International Standards and Conformity Assessment for all electrical, electronic and related technologies

SC 47F

Micro-electromechanical systems

 

Comments summarized

Comments received
No comments
No response
P-members 1 8 1
O-members 0 1 4
Non-members 0 4 0
Total 1 13 5

P-members with no response: Pakistan

*Comments rejected because they were not submitted in the IEC Comment form.

 Illustration: Voting

Report of Comments

Document 47F/183/CD

 

Project : IEC 62047-25 Ed. 1.0

IEC 62047-25 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon-based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area

 

Reference Circulation date Closing date Downloads
47F/183/CD 2014-01-03 2014-04-04
Compilation of Comments
CC file    
Report of Comments
47F/193/CC 2014-07-18  
 
export to xls file

All comments

Country
Status
Received
Comments
Belgium O 2014-04-01 N
China P 2014-04-02 N
Czech Republic O
Finland P 2014-04-03 N
France P 2014-03-19 N
Germany P 2014-04-01 Y
Greece - 2014-04-02 N
Ireland - 2014-04-04 N
Italy P 2014-03-24 N
Japan P 2014-04-01 N
Korea, Republic of P 2014-03-17 N
Netherlands O
Pakistan P
Poland O
Portugal - 2014-04-04 N
Russian Federation P 2014-04-04 N
Singapore -*
Sweden O
United Kingdom - 2014-03-12 N
United States of America P 2014-04-03 N