International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Techniques d'assemblage des composants électroniques

 

Détail

Comité
Groupes de Travail
Chef de Projet

Statut

Courant

Frcst Pub

Date

Date

Stabilité

TC 9101Walter HuckRDIS2015-062019

Historique

Stage
Document
Downloads
Date de Décision
Date Cible
PNW
91/965/NP pdf file 591 kB
2011-02-18 
ANW
91/977/RVN pdf file 491 kB
2011-06-172011-07-15
1CD
91/1030/CD pdf file 573 kB
2012-03-062012-01-31
CDM
91/1057/CC doc file 168 kB
pdf file 184 kB
91/1057A/CC doc file 204 kB
pdf file 177 kB
2012-09-07 
ACDV
91/1057/CC doc file 168 kB
pdf file 184 kB
91/1057A/CC doc file 204 kB
pdf file 177 kB
2012-11-062012-11-30
CCDV
91/1127/CDV
pdf file 305 kB
pdf file 261 kB
2013-10-092013-10-31
ADIS
91/1202/RVC doc file 183 kB
pdf file 209 kB
2014-08-222014-04-15
DEC
2014-11-202014-11-30
RDIS
2014-11-272014-12-15
CDIS
 2015-02-28
APUB
 2015-04-30
BPUB
 2015-05-15
PPUB
 2015-06-15

Projet

IEC 61760-4 Ed. 1.0

Technologie de montage en surface (SMT) - Partie 4: Classification, emballage, étiquetage et manipulation des appareils sensibles à l'humidité

 

Remarque:

SMB/5155/DL - CCDV: 2013-10-31, FDIS: 2014-05-31. Functions concerned - Quality assurance Project plan: CDV: 2012-06 FDIS: 2012-12 Relevant documents to be considered: IEC 60749-20, IEC 60749-20-1, ISO 62, J-STD020, J-STD033 Relationship of project to activities of other international bodies: TC47 WG2

 

Document Associés:

SMB/5155/DL