International Standards and Conformity Assessment for all electrical, electronic and related technologies

SC 47D

Semiconductor devices packaging


Comments summarized

Comments received
No comments
No response
P-members 3 6 2
O-members 2 2 9
Non-members 0 2 0
Total 5 10 11

P-members with no response: Pakistan; United States of America

*Comments rejected because they were not submitted in the IEC Comment form.

 Illustration: Voting

Report of Comments

Document 47D/847/DC


Proposal for a future IEC Technical Report on Glossary for Semiconductor device packages -Semiconductor package name and parts name


Reference Circulation date Closing date Downloads
47D/847/DC 2013-09-20 2013-11-22
Compilation of Comments
CC file    
export to xls file

All comments

Austria P 2013-11-21 N
Belarus O
Belgium P 2013-11-05 Y
China P 2013-11-22 Y
Czech Republic O
Denmark O
Finland P 2013-11-21 N
France P 2013-10-24 N
Germany P 2013-11-19 Y
Greece - 2013-11-21 N
Ireland - 2013-11-18 N
Italy O 2013-11-21 Y
Japan P 2013-10-17 N
Korea, Republic of P 2013-11-11 N
Netherlands O 2013-11-15 Y
Pakistan P
Poland O
Portugal O 2013-11-22 N
Romania O
Russian Federation O 2013-11-22 N
Spain O
Sweden O
Thailand O
Ukraine O
United Kingdom P 2013-11-05 N
United States of America P