International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub
Date

Stability

Date

TC 9106Kunio TakaharaAPUB2015-032016

History

Stage
Document
Downloads
Decision Date
Target Date
PNW
91/997/NP pdf file 2458 kB
2011-08-31 
ANW
91/1032/RVN pdf file 25 kB
91/1032A/RVN pdf file 115 kB
2012-03-222012-08-15
1CD
91/1082/CD pdf file 1187 kB
2013-01-232013-01-31
ACDV
91/1117/CC doc file 130 kB
pdf file 101 kB
2013-07-192013-04-30
CDTS
91/1144/DTS pdf file 6508 kB
pdf file 5672 kB
2013-09-042013-10-31
APUB
91/1165/RVC pdf file 7 kB
91/1165A/RVC doc file 121 kB
pdf file 69 kB
2014-01-282014-03-15
DEC
 2014-10-31

Project

IEC/TS 62878-2-4 Ed. 1.0

Device embedded substrate - Part 2-4: Guidelines - Test element groups (TEG)

 

Remark:

Function concerned - Quality assurance. Previous project number was IEC/TS 62326-17 Ed.1 Project plan - CDV: 2013-09, FDIS: 2014-06 Relevant docs: Future 62326-16, 18 and 19 Liaison: IPC, JEITA, JIEP, JPCA

 

Associated Documents:

91/1115/INF