International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
SC 47D |
Semiconductor devices packaging |
Detail
Committee | Working Groups | Project Leader | Current Status | Frcst Pub Date | Stability Date |
|---|---|---|---|---|---|
| SC 47D | 02 | Munehiro YAMADA | ADIS | 2013-08 | 2018 |
History
Stage | Document | Downloads | Decision Date | Target Date | ||||
|---|---|---|---|---|---|---|---|---|
| AMW |
| 2010-01-08 | ||||||
| 1CD |
| 2010-04-30 | 2010-02-28 | |||||
| CDM |
| 2010-08-20 | 2010-08-31 | |||||
| ACDV |
| 2011-05-27 | 2010-11-30 | |||||
| CCDV |
| 2011-06-08 | 2011-06-30 | |||||
| ADIS |
| 2011-11-22 | 2012-02-15 | |||||
| DEC | 2013-03-31 | |||||||
19 kB
133 kBProject
IEC 60191-4 Ed. 3.0
Mechanical Standardization Of Semiconductor Devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
Remark:
SMB/4976/DL - DEC: 2013-03-31 CDV: 2010-10 FDIS: 2011-07
Associated Documents:
SMB/4976/DL