International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology

 
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WG 1 Convenor & Members

Convenor
National

Committee
Mr Walter Huck
 DE
Member
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National

Committee
Mr Jung Soo ByunKR
Mr Hanseo ChoKR
Mr Nae Eul ChoKR
Mr Marcus EscherDE
Mr Ian Michael FoxGB
Mr Erich GörtlerDE
Mr Robert GregoryGB
Mr Erich GünterDE
Mr Sang-Won HaKR
Mr Taro HatanoJP
Mr Shinya HATTORIJP
Mr Gerhard HaubnerDE
Mr Toshiro HiramotoJP
Ms Emma HudsonGB
Mr Yuichi IWANABEJP
Mr Won Suk JungKR
Mr Tetsuji KAWAMATAJP
Mr Min-su LeeKR
Mr Jinho LeeKR
Mr Jin ho LeeKR
Mr Alan E LuceroUS
Mr Arkady M. MedvedevRU
Mr Hideyuki NAGAIJP
Mr Tanehiro NakabayashiJP
Mr Marc NikolussiDE
Mr Pascall OberndorffNL
Mr Hiroshi OshimaJP
Sechuel ParkKR
Mr Kimmo B. SaarinenFI
Mr Michael SchleicherDE
Mr Koji SerizawaJP
Mr Myungchul ShinKR
Mr Mandar Pramod SinnarkarIN
Mr Douglas J SoberUS
Mr Shigeru SUGINOJP
Mr Masaki SuwaJP
Mr Hiromitsu TakaiJP
Mr Masahiro TamboJP
Mr Stephen L TisdaleUS
Mr Michail P. UtkinRU
Mr Joachim Von Der OheDE
Mr Udo WelzelDE
Mr Katsumi YamamotoJP
Mr Ho Min YangKR
Mrs Chiko YORITAJP
Mr Vladimir N. ZverevRU

Title & Task

WG 1

Requirements for electronic components

 

-Describe how the assembly process stresses the SMD's.

-Find a suitable classification for the SMD's to meet the
different process conditions.

-Find out and describe the tests, with which this
classification can be demonstrated.

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Liaisons

Organizations
Liaison Representative
Liaison C
EDIFICEMr Rainer Schrundner
IPC 
JEITA