International Standards and Conformity Assessment for all electrical, electronic and related technologies

SC 47F

Micro-electromechanical systems

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub
Date

Stability

Date

SC 47F01J-H. Kim and H-J. LeePPUB2014-062017

History

Stage
Document
Downloads
Decision Date
Target Date
PNW
47F/96/NP pdf file 681 kB
2011-07-29 
ANW
47F/112/RVN pdf file 126 kB
47F/112A/RVN pdf file 127 kB
2011-12-022011-12-15
1CD
47F/128/CD pdf file 373 kB
2012-08-072012-07-31
CDM
47F/137/CC doc file 115 kB
pdf file 134 kB
47F/137A/CC doc file 123 kB
pdf file 162 kB
2012-10-16 
ACDV
47F/137/CC doc file 115 kB
pdf file 134 kB
47F/137A/CC doc file 123 kB
pdf file 162 kB
2012-12-072012-11-30
CCDV
47F/148/CDV pdf file 252 kB
pdf file 277 kB
2013-03-272013-02-28
ADIS
47F/172/RVC doc file 101 kB
pdf file 56 kB
2013-08-302013-09-30
DEC
2014-01-212013-12-31
RDIS
2014-01-282014-02-15
CDIS
47F/186/FDIS

2014-03-142014-04-30
APUB
47F/190/RVD pdf file 46 kB
2014-05-202014-05-15
BPUB
2014-05-212014-05-31
PPUB
2014-06-192014-06-30

Project

IEC 62047-22 Ed. 1.0

Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates

 

Remark:

Project plan - CDV: 2013-03, FDIS: 2014-03 - Relevant docs: IEC 62047-2, Micro-electromechanical devices Part 2: Tensile testing method of thin film materials IEC 62047-3, Micro-electromechanical devices - Part 3: Thin film standard test piece for tensile testing IEC 62047-8, Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films ISO 527-3, Plastics - Determination of tensile properties - Part 3: Test conditions for films & sheets