TC 91

Revision of IEC 410

Amendment to IEC 249-1 (1982) - Sub-clause 3.8.1

New specification IEC 2326-XX: Specification for appearance of surfaces of flexible printed boards

Specification for appearances of surfaces of flexible printed boards

Process assessment schedule for mass lamination panels

Technology approval schedule for printed boards

Base material for printed boards

Process assessment schedule for printed board design facilities

Generic computer aided manufacturing format (GenCAM)

IEC 61249-1: Materials for interconnecting structures - Part 1: Generic specification

Future IEC/TR 60068-3-82: Environmental Testing - Part 3-82: Supporting documentation and guidance − confIrmation of the performance of whisker test method

Revision of IEC 326-3 - New IEC 1188-2: Design and use requirements of printed boards and printed board assemblies - Part 2: Sectional design and use requirements - Engineering considerations. considerations

New Standard IEC 1193: Guidance on the use of IEC and ISO publications and quality assessment systems for printed boards and printed board assemblies

IEC 61249-1-1: Materials for printed boards and other interconnection structures - Part 1-1: Safety certification of base materials for rigid printed circuit boards

IEC 61188-5-7 Design and use of printed boards and printed board assemblies - Part 5-7: Sectional requirements attachment (land/joint) considerations - components with post mounting leads on two sides (dips)

IEC xxx-xx: Test methods for lead-free solders - Part 1: Measurement of melting temperature ranges

IEC xxx-xx: Test methods for lead-free solder - Part 2: Testing of mechanical characteristics

Specification for Flexible Optical Board using Glass Fibre and its test methods

Specification for rigid optical board using planar waveguide and its test methods

Specification for optical board connector type SF using glass fibre

Marking, Symbols and Labels for Identification of Lead-Free and Other Reportable Materials in Lead-Free Assemblies, Components and Devices

Detail Specification for Right-angled Optical Board Connector using Glass Fibers

Materials for printed boards and other interconnecting structures - Part 2-35: Reinforced base materials, clad and unclad - Modified epoxide woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly

Materials for printed boards and other interconnecting structures - Part 4-15: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional epoxide woven E-glass prepreg of defined flammability for lead-free compatible assembly

Materials for printed boards and other interconnecting structures - Part 4-16: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional non-halogenated epoxide woven E-glass prepreg of defined flammability for lead-free compatible assembly

Materials for printed boards and other interconnecting structures - Part 4-17: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Non-halogenated epoxide woven E-glass prepreg of defined flammability for lead-free compatible assembly

Materials for printed boards and other interconnecting structures - Part 2-36: Sectional specification set for reinforced based materials, clad and unclad - Epoxide woven glass fabric copper-clad sheet of defined flammability for lead-free assembly

Materials for printed boards and other interconnecting structures - Part 2-37: Sectional specification set for reinforced based materials, clad and unclad - Multi-functional, non-halogenated epoxide woven glass fabric copper-clad sheet of defined flammability for lead-free assembly

Materials for printed boards and other interconnecting structures - Part 2-38: Sectional specification set for reinforced based materials, clad and unclad - Non-halogenated epoxide woven glass fabric copper-clad sheet of defined flammability for lead-free assembly

Future IEC 61189-12: Test methods for electrical materials, interconnection structures and assemblies, Part-12 Erosion test method on the materials of solder bath or parts which contact with molten lead free solder.

Future IEC 61189-3-720: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-720: Electrochemical migration test method

FinSimMath, as a model for HDLMath

Component shape data specification for CAD library Part 2: 3D shape data specifications

Future 61249-2-48: Materials For Printed Boards and Other Interconnecting Structures – Part 2-48: Reinforced base materials clad and unclad – High performance, epoxide, woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for automotive applications

Future 61249-2-48: Materials For Printed Boards and Other Interconnecting Structures – Part 2-48: Reinforced base materials clad and unclad – High performance, epoxide, woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for automotive applications

Future 61249-2-50: Materials For Printed Boards and Other Interconnecting Structures – Part 2-50: Reinforced base materials clad and unclad – High performance thermosetting resin, modified or unmodified woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for high frequency applications

Future 61249-2-51: Materials For Printed Boards and Other Interconnecting Structures – Part 2-51: Reinforced base materials clad and unclad – High performance non-halogen thermosetting resin, modified or unmodified woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for high frequency applications

Future 61189-2-xxx: Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-XXX: Test methods for base materials for rigid printed boards – Decomposition Temperature Td

PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES – DESIGN AND USE Part 8: 3D shape data specification for CAD component library.

MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES – Part 6-11: Sectional specification set for reinforcement materials – Specification for finished fabric woven from “Low Dk” glass for printed boards

DEVICE EMBEDDING ASSEMBLY TECHNOLOGY – Part 2-603: Guideline for stacked electronic module – Test method of intra-module electrical connectivity

Endurance test methods for die attach materials – Part 1: General specification

Endurance test methods for die attach materials – Part 5: Temperature cycling test methods and reliability performance index for die attach materials (system soldering interconnection) applied to module type power electronic devices

Endurance test methods for die attach materials – Part 3: Power cycling test method and reliability performance index for die attach materials applied to discrete type power electronic devices

Electrical test method of printed circuit board by measuring the capacitance

Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-809: X/Y Coefficient of Thermal Expansion Test (CTE) for Thick Base Materials by TMA

Library standard architecture (future IEC 62014-2) (TR)

Test information flow through the product life cycle (TR)

Models of integrated circuits for EMI behavioural simulation (future IEC 62014-3)

Terminology and taxonomy for eletronic design automation

Library utilities for VHDL (TR)

Libraries of reusable parts for electrotechnical products

AI Estate - Overview and Architecture (Fast Track request expected from USNC)

AI Estate - Data and Knowledge (Fast track request expected from USNC)

AI Estate - Service specification (Fast track request expected from USNC)

Electronic design automation - Verilog 1364 - The verilog hardware description language (HDL) reference manual

Libraries of reusable parts for electrotechnical products: Development of models for CAD tools

Libraries of reusable parts for electrotechnical products: Component information representation

Libraries of reusable parts for electrotechnical products: Library organisation

IBIS models and EMC simulation

Electronic CAD to CAM exchange

Standard Hardware Description Language Based on the Verilog Hardware Description Language

Standard for Standard Delay Format (SDF) for the Electronic Design Process

Interoperability of Formats and Schemas used for Electronic Assembly Material Declaration

Generic Requirements for Electronics Manufacturing Supply Chain Communication - Product Data eXchange (PDX)

IEC 61692-2 Ed 1.0: Common rules for circulation of electronic catalogue data - Part 2: Common exchange rules and Interoperability system (IOS)

Environmental testing - Part 2-20: Tests - Test Ta and Tb: Test methods for solderability and resistance to soldering heat of devices with leads

Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads

Environmental testing. Part 2: Tests. Test T: Soldering

Amendment 2 - Basic environmental testing procedures - Part 2-20: Tests - Test T: Soldering

Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices

Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices

Corrigendum 1 - Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices

Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices

Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices

Environmental testing. Part 2: Tests. Test U: Robustness of terminations and integral mounting devices

Amendment 2 - Environmental testing. Part 2: Tests. Test U: Robustness of terminations and integral mounting devices

Amendment 3 - Environmental testing. Part 2: Tests. Test U: Robustness of terminations and integral mounting devices

Environmental testing - Part 2-44: Tests - Guidance on test T: Soldering

Basic environmental testing procedures - Part 2: Tests - Tests - Guidance on Test T: Soldering

Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method

Environmental testing. Part 2: Tests. Test Ta: Soldering - Solderability testing by the wetting balance method

Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

Amendment 1 - Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

Environmental testing - Part 2-58: Tests - Test Td - Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

Environmental testing. Part 2: Tests. Test Td: Solderability, resistance to dissolution of metallization and to soldering heat of Surface Mounting Devices (SMD)

Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method

Corrigendum 1 - Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement)

