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  9. WG 1

TC 91

Electronics assembly technology
 
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WG 1 Convenor & Members

Convenor
National

Committee
Mr Walter Huck
 DE
Member
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National

Committee
Mr Jung Soo ByunKR
Mr Hanseo ChoKR
Mr Marcus EscherDE
Mr Ian Michael FoxGB
Mr Robert GregoryGB
Mr Erich GünterDE
Mr Sang-Won HaKR
Mr Taro HatanoJP
Mr Shinya HATTORIJP
Mr Gerhard HaubnerDE
Mr MASATO HAYASHIDAJP
Mr Toshiro HiramotoJP
Ms Emma HudsonGB
Mr Yuichi IWANABEJP
Mr Tetsuji KAWAMATAJP
Mr Hyun Ho KimKR
Ms Kyounghee LeeKR
Mr Min-su LeeKR
Mr Jinho LeeKR
Mr Junkyu LeeKR
Mr Jinho LeeKR
Mr Minsu LeeKR
Mr Alan E LuceroUS
Mr Arkady M. MedvedevRU
Mr Makoto MizutaniJP
Mr Hideyuki NAGAIJP
Mr Tanehiro NakabayashiJP
Mr Marc NikolussiDE
Mr Pascall OberndorffNL
Mr Masahide OkamotoJP
Mr Hiroshi OshimaJP
Mr Romuald RoucouNL
Mr Kimmo B. SaarinenFI
Mr Michael SchleicherDE
Mr Markus SchwerdtfegerDE
Mr Mandar Pramod SinnarkarIN
Mr Douglas J SoberUS
Mr Shigeru SUGINOJP
Mr Masaki SuwaJP
Mr Hiromitsu TakaiJP
Mr Masahiro TamboJP
Mr Stephen L TisdaleUS
Mr Michail P. UtkinRU
Mr Joachim Von Der OheDE
Mr Udo WelzelDE
Mr Katsumi YamamotoJP
Mrs Chiko YORITAJP
Mr Vladimir N. ZverevRU

Title & Task

WG 1

Requirements for electronic components

 

-    Describe assembly processes and their requirements for components, their design and specifications, for reliable use in electronics.

-    Defining requirements for the specification of electronic components to meet critical environmental and assembly process conditions.

-    Finding out and describing the tests, with which the performance can be demonstrated.

-    Specify the safe transportation and storage conditions of electronic components.

-    Specify the labelling of electronic components and their packages for reliable use in the industry.

-    Study developments in assembly process technology and adopt existing documents or create new ones to cover those new requirements

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Liaisons

Organizations
Liaison Representative
Liaison C
EDIFICEMr Rainer Schrundner
IPC 
JEITA