International Standards and Conformity Assessment for all electrical, electronic and related technologies

SC 47F

Micro-electromechanical systems


Comments summarized

Comments received
No comments
No response
P-members 3 5 2
O-members 0 1 4
Non-members 0 3 0
Total 3 9 6

P-members with no response: Finland; United States of America

*Comments rejected because they were not submitted in the IEC Comment form.

 Illustration: Voting

Report of Comments

Document 47F/125/CD


Project : IEC 62047-16:2015 ED1

IEC 62047-16 Ed.1: Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films - Wafer curvature and cantilever beam deflection methods


Reference Circulation date Closing date Downloads
47F/125/CD 2012-07-27 2012-09-28
Compilation of Comments
CC file    
Report of Comments
47F/134A/CC 2012-12-07  
export to xls file

All comments

Belgium O 2012-09-26 N
China P 2012-09-28 N
Czech Republic O
Finland P
France P 2012-09-28 N
Germany P 2012-09-26 Y
Italy P 2012-09-17 N
Japan P 2012-09-24 Y
Korea, Republic of P 2012-09-28 Y
Netherlands O
Pakistan P 2012-09-28 N
Poland O
Portugal - 2012-09-28 N
Russian Federation P 2012-09-28 N
Spain - 2012-09-27 N
Sweden O
United Kingdom - 2012-08-30 N
United States of America P