International Standards and Conformity Assessment for all electrical, electronic and related technologies

SC 47F

Micro-electromechanical systems

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub
Date

Stability

Date

SC 47F01Seungmin Hyun,Yong-Hak HuhCCDV2014-122017

History

Stage
Document
Downloads
Decision Date
Target Date
PNW
47F/46/NP pdf file 1040 kB
2010-02-26 
ANW
47F/58/RVN pdf file 266 kB
47F/58A/RVN pdf file 268 kB
2010-07-092010-07-15
1CD
47F/78/CD pdf file 840 kB
2011-03-042010-11-30
CDM
47F/101/CC doc file 300 kB
pdf file 255 kB
47F/101A/CC doc file 338 kB
pdf file 237 kB
2011-09-08 
A2CD
47F/101/CC doc file 300 kB
pdf file 255 kB
47F/101A/CC doc file 338 kB
pdf file 237 kB
2012-03-012011-11-30
2CD
47F/121/CD pdf file 776 kB
2012-03-02 
CDM
47F/132/CC doc file 125 kB
pdf file 164 kB
47F/132A/CC doc file 138 kB
pdf file 188 kB
2012-09-202012-07-31
A3CD
47F/132/CC doc file 125 kB
pdf file 164 kB
47F/132A/CC doc file 138 kB
pdf file 188 kB
2012-12-182012-11-30
3CD
47F/146/CD pdf file 563 kB
2013-01-072013-02-28
ACDV
47F/165/CC doc file 220 kB
pdf file 186 kB
2013-08-072013-05-31
CCDV
47F/166/CDV
pdf file 582 kB
pdf file 581 kB
2013-10-252013-11-30
ADIS
 2014-04-30
DEC
 2014-05-31

Project

IEC 62047-17 Ed. 1.0

Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin films

 

Remark:

SMB/4976/DL - 3CD: 2013-01-31 Project plan: CDV: 2011-10 FDIS: 2012-09 IS: 2013-06 Relevant Documents: IEC 62047-1, Micro electromechanical devices - Terms and definitions. IEC 62047-2, Micro electromechanical devices - Tensile testing method of thin film materials. IEC 62047-3, Micro electromechanical devices - Thin film standard test piece

 

Associated Documents:

SMB/4976/DL