TC 91

Electronics assembly technology

WG 6 Convenor & Members

Convenor		National Committee
Mr Hisao Kasuga		JP
Mr Yoshihisa KATOH		JP

Member	National Committee
Mr Jung Soo Byun	KR
Mr Sangsuk Cha	KR
Mr Takashi FUKUDA	JP
Mr Andrew Goddard	GB
Mr Taro Hatano	JP
Mr Gerhard Haubner	DE
Mr Ife Hsu	US
Mr Walter Huck	DE
Ms Emma Hudson	GB
Mr Chris Hunt	GB
Mr Young-Min Im	KR
Mr Wongeun Jung	KR
Mr Yoshihisa KATOH	JP
Mr Hyun Ho Kim	KR
Mr Takashi KIMURA	JP
Mr Satoshi Kojima	JP
Ms Kyounghee Lee	KR
Mr Min-su Lee	KR
Mr Jinho Lee	KR
Mr Sangmyung Lee	KR
Mr Jongtae Lee	KR
Mr Alan E Lucero	US
Mr Luciano Mantovani	IT
Mr hirohiko MATSUZAWA	JP
Mr Tanehiro Nakabayashi	JP
Mr Kazuhiko OHMURA	JP
Mr Hwa Sun Park	KR
Ms Tarja Rapala	FI
Mr Kimmo B. Saarinen	FI
Mr Gabriele Sala	IT
Mr Michael Schleicher	DE
Mr Markus Schwerdtfeger	DE
Mr Mandar Pramod Sinnarkar	IN
Mr Douglas J Sober	US
Mr Shigeru SUGINO	JP
Mr Masahiro Tambo	JP
Mr Rainer Taube	DE
Mr Stephen L Tisdale	US
Mr Michail P. Utkin	RU
Mr Martin Wickham	GB
Mr Jürgen Wolf	DE
Mr Ralf Wombacher	DE
Mr Hiroshi Yamada	JP
Mr Shizuo YAMAMOTO	JP
Mr Toshihriro YAMANAKA	JP
Mr Jin YAMAUCHI	JP
Mr Hiroshi YAMAZAKI	JP
Mr Ho Min Yang	KR
Mr Kishio YOKOUCHI	JP

Title & Task

WG 6

Device Embedding assembly technology

Development of international standards and other deliverables in the area of device embedding assembly technology, which covers device embedded substrates and modules using such substrates, however, since it does not include the product itself, standards and other deliverables related to modules will be developed in close liaison with the relevant product committees, such as TC47, SC47A, SC47D, TC40, TC86 and any other relevant TCs.