Amendment 1 - Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method

Environmental testing - Part 2-69: Tests - Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method

Environmental testing - Part 2-69: Tests - Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method

Environmental testing - Part 2: Tests - Test Te: Solderability testing of electronic components for surface mount technology by the wetting balance method

Amendment 1 to IEC 60068-2-69

Environmental testing - Part 2-77: Tests - Test 77: Body strength and impact shock

Environmental testing - Part 2-77: Tests - Test 77: Body strength and impact shock

Environmental testing - Part 2-82: Tests - Test Xw1: Whisker test methods for components and parts used in electronic assemblies

Environmental testing - Part 2-82: Tests - Test XW1: Whisker test methods for electronic and electric components

Environmental testing - Part 2-82: Tests - Test Tx: Whisker test methods for electronic and electric components

Corrigendum 1 - Environmental testing - Part 2-82: Tests - Test XW1: Whisker test methods for electronic and electric components

Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste

Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile

Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile

Environmental testing - Part 3-13: Supporting documentation and guidance on Test T - Soldering

Systematic review of IEC 97 (1991)

Grid systems for printed circuits

Printed board design, manufacture and assembly - Terms and definitions

Printed board design, manufacture and assembly - Terms and definitions

Printed board design, manufacture and assembly - Terms and definitions

Terms and definitions for printed circuits and a proposal for a decimal classification code (DCC) for the categorization of the terms and definitions (Revision of IEC 194)

Terms and definitions for printed circuits.

Printed boards design, manufacture and assembly - Vocabulary - Part 1: Common usage in printed board and electronic assembly technologies

Printed boards design, manufacture and assembly - Vocabulary - Part 2: Common usage in electronic technologies as well as printed board and electronic assembly technologies

Amendment to IEC 249-1 - Measurement method for glass transition temperature using differential scanning calorimetry (New Sub-clause 4.5)

Amendment to IEC 249-1 - Measurement method of cure factor (New Sub-clause 4.6)

Addition of a new Sub-clause 4.5.2 -Measurement method for glass transition temperature using thermomechanical analysis (TMA)- to IEC 249-1

Amendment to Sub-clause 2.2.1 and 2.2.2 of IEC 249-1

Base materials for printed circuits. Part 1: Test methods

Amendment 4 - Base materials for printed circuits. Part 1: Test methods

Base materials for printed circuits. Part 2: Specifications. Specification No. 1: Phenolic cellulose paper copper-clad laminated sheet, high electrical quality

Requirements for pull-off strength - Revision of Specification 249-2-1

Amendment No. 2 - Base materials for printed circuits - Part 2: Specifications - Specification No.1: Phenolic cellulose paper copper-clad laminated sheet, high electrical quality

Amendment No. 3 - Base materials for printed circuits - Part 2: Specifications - Specifications Nos. 1, 3, 6, 7, 11 and 12

Amendment 4 - Base materials for printed circuits. Part 2: Specifications. Specification No. 1: Phenolic cellulose paper copper-clad laminated sheet, high electrical quality

Base materials for printed circuits. Part 2: Specifications. Specification No. 2: Phenolic cellulose paper copper-clad laminated sheet, economic quality

Requirements for pull-off strength - Revision of Specification 249-2-2

Amendment 3 - Base materials for printed circuits - Part 2: Specifications - Specification No.2: Phenolic cellulose paper copper-clad laminated sheet, economic quality

Amendment 4 - Base materials for printed circuits - Part 2: Specifications - Specification No.2: Phenolic cellulose paper copper-clad laminated sheet, economic quality

Amendment 5 - Base materials for printed circuits. Part 2: Specifications. Specification No. 2: Phenolic cellulose paper copper-clad laminated sheet, economic quality

Base materials for printed circuits. Part 2: Specifications. Specification No. 3: Epoxide cellulose paper copper-clad laminated sheet of defined flammability (vertical burning test)

Requirements for pull-off strength - Revision of Specification 249-2-3

Amendment No. 2 - Base materials for printed circuits. Part 2: Specifications. Specification No. 3: Epoxide cellulose paper copper-clad laminated sheet of defined flammability (vertical burning test)

