International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology


Comments summarized

Comments received
No comments
No response
P-members 4 9 0
O-members 0 4 16
Non-members 0 1 0
Total 4 14 16

 Illustration: Voting

Report of Comments

Document 91/1047/CD


Project : IEC 60068-2-58:2015 ED4

IEC 60068-2-58 Ed.4: Environmental testing - Part 2-58: Tests - Test Td - Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)


Reference Circulation date Closing date Downloads
91/1047/CD 2012-08-24 2012-10-26
Compilation of Comments
CC file    
Report of Comments
91/1135/CC 2013-08-23  
export to xls file

All comments

Austria O 2012-10-22 N
Belgium P 2012-10-16 N
Brazil P 2012-10-26 N
Bulgaria O
China P 2012-10-25 N
Czech Republic O
Denmark O
Finland P 2012-09-28 Y
France O 2012-10-25 N
Germany P 2012-10-26 Y
Greece - 2012-10-23 N
Hungary O
India P 2012-10-25 Y
Israel O
Italy P 2012-10-25 N
Japan P 2012-10-23 N
Korea, Republic of P 2012-10-22 N
Mexico O 2012-10-26 N
Netherlands P 2012-10-17 N
Norway O
Poland O
Portugal O 2012-10-26 N
Romania O
Russian Federation P 2012-10-23 N
Serbia O
Singapore O
Slovenia O
Spain O
Sweden O
Switzerland O
Turkey O
Ukraine O
United Kingdom P 2012-10-09 N
United States of America P 2012-10-25 Y