International Standards and Conformity Assessment for all electrical, electronic and related technologies

SC 47D

Semiconductor devices packaging


Comments summarized

Comments received
No comments
No response
P-members 1 8 2
O-members 0 5 8
Non-members 0 2 0
Total 1 15 10

P-members with no response: Pakistan; United States of America

*Comments rejected because they were not submitted in the IEC Comment form.

 Illustration: Voting

Report of Comments

Document 47D/842/CD


Project : IEC 60191-1 ED3

IEC 60191-1 Ed.3: Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices


Reference Circulation date Closing date Downloads
47D/842/CD 2013-09-06 2013-12-06
Compilation of Comments
CC file    
Report of Comments
47D/851A/CC 2016-10-21  
export to xls file

All comments

Austria P 2013-12-05 N
Belarus O 2013-12-06 N
Belgium P 2013-11-12 N
China P 2013-12-06 N
Czech Republic O
Denmark O
Finland P 2013-11-21 N
France P 2013-10-24 N
Germany P 2013-12-03 N
Greece - 2013-12-06 N
Ireland - 2013-12-04 N
Italy O 2013-11-26 N
Japan P 2013-11-26 Y
Korea, Republic of P 2013-11-25 N
Netherlands O 2013-12-02 N
Pakistan P
Poland O
Portugal O 2013-12-06 N
Romania O
Russian Federation O 2013-12-06 N
Spain O
Sweden O
Thailand O
Ukraine O
United Kingdom P 2013-11-14 N
United States of America P