International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology

 

Comments summarized

Comments received
No comments
No response
P-members 4 8 1
O-members 0 3 16
Non-members 0 1 0
Total 4 12 17

P-members with no response: Finland

*Comments rejected because they were not submitted in the IEC Comment form.

 Illustration: Voting

Report of Comments

Document 91/1082/CD

 

Project : IEC/TS 62878-2-4 Ed. 1.0

IEC/TS 62326-17 Ed.1: Printed boards - Part 17: Device embedded substrates - TEG (test element group)

 

Reference Circulation date Closing date Downloads
91/1082/CD 2013-01-25 2013-03-29
Compilation of Comments
CC file    
Report of Comments
91/1117/CC 2013-07-19  
 
export to xls file

All comments

Country
Status
Received
Comments
Austria O 2013-03-26 N
Belgium P 2013-03-05 N
Brazil P 2013-03-28 N
Bulgaria O
China P 2013-03-29 Y
Czech Republic O
Denmark O
Finland P
France O 2013-03-28 N
Germany P 2013-03-27 Y
Greece - 2013-03-29 N
Hungary O
India P 2013-03-25 Y
Israel O
Italy P 2013-03-25 Y
Japan P 2013-03-27 N
Korea, Republic of P 2013-03-23 N
Netherlands P 2013-03-20 N
Norway O
Poland O
Portugal O 2013-03-28 N
Romania O
Russian Federation P 2013-03-21 N
Serbia O
Singapore O
Slovenia O
Spain O
Sweden O
Switzerland O
Turkey O
Ukraine O
United Kingdom P 2013-03-01 N
United States of America P 2013-03-29 N