International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
SC 47F |
Micro-electromechanical systems |
Detail
Committee | Working Groups | Project Leader | Current Status | Frcst Pub Date | Stability Date |
|---|---|---|---|---|---|
| SC 47F | 01 | Dr. J-H. Kim & Dr. H-J. Lee | CCDV | 2014-05 | 2017 |
History
Stage | Document | Downloads | Decision Date | Target Date | ||||
|---|---|---|---|---|---|---|---|---|
| PNW |
| 2011-07-29 | ||||||
| ANW |
| 2011-12-02 | 2011-12-15 | |||||
| 1CD |
| 2012-08-07 | 2012-07-31 | |||||
| CDM |
| 2012-10-16 | ||||||
| ACDV |
| 2012-12-07 | 2012-11-30 | |||||
| CCDV |
| 2013-03-27 | 2013-02-28 | |||||
| ADIS | 2013-09-30 | |||||||
| DEC | 2013-10-31 | |||||||
681 kB
115 kBProject
IEC 62047-22 Ed. 1.0
Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates
Remark:
Project plan - CDV: 2013-03, FDIS: 2014-03 - Relevant docs: IEC 62047-2, Micro-electromechanical devices Part 2: Tensile testing method of thin film materials IEC 62047-3, Micro-electromechanical devices - Part 3: Thin film standard test piece for tensile testing IEC 62047-8, Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films ISO 527-3, Plastics - Determination of tensile properties - Part 3: Test conditions for films & sheets