Amendment No. 3 - Base materials for printed circuits. Part 2: Specifications. Specification No. 3: Epoxide cellulose paper copper-clad laminated sheet of defined flammability (vertical burning test)

Amendment 4 - Base materials for printed circuits. Part 2: Specifications. Specification No. 3: Epoxide cellulose paper copper-clad laminated sheet of defined flammability (vertical burning test)

Base materials for printed circuits. Part 2: Specifications. Specification No. 4: Epoxide woven glass fabric copper-clad laminated sheet, general purpose grade

Amendment 3 - Base materials for printed circuits. Part 2: Specifications. Specification No. 4: Epoxide woven glass fabric copper-clad laminated sheet, general purpose grade

Amendment 4 - Base materials for printed circuits. Part 2: Specifications. Specification No. 4: Epoxide woven glass fabric copper-clad laminated sheet, general purpose grade

Amendment 5 - Base materials for printed circuits. Part 2: Specifications. Specification No. 4: Epoxide woven glass fabric copper-clad laminated sheet, general purpose grade

Introduction of a new subclause 6.6 to IEC 249-2-4, 249-2-5, 249-2-11 and 249-2-12 concerning the requirements for glass transition temperature and cure factor

Base materials for printed circuits. Part 2: Specifications. Specification No. 5: Epoxide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test)

Requirements for pull-off strength - Revision of Specification 249-2-5

Requirements for punching and machining properties of laminates - Revision of Specification 249-2-5 (Sub-clause 5.5)

Amendment 3 - Base materials for printed circuits. Part 2: Specifications. Specification No. 5: Epoxide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test)

Amendment 4 - Base materials for printed circuits. Part 2: Specifications. Specification No. 5: Epoxide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test)

Amendment 5 - Base materials for printed circuits. Part 2: Specifications. Specification No. 5: Epoxide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test)

Base materials for printed circuits. Part 2: Specifications. Specification No. 6: Phenolic cellulose paper copper-clad laminated sheet of defined flammability (horizontal burning test)

Amendment 2 - Base materials for printed circuits. Part 2: Specifications. Specification No. 6: Phenolic cellulose paper copper-clad laminated sheet of defined flammability (horizontal burning test)

Amendment 3 - Base materials for printed circuits. Part 2: Specifications. Specification No. 6: Phenolic cellulose paper copper-clad laminated sheet of defined flammability (horizontal burning test)

Amendment 4 - Base materials for printed circuits. Part 2: Specifications. Specification No. 6: Phenolic cellulose paper copper-clad laminated sheet of defined flammability (horizontal burning test)

Base materials for printed circuits. Part 2: Specifications. Specification No. 7: Phenolic cellulose paper copper-clad laminated sheet of defined flammability (vertical burning test)

Requirements for surface waviness - Revision of Specification 249-2-7

Requirements for glass transition temperature and cure factor - Revision of Specification 249-2-7

Amendment 2 - Base materials for printed circuits. Part 2: Specifications. Specification No. 7: Phenolic cellulose paper copper-clad laminated sheet of defined flammability (vertical burning test)

Amendment 3 - Base materials for printed circuits. Part 2: Specifications. Specification No. 7: Phenolic cellulose paper copper-clad laminated sheet of defined flammability (vertical burning test)

Amendment 4 - Base materials for printed circuits. Part 2: Specifications. Specification No. 7: Phenolic cellulose paper copper-clad laminated sheet of defined flammability (vertical burning test)

Base materials for printed circuits. Part 2: Specifications. Specification No. 8: Flexible copper-clad polyester (PETP) film

Amendment 1 - Base materials for printed circuits. Part 2: Specifications. Specification No. 8: Flexible copper-clad polyester (PETP) film

Base materials for printed circuits. Part 2: Specifications. Specification No. 9: Epoxide cellulose paper core, epoxide glass cloth surfaces copper-clad laminated sheet of defined flammability (vertical burning test)

