International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology

 
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WG 6 Convenor & Members

Convenor
National

Committee
Mr Hisao Kasuga
 JP
Mr Yoshihisa KATOH
 JP
Member
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National

Committee
Mr Jung Soo ByunKR
Mr Sangsuk ChaKR
Mr Andrew CritcherGB
Mr Takashi FUKUDAJP
Mr Andrew GoddardGB
Mr Taro HatanoJP
Mr Gerhard HaubnerDE
Mr Walter HuckDE
Ms Emma HudsonGB
Mr Chris HuntGB
Mr Young-Min ImKR
Mr Wongeun JungKR
Mr Yoshihisa KATOHJP
Mr Hyun Ho KimKR
Mr Takashi KIMURAJP
Mr Satoshi KojimaJP
Mr Min-su LeeKR
Ms Kyounghee LeeKR
Mr Sangmyung LeeKR
Mr Jinho LeeKR
Mr Minsu LeeKR
Mr Jongtae LeeKR
Mr Alan E LuceroUS
Mr Luciano MantovaniIT
Mr hirohiko MATSUZAWAJP
Mr Tanehiro NakabayashiJP
Mr Kazuhiko OHMURAJP
Mr Hwa Sun ParkKR
Ms Tarja RapalaFI
Mr Kimmo B. SaarinenFI
Mr Gabriele SalaIT
Mr Michael SchleicherDE
Mr Markus SchwerdtfegerDE
Mr Mandar Pramod SinnarkarIN
Mr Douglas J SoberUS
Mr Shigeru SUGINOJP
Mr Masahiro TamboJP
Mr Rainer TaubeDE
Mr Stephen L TisdaleUS
Mr Michail P. UtkinRU
Mr Martin WickhamGB
Mr Jürgen WolfDE
Mr Ralf WombacherDE
Mr Hiroshi YamadaJP
Mr Shizuo YAMAMOTOJP
Mr Toshihriro YAMANAKAJP
Mr Jin YAMAUCHIJP
Mr Hiroshi YAMAZAKIJP
Mr Ho Min YangKR
Mr Kishio YOKOUCHIJP

Title & Task

WG 6

Device Embedding assembly technology

 

Development of international standards and other deliverables in the area of device embedding assembly technology, which covers device embedded substrates and modules using such substrates, however, since it does not include the product itself, standards and other deliverables related to modules will be developed in close liaison with the relevant product committees, such as TC47, SC47A, SC47D, TC40, TC86 and any other relevant TCs.