International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub
Date

Stability

Date

TC 9106Hyun Ho KimCDTR2015-092020

History

Stage
Document
Downloads
Decision Date
Target Date
PNW
91/919/NP pdf file 752 kB
2010-02-26 
ANW
91/937/RVN pdf file 72 kB
91/937A/RVN pdf file 247 kB
2010-08-062010-07-15
1CD
91/995/CD pdf file 277 kB
2011-08-252011-03-31
A2CD
91/1048/CC doc file 226 kB
pdf file 326 kB
2012-08-242012-01-06
2CD
91/1049/CD pdf file 2021 kB
2012-08-242012-09-30
A3CD
91/1134/CC pdf file 7 kB
91/1134A/CC doc file 155 kB
pdf file 97 kB
2013-08-272013-11-30
3CD
91/1138/CD pdf file 7 kB
91/1138A/CD pdf file 365 kB
2013-08-28 
ACDV
91/1183/CC doc file 100 kB
pdf file 54 kB
2014-04-112014-01-31
CDTR
91/1220/DTR pdf file 386 kB
2014-10-312014-12-31
APUB
 2015-03-31
DEC
 2015-04-30

Project

IEC/TR 62878-2-2 Ed. 1.0

Device embedded substrate - Part 2-2: Guidelines - Electrical testing

 

Remark:

SMB/5436/DL - CDTR: 2014-12-31, TR: 2015-11-30. SMB/5256/DL - CDTR: 2014-09-30. SMB/5155/DL - CDTR: 2014-09-30. Previous project number was IEC 62326-15 Ed.1. Function concerned - Quality assurance. SMB/4881/DL - 2CD: 2012-09-30, CCDV: 2013-04-30, FDIS: 2014-01-31 Project plan - CDV: 2012-03; FDIS: 2013-03 Liaison organizations: KPCA, IPC, JIEP, JEITA, JPCA Relevant documents to be considered: 91/893A/PAS, 91/894A/NP

 

Associated Documents:

SMB/4881/DL

SMB/5155/DL

SMB/5436/DL