International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology

 
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WG 3 Convenor & Members

Convenor
National

Committee
Mr Hisao Kasuga
 JP
Member
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National

Committee
Mr Uwe BlosfeldDE
Mr Richard BoyleGB
Mr Lutz BruderreckDE
Mr Jung Soo ByunKR
Mr Sangsuk ChaKR
Mr Nae Eul ChoKR
Mr Sergey V. DzyubanenkoRU
Mr Issei FUJIMURAJP
Mr Andrew GoddardGB
Mr Erich GörtlerDE
Mr Koichi HagioJP
Mr Taro HatanoJP
Mr Toshiro HiramotoJP
Mr Walter HuckDE
Ms Emma HudsonGB
Mr Werner A. HügelDE
Mr Chris HuntGB
Mr Young-Min ImKR
Mr Jin Hong ImKR
Mr Tsuyoshi InageJP
Mr Vladimir D. IvinRU
Mr Ki-do JeonKR
Mr Yoshiharu KariyaJP
Mr Hyun Ho KimKR
Mr Kyoungmin KimKR
Mr Koji KitadaJP
Mr Min-su LeeKR
Mr Jinho LeeKR
Mr Jin ho LeeKR
Mr Alan E LuceroUS
Mr Mitsuhiro MatsumuraJP
Mr Arkady M. MedvedevRU
Mr Greg MunieUS
Ms MAYUKO MUROOKAJP
Mr Hideyuki NAGAIJP
Mr Graham NaisbittGB
Mr Anton NisanRU
Mr Hiroshi NishikawaJP
Mr Pascall OberndorffNL
Mr Masahide OkamotoJP
Mr Hiroyuki OmuraJP
Mr Hiroshi OshimaJP
Mr Hwa Sun ParkKR
Sechuel ParkKR
Mr Kimmo B. SaarinenFI
Mr Akira SaitoJP
Mr Ichizo SakamotoJP
Mr Matthias SchmidtDE
Mr Koji SerizawaJP
Mr Myungchul ShinKR
Mr Mandar Pramod SinnarkarIN
Mr Douglas J SoberUS
Mr Shigeru SUGINOJP
Mr Masaki SuwaJP
Mr Masahiro TamboJP
Mr Stephen L TisdaleUS
Mr Mitsuaki TohjohJP
Mr Sadayuki TomaJP
Mr Kaichi TsurutaJP
Mr Michail P. UtkinRU
Mr Alexei G. VoltchkovRU
Mr Joachim Von Der OheDE
Mr Vesa VuorinenFI
Mr Udo WelzelDE
Mr Martin WickhamGB
Mr Mitsuharu YAMABEJP
Mr Hiroshi YamadaJP
Mr Tsuyoshi YAMAMOTOJP
Mr Katsumi YamamotoJP
Mr Anton M. ZagrebinRU

Title & Task

WG 3

Measuring and test methods for electronics assemblies

 

Development of measuring and test methods specific to surface
mounting technology and not covered by other technical
committees of the IEC.

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Liaisons

Organizations
Liaison Representative
Liaison C
IPC 
JEITA