TC 47 |
Semiconductor devices |

Convenor | NationalCommittee | |
---|---|---|
Mr Nobuyuki Wakai | JP |
Member | NationalCommittee |
---|---|
Mr Werner Berns | DE |
Mr Jaap Bisschop | NL |
Ms Stephanie Watts Butler | US |
Mr Shujun Cai | CN |
Mr Leigang Chen | CN |
Ms bo Cui | CN |
Mr Zhihong Feng | CN |
Mr Peter Friedrichs | DE |
Mr Eric GUIOT | FR |
Mr Roland Baridon Hill | GB |
Mr Tobias Hoechbauer | AT |
Mr Horst Karolewski | DE |
Mr Chul-Hee Kim | KR |
Ms Sang-A Kim | KR |
Mr Namsu Kim | KR |
Mr Andrey V. Konyukhov | RU |
Mr Nicholas (Nick) E Lycoudes | US |
Mr Jim Lynch | GB |
Mr Andreas Martin | DE |
Mr Hideya Matsuyama | JP |
Ms yan meicun | CN |
Mr Yuichi Nagahiro | JP |
Mr Jun-ichi Ohno | JP |
Mr Noboru OHTANI | JP |
Mr Sungju Park | KR |
Mr Francesco Patanè | IT |
Mr Nicolò Piluso | IT |
Mr Junji SENZAKI | JP |
Mr Andrea Severino | IT |
Mrs Ziva Shalev | IL |
Mr Takashi SHINOHE | JP |
Mr Choon Beng SIA | SG |
Mr Kurt V. Smith | IL |
Mr bai song | CN |
Mr TORU SUGIYAMA | JP |
Mr Konstantin S. Tkachuk | RU |
Mr Dr. Vali uddin | PK |
Mr Simon Wainwright | IL |
Mr KOJI YAMAGUCHI | JP |
Mr MANABU YANAGIHARA | JP |
Mr Byoung Jin Yoon | KR |
Title & Task
WG 5
Wafer Level Reliability for semiconductor devices
Generates terms, definitions and reviews or establishes specifications and standards relating to wafer-level reliability assessment of semiconductor devices in the points of failure mechanism for wafer process and test methods. To accomplish these functions, the working group maintains liaison with and utilizes information and help from other groups and technical experts.
Organizations | Liaison Representative |
---|---|
Liaison C | |
EIA |
