International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology


Comments summarized

Comments received
No comments
No response
P-members 2 10 1
O-members 0 3 16
Non-members 0 2 0
Total 2 15 17

P-members with no response: United States of America

*Comments rejected because they were not submitted in the IEC Comment form.

 Illustration: Voting

Report of Comments

Document 91/1056/CD


Project : IEC 62137-4:2014 ED1

IEC 62137-4 Ed.1: Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices


Reference Circulation date Closing date Downloads
91/1056/CD 2012-09-07 2012-11-09
Compilation of Comments
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All comments

Austria O 2012-11-06 N
Belgium P 2012-10-16 N
Brazil P 2012-11-09 N
Bulgaria O
China P 2012-11-08 N
Czech Republic O
Denmark O
Finland P 2012-11-05 N
France O 2012-11-09 N
Germany P 2012-11-09 N
Greece - 2012-11-08 N
Hungary O
India P 2012-11-08 N
Israel O
Italy P 2012-11-07 N
Japan P 2012-11-09 Y
Korea, Republic of P 2012-11-02 Y
Mexico - 2012-11-08 N
Netherlands P 2012-11-06 N
Norway O
Poland O
Portugal O 2012-11-09 N
Romania O
Russian Federation P 2012-11-01 N
Serbia O
Singapore O
Slovenia O
Spain O
Sweden O
Switzerland O
Turkey O
Ukraine O
United Kingdom P 2012-10-09 N
United States of America P