International Standards and Conformity Assessment for all electrical, electronic and related technologies

SC 47D

Semiconductor devices packaging

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub
Date

Stability

Date

SC 47D02Hirofumi NakajimaDEL2013-122018

History

Stage
Document
Downloads
Decision Date
Target Date
AMW
47D/751/MCR pdf file 40 kB
2009-08-21 
1CD
47D/755/CD pdf file 420 kB
2009-10-232009-10-31
ACDV
47D/767/CC doc file 118 kB
pdf file 276 kB
2010-04-302010-02-28
CCDV
47D/781/CDV pdf file 427 kB
pdf file 420 kB
47D/781F/CDV pdf file 420 kB
2010-08-272010-06-30
ADIS
47D/794/RVC doc file 131 kB
pdf file 260 kB
2011-04-012011-04-30
DEC
2012-02-012012-04-30
RDIS
2012-02-102012-02-29
CDIS
47D/829/FDIS

2012-10-042012-05-15
NCD
47D/830/RVD pdf file 7 kB
47D/830A/RVD pdf file 56 kB
2012-12-132012-12-15
DEL
47D/830/RVD pdf file 7 kB
47D/830A/RVD pdf file 56 kB
2013-10-242013-06-30

Project

IEC 60191-6-5 Ed. 2.0

Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA)

 

Remark:

CDV: 2010-05 FDIS: 2011-02