International Standards and Conformity Assessment for all electrical, electronic and related technologies

SC 47D

Semiconductor devices packaging

 

Vote for P-Members

P-Members
Voting
P-Members
In favour
In favour %
Criteria
Result
6 6 100 >=66.7% APPROVED

All Votes

Total
Votes Cast
Total
Against
Against %
Criteria
Result
12 0 0 <=25% APPROVED

 Illustration: Voting

Voting Result

APPROVED

Document 47D/837/FDIS

 

Project : IEC 60191-4 Ed. 3.0

IEC 60191-4 Ed. 3: Mechanical Standardization of Semiconductor Devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages

 

Reference Circulation date Closing date Downloads
47D/837/FDIS 2013-07-19 2013-09-20


Compilation of Comments
CC file    
Voting Result
47D/848/RVD 2013-09-27  
 
export to xls file

Result of Voting

Country
Status
Received
Vote
Comments
Austria P 2013-09-19 A -
Belarus O 2013-09-20 A -
Belgium P 2013-08-28 Y -
China P 2013-09-18 A -
Denmark O 2013-08-27 A -
Finland P 2013-09-11 A -
France P 2013-09-20 A -
Germany P 2013-09-19 Y -
Greece - 2013-09-17 A -
Hungary - 2013-09-20 Y -
India - 2013-09-17 A -
Ireland - 2013-09-17 Y -
Italy O 2013-09-17 Y -
Japan P 2013-07-31 Y -
Korea, Republic of P 2013-09-12 Y -
Latvia - 2013-09-18 Y -
Netherlands O 2013-09-18 Y -
Pakistan P 2013-09-19 Y -
Poland O 2013-09-16 A -
Portugal O 2013-09-20 A -
Qatar - 2013-09-19 A -
Russian Federation O 2013-09-20 Y -
Spain O 2013-09-16 A -
United Kingdom P 2013-08-21 Y -
United States of America P 2013-09-20 A -

NOTES:



  1. Vote: Does the National Committee agree to publish the FDIS as an International Standard:
    Y = In favour; N = Against; A = Abstention.

  2. Only votes received before the closing date are counted in determining the decision.
    Late Votes: (0).

  3. Abstentions are not taken into account when totalizing the votes.

  4. P-members not voting: (0).


*Comments rejected because they were not submitted in the IEC Comment form.
**Vote rejected due to lack of justification statement.