Requirements for surface waviness - Revision of Specification 249-2-9

Amendment 3 - Base materials for printed circuits. Part 2: Specifications. Specification No. 9: Epoxide cellulose paper core epoxide glass cloth surfaces copper-clad laminated sheet of defined flammability (vertical burning test)

Amendment 4 - Base materials for printed circuits. Part 2: Specifications. Specification No. 9: Epoxide cellulose paper core, epoxide glass cloth surfaces copper-clad laminated sheet of defined flammability (vertical burning test)

Amendment 5 - Base materials for printed circuits. Part 2: Specifications. Specification No. 9: Epoxide cellulose paper core, epoxide glass cloth surfaces copper-clad laminated sheet of defined flammability (vertical burning test)

Base materials for printed circuits. Part 2: Specifications. Specification No. 10: Epoxide non-woven/woven glass reinforced copper-clad laminated sheet of defined flammability (vertical burning test)

Amendment No. 3 - Base materials for printed circuits. Part 2: Specifications - Specification No. 10: Epoxide non-woven/woven glass reinforced copper-clad laminated sheet of defined flammability (vertical burning test)

Amendment No. 4 - Base materials for printed circuits. Part 2: Specifications - Specification No. 10: Epoxide non-woven/woven glass reinforced copper-clad laminated sheet of defined flammability (vertical burning test)

Amendment 5 - Base materials for printed circuits. Part 2: Specifications. Specification No. 10: Epoxide non-woven/woven glass reinforced copper-clad laminated sheet of defined flammability (vertical burning test)

Introduction of a new subclause 6.6. to IEC 249-2-4, 249-2-5, 249-2-11 and 249-2-12 concerning the requirements for glass transition temperature and cure factor

Base materials for printed circuits. Part 2: Specifications. Specification No. 11: Thin epoxide woven glass fabric copper-clad laminated sheet, general purpose grade for use in the fabrication of multilayer printed boards

Amendment 2 - Base materials for printed circuits. Part 2: Specifications. Specification No. 11: Thin epoxide woven glass fabric copper-clad laminated sheet, general purpose grade for use in the fabrication of multilayer printed boards

Amendment 3 - Base materials for printed circuits. Part 2: Specifications. Specification No. 11: Thin epoxide woven glass fabric copper-clad laminated sheet, general purpose grade for use in the fabrication of multilayer printed boards

Amendment 4 - Base materials for printed circuits. Part 2: Specifications. Specification No. 11: Thin epoxide woven glass fabric copper-clad laminated sheet, general purpose grade for use in the fabrication of multilayer printed boards

Amendment 2 - Base materials for printed circuits - Part 2: Specifications - Specification No 12: Thin epoxide woven glass fabric copper-clad laminated sheet of defined flammability, for use in the fabrication of multilayer printed boards

Amendment 3 - Base materials for printed circuits. Part 2: Specifications. Specification No. 12: Thin epoxide woven glass fabric copper-clad laminated sheet of defined flammability, for use in the fabrication of multilayer printed boards

Amendment 4 - Base materials for printed circuits. Part 2: Specifications. Specification No. 12: Thin epoxide woven glass fabric copper-clad laminated sheet of defined flammability, for use in the fabrication of multilayer printed boards

Base materials for printed circuits. Part 2: Specifications. Specification No. 13: Flexible copper-clad polyimide film, general purpose grade

Amendment 1 - Base materials for printed circuits. Part 2: Specifications. Specification No. 13: Flexible copper-clad polyimide film, general purpose grade

Base materials for printed circuits. Part 2: Specifications. Specification No. 14: Phenolic cellulose paper copper-clad laminated sheet of defined flammability (vertical burning test), economic quality

Amendment No. 3 - Base materials for printed circuits. Part 2: Specifications. Specification No. 14: Phenolic cellulose paper copper-clad laminated sheet of defined flammability (vertical burning test), economic quality

Amendment 4 - Base materials for printed circuits. Part 2: Specifications. Specification No. 14: Phenolic cellulose paper copper-clad laminated sheet of defined flammability (vertical burning test), economic quality

