International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
SC 47F |
Micro-electromechanical systems |
Detail
Committee | Working Groups | Project Leader | Current Status | Frcst Pub Date | Stability Date |
|---|---|---|---|---|---|
| SC 47F | 01 | Seungmin Hyun,Yong-Hak Huh | 3CD | 2013-06 |
History
Stage | Document | Downloads | Decision Date | Target Date | ||||
|---|---|---|---|---|---|---|---|---|
| PNW |
| 2010-02-26 | ||||||
| ANW |
| 2010-07-09 | 2010-07-15 | |||||
| 1CD |
| 2011-03-04 | 2010-11-30 | |||||
| CDM |
| 2011-09-08 | ||||||
| A2CD |
| 2012-03-01 | 2011-11-30 | |||||
| 2CD |
| 2012-03-02 | ||||||
| CDM |
| 2012-09-20 | 2012-07-31 | |||||
| A3CD |
| 2012-12-18 | 2012-11-30 | |||||
| 3CD |
| 2013-01-07 | 2013-02-28 | |||||
| A4CD | 2013-05-31 | |||||||
1040 kB
300 kBProject
IEC 62047-17 Ed. 1.0
Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin films
Remark:
Project plan: CDV: 2011-10 FDIS: 2012-09 IS: 2013-06 Relevant Documents: IEC 62047-1, Micro electromechanical devices - Terms and definitions. IEC 62047-2, Micro electromechanical devices - Tensile testing method of thin film materials. IEC 62047-3, Micro electromechanical devices - Thin film standard test piece