International Standards and Conformity Assessment for all electrical, electronic and related technologies

SC 47D

Semiconductor devices packaging

 

Comments summarized

Comments received
No comments
No response
P-members 1 8 2
O-members 0 5 8
Non-members 0 2 0
Total 1 15 10

P-members with no response: Pakistan; United States of America

*Comments rejected because they were not submitted in the IEC Comment form.

 Illustration: Voting

Report of Comments

Document 47D/834/CD

 

Project : IEC 60191-6-13 Ed. 2.0

IEC 60191-6-13 Ed.2: Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA/FLGA)

 

Reference Circulation date Closing date Downloads
47D/834/CD 2013-05-03 2013-08-09
Compilation of Comments
CC file    
Report of Comments
47D/839A/CC 2013-12-20  
 
export to xls file

All comments

Country
Status
Received
Comments
Austria P 2013-08-09 N
Belarus O 2013-08-09 N
Belgium P 2013-07-18 N
China P 2013-08-09 N
Czech Republic O
Denmark O
Finland P 2013-07-10 N
France P 2013-07-10 N
Germany P 2013-08-07 Y
Greece - 2013-07-26 N
Ireland - 2013-08-06 N
Italy O 2013-07-19 N
Japan P 2013-05-10 N
Korea, Republic of P 2013-08-05 N
Netherlands O 2013-07-24 N
Pakistan P
Poland O
Portugal O 2013-08-09 N
Romania O
Russian Federation O 2013-08-08 N
Spain O
Sweden O
Thailand O
Ukraine O
United Kingdom P 2013-07-26 N
United States of America P