Amendment 5 - Base materials for printed circuits. Part 2: Specifications. Specification No. 14: Phenolic cellulose paper copper-clad laminated sheet of defined flammability (vertical burning test), economic quality

Base materials for printed circuits. Part 2: Specifications. Specification No. 15: Flexible copper-clad polyimide film, of defined flammability

Amendment 1 - Base materials for printed circuits. Part 2: Specifications. Specification No. 15: Flexible copper-clad polyimide film, of defined flammability

Base materials for printed circuits - Part 2: Specifications - Specification No. 16: Polyimide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test)

Amendment 1 - Base materials for printed circuits - Part 2: Specifications - Specification No. 16: Polyimide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test)

Amendment No. 2 - Base materials for printed circuits - Part 2: Specifications - Specification No. 16: Polyimide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test)

Amendment 3 - Base materials for printed circuits - Part 2: Specifications - Specification No. 16: Polyimide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test)

Base materials for printed circuits - Part 2: Specifications - Specification No. 17: Thin polyimide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards

Amendment 1 - Base materials for printed circuits - Part 2: Specifications - Specification No. 17: Thin polyimide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards

Amendment 2 - Base materials for printed circuits - Part 2: Specifications - Specification No. 17: Thin polyimide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards

Amendment 3 - Base materials for printed circuits - Part 2: Specifications - Specification No. 17: Thin polyimide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards

Base materials for printed circuits - Part 2: Specifications - Specification No. 18: Bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test)

Amendment No. 1 - Base materials for printed circuits - Part 2: Specifications - Specification No. 18: Bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test)

Amendment No. 2 - Base materials for printed circuits - Part 2: Specifications - Specification No. 18: Bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test)

Amendment 3 - Base materials for printed circuits - Part 2: Specifications - Specification No. 18: Bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test)

Base materials for printed circuits - Part 2: Specifications - Specification No. 19: Thin bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards

Amendment 1 - Base materials for printed circuits - Part 2: Specifications - Specification No. 19: Thin bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards

Amendment 2 - Base materials for printed circuits - Part 2: Specifications - Specification No. 19: Thin bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards

Systematic review of IEC 60249-3-1 (1981)

Base materials for printed circuits. Part 3: Special materials used in connection with printed circuits. Specification No. 1: Prepreg for use as bonding sheet material in the fabrication of multilayer printed boards

Base materials for printed circuits - Part 3: Special materials used in connection with printed circuits - Specification No. 3: Permanent polymer coating materials (solder resist) for use in the fabrication of printed boards (Revision of IEC 249-3-3)

Base materials for printed circuits - Part 3: Special materials used in connection with printed circuits - Specification No. 3: Permanent polymer coating materials (solder resist) for use in the fabrication of printed boards

Base materials for printed circuits - Part 3: Special materials used in connection with printed circuits - First supplement: Specification No. 2: Specification for copper foil for use in the manufacture of copper-clad base materials. Note: Still valid, will be renumbered as 249-3-2 when next revised

Systematic review of IEC 321 (1970)

Systematic review of IEC 321-2 (1987)

Systematic review of IEC 321-3 (1990)

Auxiliary printed board information. Part 3: Guidelines for artwork

Printed boards - Part 1: General information for the specification writer

Printed boards. Part 2: Test methods

Amendment 1 - Printed boards. Part 2: Test methods

Systematic review of IEC 326-3 (1991)

Printed boards - Part 3: Design and use of printed boards

Systematic review of IEC 326-4 (1980)

Printed boards - Part 4: Specification for single and double sided printed boards with plain holes

Amendment 1 - Printed boards. Part 4: Specification for single and double sided printed boards with plain holes

Systematic review of IEC 326-5 (1980)

Printed boards - Part 5: Specification for single and double sided printed boards with plated-through holes

Amendment 1 - Printed boards. Part 5: Specification for single and double sided printed boards with plated-through holes

Printed boards. Part 6: Specification for multilayer printed boards.

