International Standards and Conformity Assessment for all electrical, electronic and related technologies

SC 47D

Semiconductor devices packaging

 

Vote for P-Members

P-Members
Voting
P-Members
In favour
In favour %
Criteria
Result
9 9 100 >=66.7% APPROVED

All Votes

Total
Votes Cast
Total
Against
Against %
Criteria
Result
10 0 0 <=25% APPROVED

 Illustration: Voting

Voting Result

APPROVED

Document 47D/819/CDV

 

Project : IEC 60191-2 f69 Ed. 1.0

IEC 60191-2 f69 Ed.1: Proposed new package outline - flange mount package with flat leads, P-SFM-F8 - To be published as outline 187E, if approved.

 

Reference Circulation date Closing date Downloads
47D/819/CDV 2011-12-02 2012-05-04
Compilation of Comments
CC file    
Voting Result
47D/824/RVC 2012-05-18  
 
export to xls file

Result of Voting

Country
Status
Received
Vote
Comments
Austria P 2012-05-04 A -
Belarus O 2012-05-04 A -
Belgium P 2012-04-16 Y -
China P 2012-04-27 Y -
Finland P 2011-12-08 A -
France P 2012-05-03 Y -
Germany P 2012-04-26 Y -
Greece - 2012-05-04 A -
Italy O 2012-05-03 A -
Japan P 2012-04-19 Y -
Korea, Republic of P 2012-04-03 Y -
Mexico O 2012-05-03 A -
Netherlands O 2012-04-24 A -
Pakistan P 2012-04-30 Y -
Portugal O 2012-05-04 A -
Romania P 2012-05-03 Y -
Russian Federation O 2012-05-02 Y -
Spain O 2012-05-03 A -
United Kingdom P 2012-04-19 Y -
United States of America P 2012-05-04 A -

NOTES:



  1. Vote: Does the National Committee agree to the circulation of the draft as a FDIS:
    Y = In favour; N = Against; A = Abstention.

  2. Only votes received before the closing date are counted in determining the decision.
    Late Votes: (0).

  3. Abstentions are not taken into account when totalizing the votes.

  4. P-members not voting: (0).


*Comments rejected because they were not submitted in the IEC Comment form.
**Vote rejected due to lack of justification statement.