International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
TC 91 |
Techniques d'assemblage des composants électroniques |
Détail
Comité | Groupes de Travail | Chef de Projet | Statut Courant | Frcst Pub Date | Date Stabilité |
|---|---|---|---|---|---|
| TC 91 | 03 | G. Naisbitt | AMW | 2014-09 |
Historique
77 kBProjet
IEC 61189-5-5 Ed. 1.0
Remarque:
SMB/4976/DL - 1CD: 2013-07-31 Project title changed from "Test methods for electrical materials, interconnection structures and assemblies - Part 5-5: Test methods for printed board assemblies - Surface insulation resistance (SIR)" based on 91/1077/RM, item 6.3 Project plan - CDV: 2013-03, FDIS: 2014-03
Document Associés:
SMB/4976/DL
91/1077/RM