Amendment 2 - Printed boards. Part 6: Specification for multilayer printed boards.

Systematic review of IEC 326-7 (1981)

Printed boards. Part 7: Specification for single and double sided flexible printed boards without through connections

Amendment 1 - Printed boards. Part 7: Specification for single and double sided flexible printed boards without through connections

Systematic review of IEC 326-8 (1981)

Printed boards. Part 8: Specification for single and double sided flexible printed boards with through connections

Amendment 1 - Printed boards. Part 8: Specification for single and double sided flexible printed boards with through connections

Systematic review of IEC 326-9 (1991)

Printed boards - Part 9: Specification for flexible multilayer printed boards with through connections

Systematic review of IEC 326-10 (1991)

Printed boards - Part 10: Specification for flex-rigid double-sided printed boards with through connections

Systematic review of IEC 326-11 (1991)

Printed boards - Part 11: Specification for flex-rigid multilayer printed boards with through connections

Printed boards - Part 12: Specification for mass lamination panels (semi-manufactured multilayer printed boards)

Printed boards - Electronic data description and transfer - Part 1: Printed board description in digital form

Printed board assembly products - Manufacturing description data and transfer methodology - Part 2: Generic requirements

Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2: Sectional requirements for implementation of printed board fabrication data description

Printed boards - Electronic data description and transfer - Part 7: Bare board electrical test information in digital form

Corrigendum 1 - Printed boards - Electronic data description and transfer - Part 7: Bare board electrical test information in digital form

Printed boards - Electronic data description and transfer - Part 10: Electronic data hierarchy

Generic requirements for printed board assembly products manufacturing description data and transfer methodology

Fiducial standard specification

Printed boards and printed board assemblies - Design and use - Part 1-1: Generic requirements - Flatness considerations for electronic assemblies

Printed boards and printed board assemblies - Design and use - Part 1-2: Generic requirements - Controlled impedance

Design and use of printed boards and printed board assemlies - Part 2: Guide to the use of printed wiring board substrate materials - Surface mount technology

IEC 1188-5 - Design of printed boards and printed boards assemblies - Part 5: Sectional design requirements - Attachment (land/joint) considerations (Revision of IEC 321)

Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements

Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components

Printed boards and printed board assemblies - Design and use - Part 5-3: Attachment (land/joint) considerations - Components with gull-wing leads on two sides

Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides

Printed boards and printed board assemblies - Design and use - Part 5-5: Attachment (land/joint) considerations - Components with gull-wing leads on four sides

Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations - Chip carriers with J-leads on four sides

Design and use of printed boards and printed board assemblies - Part 5: Sectional design and use requirements - Attachment (Land/joint) considerations - Section 7: Components with Post (DIP) mounting leads on two sides

Printed board and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA)

Circuit boards and circuit board assemblies - Design and use - Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards

Circuit boards and circuit board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD)

Circuit boards and circuit board assemblies - Design and use - Part 6-3: Land pattern design - Description of land pattern for through hole components (THT)

Printed boards and printed board assemblies - Design and use - Part 6-4: Land pattern design - Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design

Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction

Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction

Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction

Corrigendum 1 - Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction

Circuit boards and circuit board assemblies - Design and use - Part 8: 3D shape data for CAD component library

Component shape data specification for CAD library - Part 8-1 Generic Descriptions of the 2D and 3D description

Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology

Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology

Test methods for interconnection structures (printed boards) - Test N11: Pre-conditioning, 125°C

Amendment 1 - Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures

Test methods for electrical materials, interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures

Test Method for Halogen-free Copper-Clad Laminates

Amendment 1 - Test methods for electrical materials, interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures

Test mehods for materials for interconnection structures - Test E14: Arc resistance

Test methods for materials for interconnection structures - Test M25: Time to delamination by TMA

Test methods for materials for interconnection structures - Test M27: Resin flow properties of coverlay films, bonding films and adhesive cast films used in the fabrication of flexible printed wiring boards

