International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
SC 47D |
Semiconductor devices packaging |
Detail
Committee | Working Groups | Project Leader | Current Status | Frcst Pub Date | Stability Date |
|---|---|---|---|---|---|
| SC 47D | 02 | Hirofumi Nakajima | NCD | 2013-01 | 2018 |
History
Stage | Document | Downloads | Decision Date | Target Date | ||||
|---|---|---|---|---|---|---|---|---|
| AMW |
| 2009-08-21 | ||||||
| 1CD |
| 2009-10-23 | 2009-10-31 | |||||
| ACDV |
| 2010-04-30 | 2010-02-28 | |||||
| CCDV |
| 2010-08-27 | 2010-06-30 | |||||
| ADIS |
| 2011-04-01 | 2011-04-30 | |||||
| DEC | 2012-02-01 | 2012-04-30 | ||||||
| RDIS | 2012-02-10 | 2012-02-29 | ||||||
| CDIS |
| 2012-10-04 | 2012-05-15 | |||||
| NCD |
| 2012-12-13 | 2012-12-15 | |||||
| A2CD | 2013-06-30 | |||||||
40 kB
118 kBProject
IEC 60191-6-5 Ed. 2.0
Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA)
Remark:
CDV: 2010-05 FDIS: 2011-02