International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub
Date

Stability

Date

TC 9106Kunio TakaharaBPUB2015-032018

History

Stage
Document
Downloads
Decision Date
Target Date
PNW
91/996/NP pdf file 904 kB
2011-08-31 
ANW
91/1031/RVN pdf file 25 kB
91/1031A/RVN pdf file 25 kB
91/1031B/RVN pdf file 153 kB
2012-03-222012-01-15
1CD
91/1081/CD pdf file 1316 kB
2013-01-222013-01-31
ACDV
91/1116/CC doc file 136 kB
pdf file 71 kB
2013-07-192013-04-30
CDTS
91/1142/DTS pdf file 1426 kB
pdf file 1390 kB
2013-09-042013-10-31
APUB
91/1163/RVC pdf file 7 kB
91/1163A/RVC doc file 117 kB
pdf file 65 kB
2014-01-282014-03-15
DEC
2014-10-242014-10-31
BPUB
2014-11-032014-11-15
PPUB
 2015-03-15

Project

IEC/TS 62878-2-1 Ed. 1.0

Device embedded substrate - Part 2-1: Guidelines - General description of technology

 

Remark:

Previous project number was IEC/TS 62326-16 Ed.1. Project plan - CDV: 2013-09, FDIS: 2014-06 Relevant docs: Future 62326-17, 18 and 19 Liaison: IPC, JEITA, JIEP, JPCA

 

Associated Documents:

91/1115/INF