SC 47D |
Semiconductor devices packaging |

Convenor | NationalCommittee | |
---|---|---|
Mr Kee-Won Kwon | KR |
Member | NationalCommittee |
---|---|
Ms peng bo | CN |
Mr Giuseppe De Falco | AT |
Mr Marc Dittes | DE |
Mr Thomas Dütemeyer | DE |
Mr Kimihito HATORI | JP |
Mr Uwe Jansen | DE |
Mr Seung-Mo KIM | KR |
Mr Sungdong Kim | KR |
Mr Thomas Kimmer | AT |
Mr Yoshimasa Kobayashi | JP |
Mr Ryuji KOMEDA | JP |
Mr Yutaka Kumano | JP |
Mr Sang-Geun Lee | KR |
Mr Teck Kheng LEE | SG |
Mr Kun Li | CN |
Mr Yeow Kheng LIM | SG |
Mr Shuji Miyashita | JP |
Mr Takehide MIYAZAKI | JP |
Mr Shinichi Nakamura | JP |
Mr Koji NISHI | JP |
Mr Joon-Shik Park | KR |
Mr Jinwoo Park | KR |
Mr Uwe Rüddenklau | DE |
Mr Takuya SHINODA | JP |
Mr Toshihiro Tsujimura | JP |
Mr Ken Uchida | JP |
Mr Arendt Wintrich | DE |
Mr wu yaguang | CN |
Mr Hiroyoshi Yoshida | JP |
Title & Task
WG 1
Package outlines
Generation, coordination and review of outline drawings and design guideline
Organizations | Liaison Representative |
---|---|
Liaison C | |
JEITA |
