1238/RR PDF file 21 kB
IEC 62326-8 ED1

Sectional specification for IECQ

DEL
  • DEL
  • Deleted/abandoned
EN U
IEC PAS 62326-14:2010 ED1

Printed boards - Part 14: Device embedded substrate - Terminology / reliability / design guide

WPUB
  • WPUB
  • Publication withdrawn
EN 2010-07 U 91/1239/RR PDF file 21 kB
IEC 62326-14 ED1

IEC 62326-14: Printed boards - Device Embedded Substrate - Terminology / Reliability / Design Guide

DEL
  • DEL
  • Deleted/abandoned
EN 2012-12 U 91/894A/NP PDF file 1485 kB
IEC PAS 62326-20:2011 ED1

Printed boards - Part 20: Electronic circuit board for high-brightness LEDs

DELPUB
  • DELPUB
  • Deleted publication
EN 2011-03 U 91/926/PAS PDF file 1807 kB
IEC 62326-20:2016 ED1

Printed boards - Part 20: Printed circuit boards for high-brightness LEDs

PPUB
  • PPUB
  • Publication issued
EN-FR 2016-02 Y Webstore
IEC 62362 ED1

A standard for an Advanced Library Format (ALF) describing Integrated Circuit (IC) technology, cells, and blocks

DEL
  • DEL
  • Deleted/abandoned
EN U 93/162/NP PDF file 1739 kB
IEC 62399 ED1

Test Plan for Validation of ALF using XML

DEL
  • DEL
  • Deleted/abandoned
EN U 93/169/NP PDF file 127 kB
IEC 62421:2007 ED1

Electronics assembly technology - Electronic modules

PPUB
  • PPUB
  • Publication issued
EN-FR 2007-09 Y Webstore
MERGED
  • MERGED
  • Publication merged with EN version
FR 2013-12 U
IEC 62468 ED1

The marking for presence and absence of the specified chemical substance in materials, components and mounted boards used in electrical and electronic equipment

CAN
  • CAN
  • Draft Cancelled
EN 2008-02 Y 91/642/CDV PDF file 431 kB
IEC 62525:2007 ED1

Standard Test Interface Language (STIL) for Digital Test Vector Data

PPUB
  • PPUB
  • Publication issued
EN 2007-09 U Webstore
IEC 62526:2007 ED1

Standard for Extensions to Standard Test Interface Language (STIL) for Semiconductor Design Environments

PPUB
  • PPUB
  • Publication issued
EN 2007-09 U Webstore
IEC 62527:2007 ED1

Standard for Extensions to Standard Test Interface Language (STIL) for DC Level Specification

PPUB
  • PPUB
  • Publication issued
EN 2007-09 U Webstore
IEC 62528:2007 ED1

Standard Testability Method for Embedded Core-based Integrated Circuits

PPUB
  • PPUB
  • Publication issued
EN 2007-09 U Webstore
IEC 62529:2012 ED2

Standard for Signal and Test Definition

PPUB
  • PPUB
  • Publication issued
EN 2012-06 N Webstore
IEC 62529:2007 ED1

Standard for Signal and Test Definition

DELPUB
  • DELPUB
  • Deleted publication
EN 2007-10 U 93/251/FDIS
IEC 62530 ED3

SystemVerilog - Unified Hardware Design, Specification, and Verification Language (IEEE Std 1800-2017)

CFDIS
  • CFDIS
  • Draft circulated as FDIS
EN 2021-06 N 91/1714/FDIS PDF file 10903 kB
IEC 62530:2011 ED2

SystemVerilog - Unified Hardware Design, Specification, and Verification Language

PPUB
  • PPUB
  • Publication issued
EN N Webstore
IEC 62530:2007 ED1

Standard for SystemVerilog - Unified Hardware Design, Specification, and Verification Language

DELPUB
  • DELPUB
  • Deleted publication
EN 2007-10 U 93/252/FDIS
IEC 62530-2 ED1

SystemVerilog – Part 2: Universal Verification Methodology Language Reference Manual (IEEE Std 1800.2-2017)

CFDIS
  • CFDIS
  • Draft circulated as FDIS
EN 2021-06 N 91/1713/FDIS PDF file 4399 kB
IEC 62531:2012 ED2

