International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology

 

Comments summarized

Comments received
No comments
No response
P-members 2 11 0
O-members 0 3 16
Non-members 0 1 0
Total 2 15 16


 Illustration: Voting

Report of Comments

Document 91/1072/CD

 

Project : IEC 61189-5-4 Ed. 1.0

IEC 61189-5-4 Ed.1: Test methods for electrical materials, interconnection structures and assemblies - Part 5-4: Test methods for printed board assemblies: Solder alloys and fluxed and non-fluxed solid wire

 

Reference Circulation date Closing date Downloads
91/1072/CD 2012-11-09 2013-02-15
Compilation of Comments
CC file    
Report of Comments
91/1114/CC 2013-07-19  
 
export to xls file

All comments

Country
Status
Received
Comments
Austria O 2013-02-14 N
Belgium P 2013-01-22 N
Brazil P 2013-02-15 N
Bulgaria O
China P 2013-02-05 N
Czech Republic O
Denmark O
Finland P 2012-12-18 N
France O 2013-02-13 N
Germany P 2013-02-14 N
Greece - 2013-02-15 N
Hungary O
India P 2013-02-13 Y
Israel O
Italy P 2013-02-11 N
Japan P 2013-02-08 N
Korea, Republic of P 2013-02-12 N
Netherlands P 2013-02-01 N
Norway O
Poland O
Portugal O 2013-02-15 N
Romania O
Russian Federation P 2013-02-14 N
Serbia O
Singapore O
Slovenia O
Spain O
Sweden O
Switzerland O
Turkey O
Ukraine O
United Kingdom P 2013-01-16 N
United States of America P 2013-02-12 Y