International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology

 
export to xls file

WG 2 Convenor & Members

Convenor
National

Committee
Ms Emma Hudson
 GB
Member
sort down
sort upsort down
National

Committee
Mr Uwe BlosfeldDE
Mr Richard BoyleGB
Mr Sangsuk ChaKR
Mr Sun-Kee ChunKR
Mr Sergey V. DzyubanenkoRU
Mr Ian Michael FoxGB
Mr Andrew GoddardGB
Mr Robert GregoryGB
Mr Koichi HagioJP
Mr Toshiro HiramotoJP
Mr Chris HuntGB
Mr Vladimir D. IvinRU
Mr Gao JianCN
Mr Phil KinnerGB
Mr Jinho LeeKR
Mr Jin ho LeeKR
Mr Alan E LuceroUS
Mr Graham NaisbittGB
Mr Anton NisanRU
Mr Masahide OkamotoJP
Mr Colin John ParkinGB
Mr Len PillingerGB
Mr Gabriele SalaIT
Mr Helmut SchweigartDE
Mr Koji SerizawaJP
Mr Myungchul ShinKR
Mr Mandar Pramod SinnarkarIN
Mr Douglas J SoberUS
Mr Hector SteenGB
Mr Rainer TaubeDE
Mr Kaichi TsurutaJP
Mr Michail P. UtkinRU
Mr Alexei G. VoltchkovRU
Mr Udo WelzelDE
Mr Martin WickhamGB
Mr Tsuyoshi YAMAMOTOJP
Mr Katsumi YamamotoJP
Mr Vladimir N. ZverevRU

Title & Task

WG 2

Requirements for electronics assemblies

 

To establish international acceptance for standards and guidelines in electronics assembly technology. The standards and guidelines are to be developed through a systematic review of existing standards or working through member country standards organizations to refine or create new standards related to electronics assembly technology .

Areas of immediate work will include evaluating standards or quidelines for the following:

1. Assembly process definitions (methods and options)

2. Solder material, fluxes and cleaning standards

3. Solder joint and workmanship standards (NTL-STD-SOLD)

4. Substrate material selection and specification

5. Requirements for writing specifications for SMT

6. In process test and measurement methods

7. Assembly equipment capability evaluation guidelines.

export to xls file

Liaisons

Organizations
Liaison Representative