International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Techniques d'assemblage des composants électroniques

 

Détail

Comité
Groupes de Travail
Chef de Projet

Statut

Courant

Frcst Pub
Date

Date

Stabilité

TC 9102D.BergmanDEL2013-112016

Historique

Stage
Document
Downloads
Date de Décision
Date Cible
PNW
91/979/NP pdf file 714 kB
2011-06-13 
ANW
91/1018/RVN pdf file 218 kB
2011-11-082011-10-31
1CD
91/1036/CD pdf file 1395 kB
2012-03-272012-06-30
CDM
91/1058/CC doc file 138 kB
pdf file 232 kB
91/1058A/CC doc file 140 kB
pdf file 242 kB
2012-09-07 
ACDV
91/1058/CC doc file 138 kB
pdf file 232 kB
91/1058A/CC doc file 140 kB
pdf file 242 kB
2012-11-012012-11-30
CCDV
91/1062/CDV pdf file 1016 kB
pdf file 1031 kB
2013-01-172013-01-31
NADIS
91/1109/RVC doc file 164 kB
pdf file 88 kB
2013-06-252013-07-31
DEL
2013-10-11 

Projet

IEC 62588 Ed. 1.0

Marquage et étiquetage des composants, PCB et PCBA, pour identifier le plomb (Pb), l'absence de plomb (sans Pb) et d'autres attributs

 

Remarque:

Project deleted based on decision taken at TC 91 meeting in Richardson, Texas, USA on 2013-10-11 Function concerned - Quality assurance. Project plan - CDV: 2013-06, FDIS: 2014-03 Relevant doc: IPC/JEDEC J-STD-609A. - Liaison: IPC, JEDEC