Property Specification Language (PSL)

PPUB
  • PPUB
  • Publication issued
EN 2012-05 N Webstore
IEC 62531:2007 ED1

Standard for Property Specification Language (PSL)

DELPUB
  • DELPUB
  • Deleted publication
EN 2007-10 U 93/253/FDIS
IEC 62588 ED1

Marking and labeling of components, PCBs and PCBAs to identify lead (Pb), lead-free (Pb-free) and other attributes

DEL
  • DEL
  • Deleted/abandoned
EN-FR 2013-11 Y 91/1062/CDV PDF file 1017 kB
PDF file 1032 kB
IEC PAS 62588:2008 ED1

Marking and labeling of components, PCBs and PCBAs to identify lead(Pb), Pb-free and other attributes

WPUB
  • WPUB
  • Publication withdrawn
EN 2008-09 U 91/1240/RR PDF file 21 kB
IEC 62699 ED1

Mapping rules and exchange methods for heterogeneous parts libraries

DEL
  • DEL
  • Deleted/abandoned
EN-FR 2016-04 N 91/1078/CDV PDF file 786 kB
PDF file 997 kB
IEC TR 62699-1:2014 ED1

Mapping rules and exchange methods for heterogeneous electronic parts libraries - Part 1: Building an integrated search system

PPUB
  • PPUB
  • Publication issued
EN 2014-12 N Webstore
IEC 62739-1:2013 ED1

Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 1: Erosion test method for metal materials without surface processing

PPUB
  • PPUB
  • Publication issued
EN-FR 2013-06 Y Webstore
IEC 62739-2:2016 ED1

Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 2: Erosion test method for metal materials with surface processing

PPUB
  • PPUB
  • Publication issued
EN-FR 2016-07 Y Webstore
IEC 62739-3:2017 ED1

Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 3: Selection guidance of erosion test methods

PPUB
  • PPUB
  • Publication issued
EN 2017-01 Y Webstore
IEC 62739-3/FRAGF ED1

Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 3: Selection guidance of erosion test methods

MERGED
  • MERGED
  • Publication merged with EN version
FR Y
IEC TR 62856:2013 ED1

Documentation on design automation subjects - The Bird's-eye View of Design Languages (BVDL)

PPUB
  • PPUB
  • Publication issued
EN-FR 2013-08 N Webstore
IEC TR 62866:2014 ED1

Electrochemical migration in printed wiring boards and assemblies - Mechanisms and testing

PPUB
  • PPUB
  • Publication issued
EN-FR 2014-05 N Webstore
IEC 62878-1:2019 ED1

Device embedding assembly technology - Part 1: Generic specification for device embedded substrates

PPUB
  • PPUB
  • Publication issued
EN 2019-11 Y Webstore
IEC 62878-1/FRAG1 ED1

Device embedded substrate - Part 1: Generic specification

DEL
  • DEL
  • Deleted/abandoned
EN U
IEC 62878-1/FRAGF ED1

Device embedding assembly technology - Part 1: Generic specification for device embedded substrates

MERGED
  • MERGED
  • Publication merged with EN version
FR Y
IEC 62878-1-1:2015 ED1

Device embedded substrate - Part 1-1: Generic specification - Test methods

PPUB
  • PPUB
  • Publication issued
EN-FR 2015-05 Y Webstore
IEC TS 62878-2-1:2015 ED1

Device embedded substrate - Part 2-1: Guidelines - General description of technology

PPUB
  • PPUB
  • Publication issued
EN-FR 2015-03 N Webstore
IEC TR 62878-2-2:2015 ED1

Device embedded substrate - Part 2-2: Guidelines - Electrical testing

PPUB
  • PPUB
  • Publication issued
EN-FR 2015-12 N Webstore
IEC TS 62878-2-3:2015 ED1

Device embedded substrate - Part 2-3: Guidelines - Design guide

PPUB
  • PPUB
  • Publication issued
EN-FR 2015-03 N Webstore
IEC TS 62878-2-4:2015 ED1

Device embedded substrate - Part 2-4: Guidelines - Test element groups (TEG)

PPUB
  • PPUB
  • Publication issued
EN-FR 2015-03 N Webstore
IEC 62878-2-5:2019 ED1

