International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Techniques d'assemblage des composants électroniques

 

Détail

Comité
Groupes de Travail
Chef de Projet

Statut

Courant

Frcst Pub

Date

Date

Stabilité

TC 91WG 3Graham NaisbittAMW2016-01 

Historique

Stage
Document
Downloads
Date de Décision
Date Cible
AMW
91/1021/RR pdf file 77 kB
2011-11-22 
1CD
 2015-05-31

Projet

IEC 61189-5-5 Ed. 1.0

 

Remarque:

SMB/5436/DL - 1CD: 2015-05-31, FDIS: 2016-05-31. SMB/5347/DL - CCDV: 2015-11-30. Change of target date of 1CD to 2014-12 based on decision taken at TC 91 meeting in Richardson, Texas, USA on 2013-10-11. SMB/4976/DL - 1CD: 2013-07-31 Project title changed from "Test methods for electrical materials, interconnection structures and assemblies - Part 5-5: Test methods for printed board assemblies - Surface insulation resistance (SIR)" based on 91/1077/RM, item 6.3 Project plan - CDV: 2013-03, FDIS: 2014-03

 

Document Associés:

SMB/5436/DL

SMB/4976/DL

91/1077/RM