International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology

 

Comments summarized

Comments received
No comments
No response
P-members 2 11 0
O-members 0 5 14
Non-members 0 2 0
Total 2 18 14


 Illustration: Voting

Report of Comments

Document 91/1152/CD

 

Project : IEC 61189-3-719 Ed. 1.0

IEC 61189-3-719 Ed.1: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Test 3E19: Monitoring of single plated-through hole (PTH) resistance change during thermal cycling

 

Reference Circulation date Closing date Downloads
91/1152/CD 2013-11-15 2014-01-17
Compilation of Comments
CC file    
Report of Comments
91/1167/CC 2014-02-14  
 
export to xls file

All comments

Country
Status
Received
Comments
Austria O 2014-01-16 N
Belgium P 2013-12-26 N
Brazil P 2014-01-17 N
Bulgaria O
China P 2014-01-17 N
Czech Republic O
Denmark O
Finland P 2013-11-20 N
France O 2014-01-16 N
Germany P 2014-01-16 Y
Greece - 2014-01-17 N
Hungary O 2014-01-17 N
India P 2013-12-31 N
Ireland - 2013-12-04 N
Israel O
Italy P 2014-01-13 N
Japan P 2014-01-10 N
Korea, Republic of P 2013-12-26 N
Netherlands P 2014-01-08 N
Norway O
Poland O
Portugal O 2014-01-17 N
Romania O
Russian Federation P 2013-12-25 N
Serbia O
Singapore O
Slovenia O 2014-01-16 N
Spain O
Sweden O
Switzerland O
Turkey O
Ukraine O
United Kingdom P 2014-01-02 N
United States of America P 2014-01-14 Y