Device embedding assembly technology - Part 2-5: Guidelines - Implementation of a 3D data format for device embedded substrate

PPUB
  • PPUB
  • Publication issued
EN 2019-10 Y Webstore
IEC PAS 62878-2-5:2015 ED1

Device embedded substrate - Guidelines - Data format

DELPUB
  • DELPUB
  • Deleted publication
EN 2015-07 U 91/1257/PAS PDF file 1334 kB
IEC 62878-2-5/FRAGF ED1

Device embedding assembly technology - Part 2-5: Guidelines - Implementation of a 3D data format for device embedded substrate

MERGED
  • MERGED
  • Publication merged with EN version
FR Y
IEC TR 62878-2-7:2019 ED1

Device embedding assembly technology - Part 2-7: Guidelines - Accelerated stress testing of passive embedded circuit boards

PPUB
  • PPUB
  • Publication issued
EN 2019-04 U Webstore
IEC TR 62878-2-8 ED1

Device embedded substrate - Part 2-8: Guidelines-Warpage Control of Active Device Embedded Substrate

APUB
  • APUB
  • Approved for publication
EN 2022-02 U 91/1721/RVDTR PDF file 250 kB
Word file 42 kB
IEC TR 62878-2-9 ED1

Device embedding assembly technology - Part 2-9: Guidelines - Concept of JISSO level in the electronic assembly technology industries

PRVDTR
  • PRVDTR
  • Preparation of RVDTR
EN 2021-11 U 91/1703/DTR
IEC 62878-2-602 ED1

Device Embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity

TPUB
  • TPUB
  • Translation of publication
EN-FR 2021-08 Y 91/1663/CDV
PDF file 1302 kB
PDF file 1213 kB
IEC 62878-2-603 ED1

Device embedding assembly technology – Part 2-603: Guideline for stacked electronic module – Test method of intra-module electrical connectivity

ACD
  • ACD
  • Approved for CD
EN 2024-06 U 91/1693/NP PDF file 394 kB
IEC 63003:2015 ED1

Standard for the common test interface pin map configuration for high-density, single-tier electronics test requirements utilizing IEEE Std 1505™

PPUB
  • PPUB
  • Publication issued
EN 2015-11 N Webstore
IEC 63004:2015 ED1

Standard for receiver fixture interface

PPUB
  • PPUB
  • Publication issued
EN 2015-11 N Webstore
IEC TR 63017:2015 ED1

Flexible printed circuit boards (FPCBs) - Method of compensation of impedance variations

PPUB
  • PPUB
  • Publication issued
EN 2016-01 N Webstore
IEC TR 63018:2015 ED1

Flexible printed circuit boards (FPCBs) - Method to decrease signal loss by using noise suppression materials

PPUB
  • PPUB
  • Publication issued
EN 2016-01 N Webstore
IEC TR 63051:2017 ED1

Documentation on design automation subjects - Mathematical algorithm hardware description languages for system level modeling and verification (HDLMath)

PPUB
  • PPUB
  • Publication issued
EN 2017-01 N Webstore
IEC 63055:2016 ED1

Format for LSI-Package-Board Interoperable design

PPUB
  • PPUB
  • Publication issued
EN 2016-09 U Webstore
IEC 63215-2 ED1

Endurance test methods for die attach materials applied to power electronics devices – Part 2: Temperature cycling test method and reliability performance index for Die attach materials applied to discrete type power electronic devices

PCC
  • PCC
  • Preparation of CC
EN 2022-04 Y 91/1660/CD
PDF file 989 kB
IEC 63215-4 ED1

Endurance test methods for die attach materials applied to power electronic devices – Part 4: Power cycling test method and reliability performance index for Die attach materials (Near Chip Interconnection) applied to module type power electronic devices

ACD
  • ACD
  • Approved for CD
EN 2022-04 Y 91/1497/NP PDF file 404 kB
IEC 63251 ED1

Test Method for Mechanical Property of Flexible Opto-Electric Circuit Boards under Thermal Stress

ACDV
  • ACDV
  • Approved for CDV
EN 2022-04 Y 91/1683/CC PDF file 142 kB
Word file 36 kB