International Standards and Conformity Assessment for all electrical, electronic and related technologies

SC 47D

Semiconductor devices packaging

 

Comments summarized

Comments received
No comments
No response
P-members 0 9 2
O-members 0 5 8
Non-members 0 2 0
Total 0 16 10

P-members with no response: Pakistan; United States of America

*Comments rejected because they were not submitted in the IEC Comment form.

 Illustration: Voting

Report of Comments

Document 47D/844/CD

 

Project : IEC 60191-2 f70 Ed. 1.0

IEC 60191-2/F70 Ed.1: Proposed new package outline - P-ZMP-P165

 

Reference Circulation date Closing date Downloads
47D/844/CD 2013-09-06 2013-12-06
Compilation of Comments
CC file    
Report of Comments
47D/852/CC 2014-08-22  
 
export to xls file

All comments

Country
Status
Received
Comments
Austria P 2013-12-05 N
Belarus O 2013-12-06 N
Belgium P 2013-11-12 N
China P 2013-12-06 N
Czech Republic O
Denmark O
Finland P 2013-11-21 N
France P 2013-10-24 N
Germany P 2013-12-03 N
Greece - 2013-12-06 N
Ireland - 2013-12-04 N
Italy O 2013-11-26 N
Japan P 2013-11-08 N
Korea, Republic of P 2013-11-25 N
Netherlands O 2013-12-02 N
Pakistan P
Poland O
Portugal O 2013-12-06 N
Romania O
Russian Federation O 2013-12-06 N
Singapore -*
Spain O
Sweden O
Thailand O
Ukraine O
United Kingdom P 2013-11-14 N
United States of America P