Amendment 2 to IEC 1189-2: Test methods for electrical materials, interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures

Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-501: Test methods for materials for interconnection structures – Measurement of Resilience strength and Resilience strength Retention Factor of Flexible Dielectric Materials

IEC 61189-2-628,Ed.1: Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-628: Mechanical test methods for printed board and assembly materials - Glass transition temperature of base material by dynamic mechanical analysis(DMA; bend and pull)

Test method of adhesion between a dielectric and inkjet printed circuits to be used for printed elecronics sheet(board) application

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-630: Test methods for materials for interconnection structures - Moisture absorption after pressure vessel conditioning

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-719: Test methods for materials for interconnection structures - Relative permittivity and loss tangent (500 MHz to 10 GHz)

Future IEC 61189-2-719 Ed. 1.0: Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-719: Electrical test methods for printed board and assembly materials - Relative permittivity and dissipation factor (500MHz to 10GHz)

Future IEC 61189-2-720 Ed. 1.0: Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-720: Electrical test methods for printed board and assembly materials - Relative permittivity and dissipation factor (1MHz)

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-721: Test methods for materials for interconnection structures - Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency using a split post dielectric resonator

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-801: Thermal conductivity test for base materials

Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-803: Test methods for Z-Axis Expansion of base materials and printed board

Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-804: Test methods for time to delamination – T260, T288, T300

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-805: X/Y CTE Test for Thin Base Materials by TMA

Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-807: Test methods for materials for interconnection structures – Decomposition Temperature (Td) using TGA

Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-808: Thermal resistance of dielectric layer by thermal transient method

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)

Test methods for electrical materials, interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)

Test methods for electrical materials, interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)

Amendment 1 - Test methods for electrical materials, interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)

Amendment No. 1 to IEC 1189-3 - Tests 3N01, 3N04 to 3N06, 3N08, 3X07 and 3X10

Test methods for interconnection structures (printed boards) - Test N04: Thermal shock , dip soldering

Test methods for interconnection structures (printed boards) - Test N05: Thermal shock, floating, solder bath 280°C

Test methods for interconnection structures (printed boards) - Test N06: Damp heat, steady state

Test methods for interconnection structures (printed boards) - Test N08: Thermal shock, immersion, fluidized sand bath

Amendment 1 - Test methods for electrical materials, interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)

Test methods for interconnection structures (printed boards) - Test X07: Edge dip test for surface mount conductors and attachment lands

Test methods for interconnection structures (printed boards) - Test X10: Rotary dip test for plated through holes, surface mount conductors and attachment lands

Amendment 2 to IEC 61189-3: Test methods for electrical materials, interconnection structures and assemblies - Part 3: Test methods for interconnection structures

Test methods for interconnection structures (printed boards) - Test E08: PTH resistance change, thermal cycling

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-301: Test methods for interconnection structures (printed boards) - Appearance inspection method for plated surfaces on PWB

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-913: Test method for thermal conductivity of electronic circuit boards for high-brightness LEDs

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-913: Test methods for interconnection structures (printed boards) - Electronic circuit board for high-brightness LEDs

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-914: Test method for thermal conductivity of printed circuit boards for high-brightness LEDs - Guidelines

Test method of ultrasonic cleaning

Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies

Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies

Test methods for electrical materials, interconnection structures and assemblies - Part 5-5: Test methods for printed board assemblies - Surface insulation resistance (SIR)

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-301: General test methods for materials and assemblies - Soldering paste using fine solder particles

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-501: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of solder fluxes

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-502: General test methods for materials and assemblies - Surface Insulation Resistance (SIR) testing of assemblies

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-504: General test methods for materials and assemblies - Process ionic contamination testing (PICT)

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-506: General test methods for materials and assemblies - An intercomparison evaluation to implement the use of fine-pitch test structures for surface insulation resistance (SIR) testing of solder fluxes in accordance with IEC 61189-5-501

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-601: General test methods for materials and assemblies - Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards

Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in manufacturing electronic assemblies

Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in manufacturing electronic assemblies

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys

Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly

Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly