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  9. WG 2

TC 119

Printed Electronics
 
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WG 2 Convenor & Members

Convenor
National

Committee
Mr Takehito Kozasa
 JP
Member
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National

Committee
Mr Ari AlastaloFI
Ms Nina BiddleGB
Mr Gyoujin ChoKR
Mr Byung-Oh ChoiKR
Mr Ta-Ya ChuCA
Mr Sun-Kee ChunKR
Mr Tim ClaypoleGB
Mr Jan de BoerNL
Mr Fernando de CastroGB
Mr Wilco de GrootNL
Mr Yukio EHARAJP
Ms Julie FerrignoCA
Mr Kenichi FUKAWAJP
Ms Nobuko FUKUDAJP
Mr Daniel GamotaUS
Mr Xiaojun GUOCN
Ms Rakel HerreroES
Mr Shuji HIRAKAWAJP
Mr Kogo IWABUCHIJP
Mr Eun-chae JeonKR
Mr Edward JerjianCA
Mr Chao JiangCN
Mr Toshihide KAMATAJP
Mr Kyung-Tae KangKR
Mr Arnold KellCA
Mr Sangho KIMKR
Mr Chung-Hwan KimKR
Mr Haekyoung KimKR
Mr Byoung-Joon KimKR
Mr Keun-Soo KIMKR
Mr Yoshiaki KondohJP
Mr Hoo-Jeong LeeKR
Mr Sang-Geun LeeKR
Mr Haeseong LeeKR
Mr Dongjin LeeKR
Ms Yongju LEEKR
Mr Yong Uk LeeKR
Mr Fengyu LICN
Ms Jun LiuCN
Mr Giles LloydGB
Mr Greg Peter LopinskiCA
Mr Bill MacDonaldGB
Mr Shuichi MAEDAJP
Mr Satoshi MAEDAJP
Mr Leszek Artur MajewskiGB
Mr Lixin MOCN
Mrs Seong Yi MoonKR
Mr Matti MäntysaloFI
Mr Christopher NewsomeGB
Mr Jinsoo NohKR
Mr Masaaki OdaJP
Mr Simon OgierGB
Mr Joon-Shik ParkKR
Mr Youngbae ParkKR
Mr Steve ParkKR
Mr Jucheol ParkKR
Mr Christian PuncktDE
Ms Outi RusanenFI
Mr Beyong Hwan RyuKR
Mr Haridoss SarmaCA
Mr Hiroyuki SATOJP
Mr Tadanobu SatoJP
Mr Wolfgang SchmidtDE
Mr Ilja SchwertfegerDE
Mrs CHIZU SEKINEJP
Mr John ShinKR
Mr Arto Tapani SirviöFI
Mr Yanlin SONGCN
Ms Sarah VellaCA
Mr Xiang WANGCN
Mr Zhixiang WEICN
Mr Thomas WillersDE
Ms Diane H WilliamsUS
Mr Junliang YangCN
Mr Xingye ZHANGCN

Title & Task

WG 2

Materials

 

To develop measuring methods and evaluation methods for materials such as substrates, inks, composite substrates and related materials for printed electronics.
To analyze the effectiveness of the existing methods specific to the materials of printed electronics.
To define specific terms and to determine assessments, requirements, specifications and reliability of materials for printed electronics.
NOTE: Composite substrates include laminated substrates having multi-layer structure.

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Liaisons

Organizations
Liaison Representative
Liaison C
IPC