International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
TC 91 |
Electronics assembly technology |
Comments summarized
Comments received |
No comments |
No response |
|
|---|---|---|---|
| P-members | 6 | 8 | 1 |
| O-members | 1 | 3 | 14 |
| Total | 7 | 11 | 15 |
P-members with no response: Finland
*Comments rejected because they were not submitted in the IEC Comment form.
Report of Comments
Document 91/1023/CD
Project : IEC 61190-1-2 am1 Ed. 2.0
IEC 61190-1-2 Am.1 Ed.2: Attachment materials for electronic assembly - Part 1-2: Requirement for soldering pastes for high-quality interconnects in electronics assembly
| Reference | Circulation date | Closing date | Downloads |
|---|---|---|---|
| 91/1023/CD | 2011-12-23 | 2012-03-23 | |
| Report of Comments | |||
| 91/1042/CC | 2012-05-25 | ||
839 kB
118 kB
All comments
Country |
Status |
Received |
Comments |
|---|---|---|---|
| Austria | O | ||
| Belgium | P | 2012-03-22 | Y |
| Brazil | P | 2012-03-23 | N |
| Bulgaria | O | ||
| China | P | 2012-03-21 | Y |
| Czech Republic | O | ||
| Denmark | O | ||
| Finland | P | ||
| France | P | 2012-03-23 | N |
| Germany | P | 2012-03-07 | N |
| Hungary | O | 2012-03-22 | N |
| India | P | 2012-03-22 | Y |
| Israel | O | ||
| Italy | P | 2012-03-22 | Y |
| Japan | P | 2012-03-16 | Y |
| Korea, Republic of | P | 2012-02-10 | N |
| Mexico | O | 2012-03-22 | N |
| Netherlands | P | 2012-03-22 | N |
| Norway | O | ||
| Poland | O | ||
| Portugal | O | 2012-03-23 | N |
| Romania | P | 2012-03-23 | N |
| Russian Federation | P | 2012-03-21 | N |
| Serbia | O | ||
| Singapore | O | ||
| Slovenia | O | ||
| Spain | O | 2012-03-16 | Y |
| Sweden | O | ||
| Switzerland | O | ||
| Turkey | O | ||
| Ukraine | O | ||
| United Kingdom | P | 2012-02-27 | N |
| United States of America | P | 2012-03-22 | Y |