International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology

 

Comments summarized

Comments received
No comments
No response
P-members 4 8 1
O-members 0 4 16
Non-members 0 1 0
Total 4 13 17

P-members with no response: Finland

*Comments rejected because they were not submitted in the IEC Comment form.

 Illustration: Voting

Report of Comments

Document 91/1049/CD

 

Project : IEC/TR 62878-2-2 Ed. 1.0

IEC 62326-15: Printed boards - Part 15: Device Embedded Substrate General electrical test guide for device embedded substrate with active devices, passive components (Capacitor, Resistor, Inductor, etc), Integrated passive device (IPD), and discrete packages

 

Reference Circulation date Closing date Downloads
91/1049/CD 2012-08-24 2012-10-26
Compilation of Comments
CC file    
Report of Comments
91/1134A/CC 2013-08-30  
 
export to xls file

All comments

Country
Status
Received
Comments
Austria O 2012-10-22 N
Belgium P 2012-10-09 Y
Brazil P 2012-10-26 N
Bulgaria O
China P 2012-10-25 N
Czech Republic O
Denmark O
Finland P
France O 2012-10-25 N
Germany P 2012-10-26 Y
Greece - 2012-10-23 N
Hungary O
India P 2012-10-25 N
Israel O
Italy P 2012-10-25 N
Japan P 2012-10-26 Y
Korea, Republic of P 2012-10-22 N
Mexico O 2012-10-26 N
Netherlands P 2012-10-17 N
Norway O
Poland O
Portugal O 2012-10-26 N
Romania O
Russian Federation P 2012-10-23 N
Serbia O
Singapore O
Slovenia O
Spain O
Sweden O
Switzerland O
Turkey O
Ukraine O
United Kingdom P 2012-10-09 N
United States of America P 2012-10-25 Y