International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology


Comments summarized

Comments received
No comments
No response
P-members 6 8 1
O-members 1 3 14
Total 7 11 15

P-members with no response: Finland

*Comments rejected because they were not submitted in the IEC Comment form.

 Illustration: Voting

Report of Comments

Document 91/1023/CD


Project : IEC 61190-1-2:2014 ED3

IEC 61190-1-2 Am.1 Ed.2: Attachment materials for electronic assembly - Part 1-2: Requirement for soldering pastes for high-quality interconnects in electronics assembly


Reference Circulation date Closing date Downloads
91/1023/CD 2011-12-23 2012-03-23
Compilation of Comments
CC file    
Report of Comments
91/1042/CC 2012-05-25  
export to xls file

All comments

Austria O
Belgium P 2012-03-22 Y
Brazil P 2012-03-23 N
Bulgaria O
China P 2012-03-21 Y
Czech Republic O
Denmark O
Finland P
France P 2012-03-23 N
Germany P 2012-03-07 N
Hungary O 2012-03-22 N
India P 2012-03-22 Y
Israel O
Italy P 2012-03-22 Y
Japan P 2012-03-16 Y
Korea, Republic of P 2012-02-10 N
Mexico O 2012-03-22 N
Netherlands P 2012-03-22 N
Norway O
Poland O
Portugal O 2012-03-23 N
Romania P 2012-03-23 N
Russian Federation P 2012-03-21 N
Serbia O
Singapore O
Slovenia O
Spain O 2012-03-16 Y
Sweden O
Switzerland O
Turkey O
Ukraine O
United Kingdom P 2012-02-27 N
United States of America P 2012-03-22 Y